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01 October 2008
News & Analysis
Hewlett-Packard Labs is attempting to catapult the memristor, the fourth passive circuit element after resistors, capacitors and inductors, into the electronics mainstream.

It is not the gleaming edifices housing thousands of software engineers nor the bustling cities caught up in perennial traffic jams, but the bleak, endless landscapes of 600,000 villages in India that is becoming the next frontier for mobile handset makers to conquer.

Driven by strong market demand for portable products, the consumer electronics sector swerves to the Internet-capability route, as touted by Mobile Internet Devices.

Take a different approach to chill. A group of researchers just did, resulting in what may be the most efficient heat dissipation possible for stacked microprocessors.

Chip designers must consider package routability, power delivery and I/O behavior during the initial I/O planning process. To do so, they should combine package-aware I/O planning with automated floor-plan synthesis, which can be very cost-effective for the chip floor plan and the package layout.




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When creating a new IC, device packaging is often overlooked until the end of process. However, choosing the right package can reduce time-to-market and create tangible benefits for customers. Here is a look at some of the available options and what they have to offer.

State-of-the-art routing technology is now required to handle complex design rules and to trade-off yield and other design goals efficiently at advanced process nodes. It must be variation-aware and fully integrated with placement, clock tree, and multi-corner multi-mode optimization in order to achieve higher QoR.

Much vital project knowledge exists only in engineers' heads. Jack Ganssle advises engineers to capture the knowledge by means of brain books.

Demand for serial flash memory continues to soar as designers of DTVs, DVDs, PCs, modems, printers and mobile CE devices view memory as an increasingly attractive code execution alternative to parallel NOR flash. To meet the demand, serial flash suppliers Atmel, Macronix, Numonyx, Silicon Storage Technology, Spansion and Winbond are offering higher-density devices.

Bluetooth has become ubiquitous and hasn't remained stagnant as designers strive for better performance, lower power consumption, increased range, and decreased size and costs.

As price pressure from consumers persists, chip companies are taking a cue from OEMs to provide devices that pack more video functions to minimize costs.

With mobile phone users struggling to hear and be heard in noisy environments, designers are working hard to integrate more advanced audio processing into portable audio devices.


Technical Features
Design analysis of CMOS low dropout regulator (LDO) focusing on low quiescent current and load transient improvement methodologies and structures are discussed in this article. A novel structure using operational transconductance amplifiers is discussed.  (PDF file)

Reference designs supporting various digital standards help shorten time-to-market. Here's how they are also able to ensure TV standards compliance.  (PDF file)

Memory, time and hardware constraints limit how the C implementation allocates memory. Here are some workarounds.  (PDF file)

While the infrastructure for plugging portable devices into the USB for datacom-with-power applications is fairly universal today, using the USB as a power source for direct powering or charging a battery isn't necessarily foolproof. You'll generally need over-voltage protection (OVP) circuitry; here's what to consider in designing your discrete or IC-based circuit.  (PDF file)

Certified wireless USB is an extension of the USB standard that uses the WiMedia common radio platform to communicate over the UWB wireless medium. It poses challenges which are not encountered in wired USB. This article focuses on avoiding deadlocks caused by packet loss.  (PDF file)


Opinion
It's worth noting how the green engineering revolution has come and how it'll further grow in the future.

The creative computer may not become a reality anytime soon. But the principles of creative behavior and learning are already being applied in clever ways.


Vital Signs
A big shakeup in the top 20 semiconductor supplier ranking for 1H 08 has been reported by research firm IC Insights Inc.

Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

Peek at Hot Gadgets for 2012
Smart energy "Try explaining to your eight-year-old son that instead of an Xbox, you got him a Wi-Fi enabled smart energy thermostat to help minimize his energy consumption and carbon footprint..."
 

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