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16 April 2007
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News & Analysis
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternative—a version of 193nm immersion—is proving expensive.
A growing chorus of companies and public-interest groups is calling for cellular carriers to open their networks to any device or Web application. Carrier restrictions are choking innovation and consumer choice, stalling the next big round in wireless growth, they say.
With the expansion of large IP-networking carrier projects like Verizon's FiOS and BT Group's 21CN, it would seem all carriers want to show they are on a fiber-rich diet. But equipment that took center stage at the Comptel show in March indicated a focus on Ethernet services over copper.
India has unveiled its much-awaited Special Incentive Package Scheme, hoping to attract investments in IC plants and other technology-manufacturing industries.
The test-and-measurement community must help ensure a smooth migration to LTE so that pitfalls associated with past rollouts of next-gen cellular networks can be avoided.
Over 700 embedded system designers in Asia, including those in mainland China, Taiwan, South Korea, Singapore and India, participated in an annual survey that aims to gauge each year their development experience with hardware, development tools and RTOS.
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China continues to lure manufacturers from all over, aggressively honing its design expertise to gain a bigger slice of the revenue pie.
Stream Processors Inc. emerges from stealth mode to introduce two parts that embody what the company calls a fundamentally new architecture and the first commercial application of stream processing for DSPs.
Targeting the nascent market for GPS services on cellphones, SiRF Technology rolls out its latest GPS chip—its smallest, lowest-power and most sensitive device to date.
Startup Boston-Power Inc. has fielded a Li-ion battery for notebook computers that promises a faster charge time and a threefold longer life span than existing batteries.
Micron Technology Inc. introduced a new line of CMOS image sensors for camera-based cellphones, as well as what it claims is the industry's 'first' 1Gbit mobile DRAM for multifeatured handsets to be based on a 78nm technology.
Startup OneSpin Solutions GmbH has introduced a solution that makes FPGA equivalence checking practical by supporting those optimizations.
Claiming to set a new direction for silicon intellectual-property (IP) design and reuse, Bluespec Inc. has rolled out the AzureIP Foundation Library, a set of parameterized IP blocks for use with the company's Bluespec Compiler.
The one constant in cellphone design is change. This article discusses the latest handset design trends and their implications.
Optimizing power consumption is an important design goal for DSP-based systems, but it is a goal that is often difficult to achieve. To optimize power consumption, a designer needs to understand the power profile of the system and reference an information resource that considers all the major system functions in deriving a power estimate.
Image quality in FPDs is highly subjective, and image-enhancement algorithm specifications continue to evolve. As a result, low-cost, logic-optimized FPGAs and reference designs enable designers to modify image-enhancement algorithms quickly and easily.
Manufacturers must turn to new methodologies that promote flexibility, rapid innovation and low initial development costs. This means using PLDs, such as FPGAs, with ASICs and ASSPs to provide the agility and differentiation needed to be competitive in the CE market.
Technical Features
Zigbee is on its way to becoming a strong player in the embedded device market. Modules and networking stacks that are Zigbee-certified are beginning to emerge, offering powerful mesh solutions and effectively addressing many, if not all, of the current Zigbee limitations. (PDF file)
This article discusses the development of the rail-to-rail amplifier's input stage and the input-enhancement circuit that overcomes the amplifier's deficiencies. (PDF file)
There are many good reasons to switch to a 42V automotive electrical system. Its practical implementation, however, has been limited due to several economic and technical challenges. (PDF file)
For HMI/MEI applications to become broadly adopted, fourth-generation CMOS imagers must be designed with a system-level approach, taking on aspects of the system that are well-suited to execute. (PDF file)
An environment that spans both enterprise and embedded systems, and the combination of their tools and development, will soon be a reality. (PDF file)
A lower-power FPGA design offers advantages other than adherence to the device's thermal operating requirements. (PDF file)
By carefully reviewing test requirements and applying the TMU solution, an expensive tester upgrade may prove unnecessary. (PDF file)
The HES system provides solutions for different verification stages, including hardware-acceleration simulation, SoC HW/SW acceleration co-verification and hardware prototype verification. (PDF file)
Opinion
The Indian electronics industry is now perched on the point of all growth. It is up to those in the business of technology to take it over the tipping point.
For designers of complex chips, the controlled, more predictable timing convergence of physical synthesis is of higher value.
Interview
This article features ST's MEMS Product Division General Manager Benedetto Vigna, who views MEMS as the new 'mouse.' ST first ventured into developing MEMS in 2001. Last year, the company inaugurated a 200mm semiconductor wafer fabrication line dedicated to MEMS devices.
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