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01 June 2007

News & Analysis | Technical Features | Opinion | Interview
News & Analysis
HDTV interface spec sparks product rollouts
Chipmakers are rushing out competitive solutions for the emerging third-generation Serial Digital Interface standard.

IC designers favor less complex DFM
During the IEEE Electronic Design Process workshop, IC design experts point out that current approaches to design-for-manufacturing (DFM) may be yielding too little for the amount of effort and cost involved.

IBM gets on the road to 3D packaging
News that IBM Corp. this year will sample its first commercial devices to make direct metal connections between chips marks a small but significant milestone on the road to 3D packaging.

Is India the next China?
While some believe that India will be a magnet for IC giants, other industry watchers think otherwise, pointing to the country's infrastructure shortcomings and late start in the chip-manufacturing sweeps.

MEMS chips integrate more intelligence
Freescale's ESC MEMS chip will capitalize on two trends—integration of multiple sensing elements into one package and integration of more intelligence—to embed decision-making functions at the point of sensing.

Hearing aids get makeover with wireless
The humble hearing aid is going stereo, mutating from a tech dinosaur into a gizmo with the status of a Bluetooth ear clip.


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Analog front-end targets mobile ultrasound
Analog Devices Inc. rolled out an integrated analog front-end in an effort to gain an edge in mobile ultrasound systems.

Board offers direct LCD panel operation
Renesas Technology Corp. is teaming up with an embedded-software company to enable displays in cost-sensitive applications—ones that don't require a separate LCD controller chip.

Lower-voltage DDR2 DRAMs target data center apps
Micron Technology Inc. recently launched low-voltage DDR2 DRAMs that aim to lower server power consumption.

All-in-OneMemory packs NOR, NAND, RAM
Silicon Storage's All-in-OneMemory offers multigigabytes of execute-in-place code storage to meet the growing needs of embedded apps such as multimedia handsets, PMPs and digital still/video cameras.

BIOS solutions go for system-specific apps
General Software has streamlined the StrongFrame core of its BIOS and crafted a version based on that code for embedded systems such as kiosks, point-of-sale terminals and avionics gear.

XA offers better simulation accuracy
Synopsys' Discovery AMS 2007 features the XA simulation technology, which promises greater performance and accuracy for Fast Spice simulation.

Library Compiler supports CCS models
Synopsys has updated Library Compiler with enhancements such as quality assurance and model adaptation capabilities aimed at CCL.

Sound advice on Class D audio amps designs
When building high-performance Class D audio amplifiers, designers must consider such factors as output transistor size, output stage protection, modulation technique, filter topology, EMI reduction and system cost.

DirectDrive delivers better audio quality
This new architecture eliminates the DC-blocking capacitor required on the output of traditional headphone amplifiers. Furthermore, it offers click and pop suppression, low-voltage operation and better bass performance.

Performing SE design with digital audio amps
This article discusses the basics of single-ended design and the engineering trade-offs involved.

Cut your design time with multiproject wafer services
By understanding the nature of multiproject wafer services and adapting your design methodology to take advantage of them, you can save weeks or months of development time in getting a chip to market.

Design with serial EEPROM devices
Serial EEPROM devices are easy to use, and they integrate into a variety of applications—from automotive to medical and consumer goods.



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Technical Features
Address challenges in DVB-H receiver design
With careful system and application design, DVB-H can enable the integration of power-, area- and cost-efficient terminals for the smooth delivery of mobile TV. (PDF file)

Integrate tactile feedback into touchscreen HMI
Though still in the infancy stage, touchscreens with tactile feedback are already showing much promise for improving the HMI and ensuring a more intuitive, engaging and satisfying user experience. (PDF file)

Media processing architecture scales from MP3 to HD video
Since many A/V coding standards exist, interoperability requires that the underlying media architecture be programmable, thus allowing device manufacturers to differentiate their products and use SoCs in different ways. (PDF file)

Transmit power safely with PoE tech
Power-over-Ethernet allows safe and reliable power transmission—15W with 48V—for telecom applications over existing Cat5, Cat5e and Cat6 cables. (PDF file)

Fast-diode MOSFETs incurrent commutation
A MOSFET with a fast-recover diode can improve the body diode performance in a three-phase inverter topology providing six-step current commutation. (PDF file)

Guard intellectual property, your ultimate asset
Software and system vendors must implement strong software- and IP-protection solutions to prevent theft and violation. These solutions must also surpass legal protection requirements and offer technology that can ensure enforcement. (PDF file)

Use Eclipse for embedded cross-development
This article describes how to construct a free or low-cost cross-development environment based on the open-source Eclipse IDE and GNU toolsets. The task can be difficult and time-consuming. This article also presents the preconfigured Eclipse projects and pre-built GNU tools offered by Macraigor Systems to help speed construction. (PDF file)

Optimize wireless networks for end-users
Requiring no drive tests or cell-site visits, this comprehensive solution for the optimization of a radio network combines internal software tools with customer-specific interfaces. (PDF file)

Testing signals for UWB aerospace systems
As signal bandwidth exceeds 200MHz, finding effective test equipment for advanced RF systems becomes increasingly difficult. These technologies address the different testing requirements for wideband aerospace and defense systems. (PDF file)

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Opinion
Video-wireless union is shaping security domain
The marriage of wireless and A/V devices is changing the form of surveillance and remote monitoring.

Let software catch up with silicon
By simplifying the way we do things, we allow the software to catch up with advances in silicon, making teraflops on the desktop a feasible and useful technical accomplishment.


Interview
Micron CEO: Of memories and foundry models
Micron Technology Inc. has grabbed its share of headlines. What will Micron do next? To get a handle on the company, EE Times caught up with Steve Appleton, its president, CEO and chairman, who talked about the IC industry, foundry/fab-lite models, private-equity buyouts, its diversification strategy and universal memory.
Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

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