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16 November 2008

News & Analysis | Technical Features | Opinion | Interview
Vital Signs
News & Analysis
How to grow an electronics giant
How Samsung Electronics Co. Ltd made the transition from a CE dwarf to a global brand is a well-told story. Less well-known, however, is the story of how Samsung, based in Seoul, South Korea, achieved its current supremacy by battling Japan companies on their own turf—CE and memory chips.

Powerline unification misses the cut
A proposal to unify competing powerline networking technologies failed in a vote at a standards meeting in Madrid, Spain, in October, sending engineers back to the drawing board.

Fab tech roll call: survival of the fittest
Manufacturers are rolling out 45nm ICs, with 32nm designs in the works; 22nm and even smaller devices are in R&D. But delivery of chips at 32nm and beyond won't be a cool breeze.

PC demand slips worldwide
According to a market researcher, PC demand started falling in emerging markets including China and has been on the decline globally.

Consider power early in the design process
Power management is becoming a necessity everyday. Many reasons are provided justifying the designers' need to care about power and the list is getting longer.


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Green design improves normally-on switches
As green energy trends become more popular, design engineers should re-examine some of the circuits that continually consume power to reduce overall system power use.

Explore NAND flash implementation options
Several factors are contributing to the challenges of designing NAND flash memory subsystems. Presented in this article are different NAND flash implementations.

Antifuse memory IP offers lower-power operation
Memory IP for power-sensitive apps requires the design of both the basic memory bit and the memory macro architecture to minimize power demands.

MIDs promise dignity
Jeff Bier admits being a 'Laptop Power Nomad.' And he believes that Mobile Internet Devices (MIDs), which have longer battery lives, will offer what laptops don't—convenience and dignity.

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Technical Features
Know the nuts and bolts of HDCP
This article provides a technical interpretation of the HDCP specification and then explores the reasoning behind some of the problems.  (PDF file)

Simplify digital audio decoding
As the market for digital audio explodes, a number of chips and chipsets have been introduced to meet the demands of ever better players. Here's how you can simplify digital audio decoding.  (PDF file)

Deploy cost-effective, high-quality video over IPTV
The rapid growth of the IPTV market presents network designers with challenges that must be addressed to allow cost-effective, high-quality video deployments.  (PDF file)


Opinion
Innovating out of a crisis
Engineers across Asia will face pressures like never before to cut costs and reduce power consumption. In other words, they have to innovate their way out of demanding times.

Welcome the wireless chief
How businesses learn to communicate within their organization is about to be dramatically reshaped, as machines are learning to talk.


Vital Signs
Embedded developers make OS choices
Here's the second installment of a two-part report of Embedded Systems Design magazine's 2008 Embedded Market Study results.

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Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

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Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

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