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16 September 2008
News & Analysis
Engineers must take a holistic rather than a piecemeal approach when integrating MEMS into larger electronic systems.

According to a report by CleanEdge Inc., total revenue of the biofuel, wind, solar photovoltaic (PV) and fuel cell markets is expected to top $250 billion within the decade, up from $77 billion last year.

Digital map data pioneer Navteq has been hitting the road to collect about 260 road attributes and to catalog gathered data for public domain use.

This article introduces the JESD204 standard for data converters, which makes it possible for high-speed, high-resolution ADCs to transmit high-speed data across a single pair of transmission lines.

Bill Schweber mulls engineering accomplishments and recognizes the impressive accomplishments that other engineers have achieved.




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SoC design options for software-friendly multiprocessing have been limited. Now, SoC design components, such as the MIPS32 1004K coherent processing system, mean on-chip symmetric multiprocessing (SMP) under a single OS is a real option.

This article discusses the various features that make writing a combination of C and assembly code easier for the DSP engineer to handle the task.

Jason Cohen of Smart Bear gives tips on improving code review by devising shorter checklists.


Technical Features
As the industry evolves from 802.11g to 802.11n, design home networks should take advantage of the faster and more reliable wireless connection.  (PDF file)

Connectors in today's medical applications must function at higher speeds, provide higher density, require smaller footprints and lower profiles, and comply with ever-stricter industry standards.  (PDF file)

With faster and lower power serial ADCs, medical devices will continue to improve in accuracy, speed and ease-of-use. Choose from the different ADCs suitable for your medical application.  (PDF file)

Often, there is a need to simulate RFIC designs with substrate parasitics to accurately represent high-frequency effects in actual silicon. Generally, parasitics appear from a chip's surface layers, especially from metallization routing and coupling, or from the RC parasitics of the silicon substrate.  (PDF file)


Opinion
The car is becoming the new center of attention, as automotive electronics presents the industry with a set of opportunities and challenges typical of upcoming growth.

Using a multimedia networking backbone for car infotainment systems is important. The network should combine the tough requirements of the automotive world.


Interview
Shinichi Yamamoto, senior manager for the new CE CTS, C&C business group at Hitachi GST elaborates on the company's commitment to the environment and narrates how it has lived up to this vision through the development of new technologies.

Vital Signs
Databeans Inc. projects an annual growth rate of 14 percent per year over the next five years for devices used in medical electronics, surpassing both the CE and computer markets.

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