EDA/IC Design: [EDA/IP/News & Trends][Page 13] News, Technical Archives, App Notes

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News & Trends (Sorted By Date)

Developing a green product development strategy (2008-08-01)
Ultrafast 3D circuit enables higher switching capacity (2008-07-31)
National hails Synopsys as its key EDA partner (2008-07-30)
Kontron releases updated UGM spec (2008-07-28)
LabView examines structural health of Olympic venues (2008-07-28)

What has driven Cadence to buyout Mentor? (2008-07-25)
PMC-Sierra licenses MIPS cores for comms, storage solutions (2008-07-24)
Project Galaxy allots $6.4M for GALS research (2008-07-24)
India board design services to hit $458M this year (2008-07-24)
Achieving precision performance from digital pots (2008-07-23)

HKSTP-IBM partnership sees extension (2008-07-23)
Chip industry preps for 'More than Moore' era (2008-07-21)
MTNet taps Aeroflex platform for CDMA, A-GPS test (2008-07-18)
Freescale, Arada co-develop 802.11n ref design (2008-07-17)
Qualcomm, IMEC team on 3D tech for wireless apps (2008-07-16)

Predicting real-world wireless performance (2008-07-16)
SpringSoft works on global ambition (2008-07-16)
Are chipmakers in the mood to buy equipment? (2008-07-15)
Standards for 3D memory chips set (2008-07-14)
Japanese design services firms sign up for PFI (2008-07-14)

Agilent expands particle analysis line with acquisition (2008-07-10)
Carbon Design acquires ARM SoC Designer (2008-07-09)
India seeks to boost efforts in IP firms (2008-07-09)
Alcatel-Lucent, INRIA open R&D lab for future networks (2008-07-08)
Embedded designers face tighter schedule challenges (2008-07-08)

Applied funding arm to build more Indian IC firms (2008-07-08)
New fall schedule, venues for IIC-China '09 (2008-07-08)
New alliance to fuel patent pooling (2008-07-07)
EDA market shows signs of weakness (2008-07-07)
Confab stresses potential thermal crisis in IC design (2008-07-03)

Mentor seeks advice on Cadence takeover bid (2008-07-02)
Synopsys gears up for 'techonomic' challenges (2008-07-01)
A perspective on professional organizations (2008-07-01)
LG opens new design center in Europe (2008-06-27)
IEEE confab sees Istanbul as 'Prime' location (2008-06-26)

Magma grows China operations, works with universities (2008-06-25)
Cadence CEO's EDA ambition (2008-06-24)
Taiwan develops low-power chips for mobile markets (2008-06-24)
Low power design for analog/mixed-signal IP (2008-06-24)
Cadence-Mentor merger a 'bad idea', analyst says (2008-06-20)

Radiocomp, Altera deliver OBSAI solution for WiMAX/LTE (2008-06-19)
$1.6B Cadence buyout offer not enough, Mentor says (2008-06-19)
SanDisk, Toshiba team up to produce 3D memory chips (2008-06-19)
Analogix files antitrust suit vs. Silicon Image (2008-06-18)
IPL Alliance's 'interoperable' ref flow puts pressure on Cadence (2008-06-18)

Allocating memory in Matlab-to-C code (2008-06-17)
ADI brings HDMI in digital homes (2008-06-17)
Analysis: Business gets tough for EDA vendors (2008-06-17)
Top considerations in selecting mobile antennas (2008-06-16)
TI acquires analog design specialist (2008-06-16)

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