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Embedded designers face tighter schedule challenges
(2008-07-08)
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EDA market shows signs of weakness
(2008-07-07)
-
New alliance to fuel patent pooling
(2008-07-07)
-
Confab stresses potential thermal crisis in IC design
(2008-07-03)
- Mentor seeks advice on Cadence takeover bid (2008-07-02)
- A perspective on professional organizations (2008-07-01)
- Synopsys gears up for 'techonomic' challenges (2008-07-01)
- LG opens new design center in Europe (2008-06-27)
- IEEE confab sees Istanbul as 'Prime' location (2008-06-26)
- Magma grows China operations, works with universities (2008-06-25)
- Low power design for analog/mixed-signal IP (2008-06-24)
-
Taiwan develops low-power chips for mobile markets
(2008-06-24)
-
Cadence CEO's EDA ambition
(2008-06-24)
-
Cadence-Mentor merger a 'bad idea', analyst says
(2008-06-20)
- SanDisk, Toshiba team up to produce 3D memory chips (2008-06-19)
-
$1.6B Cadence buyout offer not enough, Mentor says
(2008-06-19)
- Radiocomp, Altera deliver OBSAI solution for WiMAX/LTE (2008-06-19)
-
IPL Alliance's 'interoperable' ref flow puts pressure on Cadence
(2008-06-18)
- Analogix files antitrust suit vs. Silicon Image (2008-06-18)
-
Analysis: Business gets tough for EDA vendors
(2008-06-17)
- ADI brings HDMI in digital homes (2008-06-17)
- Allocating memory in Matlab-to-C code (2008-06-17)
- Implement an FPGA ASIC prototype (2008-06-16)
- Break the barriers to greater innovation (2008-06-16)
- TI acquires analog design specialist (2008-06-16)
- India preps Karnataka as next IC hub (2008-06-16)
- Top considerations in selecting mobile antennas (2008-06-16)
-
TSMC targets to unify 32nm design flow
(2008-06-12)
- Chartered acquires stake in Taiwan design firm (2008-06-12)
- Takumi teams up with quality design group (2008-06-12)
- Intel is again under FTC scrutiny (2008-06-11)
-
Processor core provider confesses chip design is a struggle
(2008-06-11)
- Intel, Rosnanotech collaborate on sub-45nm research (2008-06-11)
- NEC software development center rises in Taiwan (2008-06-11)
- HP, Acer conclude patent dispute (2008-06-11)
-
IBM splashes water on hot 3D chips
(2008-06-10)
-
ST considers 3D graphics core in next chipsets
(2008-06-09)
-
Exec highlights need for 'collaboration'
(2008-06-09)
- Firms partner on network attached storage solutions (2008-06-06)
- Scientists gauge quantum states for chip cooling, settling (2008-06-06)
- ARM, Renesas, Synopsys draft low-power verification methodology (2008-06-05)
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TSMC stirs IC designs using 40nm node
(2008-06-05)
- China handset suppliers prefer MediaTek mobile solutions (2008-06-05)
- HKSTP, Canada government ink deal on tech biz (2008-06-04)
- IPL Alliance gets TSMC onboard (2008-06-03)
- ST brings CMOS process program to Chinese universities (2008-06-03)
-
Shenzhen's startups deal with cost, competition
(2008-06-02)
- Use system models for better verification (2008-06-02)
- Don't kiss assembly language goodbye (2008-06-02)
- ANSI C vs. System C: Resolving the confusion (2008-06-02)
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