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01 February 2007

News & Analysis | Technical Features | Opinion | Interview
News & Analysis
Next-gen memory market up for grabs
The frantic search for a next-generation memory technology took center stage at the IEEE International Electron Devices Meeting in December, amid growing concerns that DRAM and flash parts will no longer scale in the near future.

Staccato, SK Telecom push for UWB in PANs
Staccato and SK Telecom, are staking out new territory in the development of PANs using UWB technology, teaming up to implement a mobile-phone UWB solution that can be used simultaneously for Bluetooth, higher-bandwidth UWB and multipoint WiNet services.

High-speed interconnects reshape board
A handful of high-speed interconnects are driving changes in how designers handle fast signals. The Scalable System Packet Interface from the Optical Internetworking Forum aims to carry data at 6Gbps and up between chips or boards in a communications system.

Rotary engine spins comeback
Reg Technologies has fine-tuned the Wankel rotary engine design and will soon launch its Radmax direct-change engine to be a broader market.

H.264 codec targets Japan, South Korea markets
Several IC firms are testing the waters for H.264 High Profile codecs in hopes of claiming design turf in high-definition DSCs, digital video camcorders and storage devices.

Mobile TV outlook remains dim
The immediate outlook remains dim for solving the tangled web of problems tripping up broadcast mobile TV.


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Accellera to define verification coverage metrics
Responding to user calls for a consistent way to measure functional-verification completeness, the Accellera standards organization has launched the Unified Coverage Interoperability to define standards that enable the sharing and analysis of coverage data by different tools during the verification process.

Startup weaves new foundation for chip design
Fabbrix claims it can provide the regular circuit patterns or 'fabrics' needed by manufacturable designs at 65nm and below—without area, performance or power penalties.

Logic chipmakers seek 32nm breakthroug
Even as they put the finishing touches on their 45nm process technologies and tweak them for low power, leading-edge logic chipmakers are scrambling to find manufacturing breakthroughs for the 32nm node and beyond.

Samsung bets on WiMAX as future tech
Samsung made its case for mobile WiMAX as the future of wireless at its second annual Mobile Summit in New York City last December.

Philippine EMS company aims for global foothold
Hoping to join the ranks of the top 20 global EMS providers and post $1 billion in revenue by 2011, Philippine-based Integrated Microelectronics Inc. will focus on integration and push forth bold ventures in emerging applications this year.

Build bridge between Web and TV, says Hollywood
The Internet is becoming an important source of video, but neither Hollywood studios nor systems makers know how to bring video from the Web to the TV screen, said a senior Hollywood executive.

802.11n chip touts extended range
Ralink Technology Corp. is jumping into the 802.11n game with a Draft 2.0-compliant chipset it claims handily beats early movers in the market at extended ranges.

Agere pioneers mobile content server
Looking to enable cellular handsets to function as personal media players, Agere Systems Inc. plans to introduce what it bills as a new product category: the mobile content server.

Robotics Studio expected to spawn various apps
Microsoft Corp. rolled out a commercial version of its Robotics Studio application development environment, hoping it will be a catalyst for activity in robotics.

Video processors roll for mobile handsets, PMPs
Tensilica's Diamond Standard VDO processors handle multistandard, multiresolution video in SoC designs and can be programmed to support popular video codecs.

AMD joins 65nm race, readies for 45nm
AMD has rolled out its first 65nm X86 CPUs, which cut die size in half and power by a third compared with its 90nm desktop processors, and plans to ship its first 45nm devices by mid-2008.

TV-on-a-chip simplifies entire DTV design
Broadcom's 'television-on-a-chip' is the first digital HDTV silicon solution to support full 1,080p display resolution, and should save customers cost in the entire digital TV design.

Electronics gears for health care innovation
While it may seem that electronics and medicine have little in common, both are driven by the need for small physical size, low power and advanced connectivity.

Overcome challenges in implant design
This article gives pointers on how to address the unique power, signal-processing and communication challenges posed by implanted devices.

Circuit designer takes control over LOD parameters
Predicting LOD effects entails communication between circuit and layout designers. PDK can help circuit designers successfully match post-layout simulation in the schematic simulation.

Raise your venture capital
Here are tips to help you raise venture capital—ways that can better your odds and avoid undermining your chances.

View from assertion-level logic
Assertion-level logic does not affect the final implementation, but simply offers an alternative way of viewing things.

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Technical Features
Single-chip CMOS enables low-cost handsets
To get the unconnected connected, handsets must become very affordable. Infineon's E-GOLDradio GSM/GPRS single-chip solution is one step toward cost-effective CMOS integration. (PDF file)

FMC facilitates wireless carrier link
VEnterprise-wide Wi-Fi adoption has given birth to a technology that bridges wireless carrier connectivity with on-campus WLAN connectivity—fixed/mobile convergence. (PDF file)

Boost AMC performance with multicore design
Silicon vendors are increasingly turning to designs that use multiple processing cores on a single die to meet increasing performance requirements. (PDF file)

Class AB amps retain place in audio design
When it comes to low cost, distortion and noise, class AB amplifiers still have the edge. (PDF file)

Implement MCU-based software UART
Find out why it's best to implement a UART in software using MCU port pins, and how much bandwidth will be taken away from the main application by doing so. (PDF file)

Advanced package-stacking fits more functions
Multiple-die packaging increases component density, decrease circuit board complexity, improve reliability and reduce risk in getting the product to market. (PDF file)

Address SI issues in high-speed board design
This article discusses some of the SI challenges and the factors associated with high-speed interface designs that are enabled with key features of a RapidIO switch. (PDF file)

Test passive RFID tags with RTSA
Testing challenges confronting the designer of an RFID communication system include regulatory testing, standards conformance, and optimization with a focus on passive RFID tags. (PDF file)

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Opinion
Another break for power electronics
New battery-management challenges could further fuel demand for power ICs, signaling a banner year for power electronics.

Consider the platform approach for RoHS
When cash flow is examined thoroughly and cost of maintaining the design over the full product life cycle is considered, starting a fast-turn RoHS design with a platform—not a bag of parts—is well-advised.


Interview
Retired industry pioneer muses on IC trends
Epitaxy innovator and SIA founder Wilf Corrigan shares with EE Times his take on the developments in semiconductor business.
Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

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