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01 December 2007

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News & Analysis
Is it a fab-lite diet for analogs, too?
As digital IDMs increasingly turn to foundries for their production needs, an inevitable question arises: Will the big analog IDMs follow the same path and move toward fab-lite or even fabless strategies?

Collaboration is key, say IP experts
In place of today's patent thickets, full of fears of unknown licensing and litigation costs, experts envision more open pools for collaboration, linked into new tools emerging on the Net.

Spend on product innovation, not on fabs
Top-tier analog IDMs thrive largely because they prefer to win design-ins by being old-fashioned and there are good reasons for analog vendors to keep much of their capacity in-house.

Model-based approach for safer batteries
This article reviews the current design process and provides examples of how a model-based approach leads to better performing and safer batteries.

Here come supercapacitors
Supercapacitors bridge the power gap between batteries and conventional capacitors, delivering higher power bursts than batteries and storing more energy than capacitors.


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Enabling energy-efficient PCs, handhelds
Peak power performance now requires a holistic design approach to keep energy consumption in check. There are a host of new mechanisms and technologies aimed at simultaneously improving performance and efficiency, not just in discrete components, but for devices as a whole.

Old-fashioned models work for analog IDMs
Top-tier analog IDMs thrive largely because they prefer to win design-ins by being old-fashioned and there are good reasons for analog vendors to keep much of their capacity in-house.

Achieve processor energy savings with AVS
Processing large amounts of data at fast speeds rapidly drains the power of a mobile device battery. Maximizing energy savings can be achieved with an AVS technique to reduce energy consumption in digital processors by up to 70 percent.

What to do with trade-offs
Bill Schweber suggests that engineers be more up-front about what they've done with their designs—and had to do—to get to the final product, and the inherent trade-offs of the design process.

Deploy your apps to market quickly
Telecom infrastructure development is moving into a third phase of infrastructure development. To ensure that the time-to-market advantage is preserved, here are some strategies.

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Technical Features
Solve quality, reliability challenges of VoWLAN
This article examines existing VoWLAN technology's performance and reliability challenges and proposes an innovative WLAN Edge Architecture to overcome them. (PDF file)

Reimagine current sensors in switch mode power apps
Basic technology is applied in a novel way to create an AC current sensor that outperforms traditional sensing methods. (PDF file)

Determine key profiles for video playback
Designers of next-generation home and portable devices with video support must understand what is important to consumers as they work on their next SoC design architectures. (PDF file)

Tap tested technology for DVRs
Developing a solution for storing digital video is a complex, time consuming, and costly task. A practical alternative is to implement a board-level DVR solution that is a proven technology, and can be customized to accommodate practically any application. (PDF file)

Discover new SRAM options in embedded designs
There is an alternative for applications that require large amounts of on-chip storage "typically more than 256Kbits" but doesn't require the absolute fastest access time. The solution consists of memory arrays that work like SRAMs, but are based on a one-transistor/one-capacitor (1T) memory cell such as used in DRAMs. (PDF file)

Taking RF measurements in crowded spectrum
This article highlights the key elements to consider when selecting instruments for RF network testing to conduct measurement in today's crowded RF spectrum. (PDF file)

Building PCIe endpoint devices with FPGAs
This article will review the factors for building single-chip x4- and x8-lane PCIe designs with the latest FPGA technology. (PDF file)

Testing beyond the required specs
An increasing number of new and proposed EMC standards are pushing the upper frequency test limits further up the microwave spectrum. The latest EMC standard released, IEC 61000-4-3:2006, is no exception. (PDF file)

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Opinion
2007 highlights carry mixed signals
The year 2007 has been a mixed bag for the semiconductor industry, with the usual ups and downs in the commodity memory chip markets. The crystal ball for 2008 seems to paint a more colorful picture.

Recipe for an embedded success story
Writing embedded software code is not rocket science; it is doable by a wide range of people with a broad set of skills.


Vital Signs
All set for shift to mobile broadband
The business of mobile network operators is undergoing rapid change as the Internet goes mobile, alongside continuing developments in voice services.

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Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

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