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16 December 2007
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News & Analysis
A new technique called "chip-on-MEMS" bonds ASIC dice atop an entire MEMS wafer before dicing, according to developer VTI Technologies.
Christos Lagomichos, NXP's home electronics division unit general manager, has drawn up a road map for the work that will be done in India.
Apollo, a three-year strategic research program, is producing results in its quest to provide the technology for efficient migration to 4G comms and multiprocessing in the sub-45nm era.
An IMEC laboratory at the University of Ghent in Belgium has realized interconnections for elastic electronic wires that can be stretched to twice their original length while maintaining electrical conductivity.
Standards will continue to be important. The role of standards in IPTV is assured in the long term—especially as the offerings are becoming more and more complex.
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Developers need to become familiar with various key technologies that make implementing GPS in CE devices possible, most specifically, the Galileo satellite network being developed and implemented under the EU.
The integration of a GPS receiver into a handset can create a simultaneous-GPS application where the GPS receiver is used together with other wireless communication systems from various frequency bands.
The latest high-voltage IC technologies are helping engineers address these demands by streamlining the design of the inverter-based variable speed motor drive solutions that are increasingly used in these applications.
Ugo Carena of STmicroelectronics notes that the automotive industry has been the single greatest engine of economic growth in the world.
Broadcom Corp. is sampling a single-chip HSPA processor that's said to integrate all key 3G cellular and mobile technologies on a low-power, 65nm CMOS die.
Last year's adoption of the HDMI version 1.3 release, with key performance improvements, has advanced the adoption rate of sources that provide 1,080p resolution such as Blu-ray and HD DVD.
Delta Electronics Inc. has developed an energy-saving LED backlight module (BLM), which allows LEDs to achieve maximum homogeneous illumination.
Co-inventor of the quantum-cascade laser, Harvard professor Federico Capasso, has devised an optical antenna that enables QC lasers to perform submicron scans by focusing the laser's spot with nanoscale accuracy.
Technical Features
Hybrid drives deliver a cost-effective combination of high capacity and performance, extended battery life, and unprecedented durability. (PDF file)
Digital Audio Broadcasting based on the Eureka-147 has achieved significant penetration in markets worldwide. In this article, Alex Sin of Frontier Silicon discusses that there are many clear benefits to the DAB+ standard that will be felt by governments, regulators, broadcasters and, most importantly, consumers. (PDF file)
This article from Altera offers a systematic SSN overview with the focus on SSN caused by FPGA output buffers. A description of the causes of system-level SSO is presented and a hierarchical system-level SSO modeling methodology is proposed. (PDF file)
PCIe switches and PCI-to-PCIe bridges can help get beyond many of the workstation I/O limitations. Steve Moore of PLX Technology invites us to explore how these devices can be used to optimize I/O expansion in high-performance workstations. (PDF file)
There are many factors to consider during PCB evaluation. Sylvia Teo of Mentor Graphics discusses how to address the challenges in PCB design and what factors must be considered when evaluating a PCB design tool. (PDF file)
Hemant Shah of Cadence Design Systems discusses need for algorithmic models, the interoperability problem, the need for IBIS BIRD 104 and the benefits systems companies and Serdes IP companies will derive from this new approach. (PDF file)
Sun Microsystems shares the experience of using latest generation hardware-based verification systems to develop its recently launched Ultrasparc T2 processor. (PDF file)
Opinion
In general, consumer audio/video—particularly DTVs, cellphones and automotive electronics including infotainment?are segments performing well and showing signs of potentially robust growth.
Design teams can greatly increase the efficiency of the embedded design process if the process flows smoothly from design to deployment along a smooth curve.
Interview
Willem Roelandts, Xilinx chairman, CEO and president, talks about their commitment to Asia and the future of FPGA industry.
Vital Signs
Life is relatively good for engineers—at least according to their responses to the EE Times Annual Salary and Opinion Survey.
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