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01 January 2007

News & Analysis | Technical Features | Opinion | Interview
News & Analysis
Asia sets eye on more design activities
With the slew of investments and expansion projects undertaken in India, Singapore, Malaysia and even Vietnam last year, global companies have reaffirmed their confidence in the huge potential of these nations.

U.S. engineers battle globalization impact
As the U.S. engineering community works to document the extent of offshoring, experts are trying to get their arms around globalization's implications for the engineering profession.

New CE apps clearing way for MEMS
Emerging consumer apps combined with strides in manufacturing, testing and packaging could transform MEMS from last year's trendy tech into a viable market.

Handhelds, autos focus on consumer experience
As new portable devices emerge, the attention shifts to wireless connectivity, storage, audio and portable-related technologies as well as power consumption and interference hurdles.

China gears up for more innovative design
Although there is still a lot of work to be done in mainland China's R&D sector, there has been remarkable progress especially in the communication and consumer electronics front.

Korea's electronics sector awaits solid year
Industry experts paint a rosy picture for the industry, particularly for large displays, OLED, NAND flash, DRAM, RFID and CMOS image sensors and multimedia chip for handsets


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Taiwan eyes better displays, comms
The 3C convergence will continue in 2007, with LCD TVs, LCD panels cellphones and WiMAX driving Taiwan's burgeoning electronics industry.

End of Moore's Law prompts technology search
With the end of Moore's Law looming as a possibility, the search for something to replace today's workhorse CMOS-based silicon is intensifying

Peripherals concept rolls for media handsets
Cypress Semiconductor will unveil a dedicated peripherals controller that can download files from a handset to a PC faster than solutions from competing companies.

China's homegrown spec hits true 3G speed
China's mobile-phone technology has finally broken into the realm of honest-to-goodness 3G, with handset data rates reaching 384Kbps in real-world conditions.

Firm shares tips on running China facilities
Connector maker Bel Fuse Inc. reveals some of the lessons it has learned from its experience in mainland China.

Nintendo woos casual gamers with intuitive Wii
Teardown analyses of Sony Corp.'s Playstation 3 and Nintendo Co.'s Wii lay bare the divergent battle plans for the latest phase of the videogame console wars.

Japan firm grows blue LED on wafer
Shimei Semiconductor's blue LED on a silicon wafer promises to slash the cost of device and ease its integration into CMOS circuits.

Slow MP3 sales weaken NAND prices
Although global sales of NAND flash in Q3 2006 hit $3.1 billion, the market continued to slump as NAND prices fell by 22 percent in the same period.

Major China telecom picks AVS for IPTV rollout
Backers of China's domestic codec scored a minor, but cherished, victory when the country's second-largest wired-telecom company picked it over H.264 for an IPTV rollout.

'Digital living room' to take many forms
Contrary to the prevailing wisdom, the PC will not necessarily be the centerpiece of the so-called "digital living room," according to an Advanced Micro Devices Inc. executive.

Multimedia ICs target China's PMP market
In a bid to woo PMP manufacturers in China, Vimicro Corp. has launched a line of multimedia chips complete with reference designs and software.

Coldfire core now open for OEM licensing
Freescale will sell its ColdFire technology under its own brand and will license it to OEMs in the hope of expanding access to its MCU alternative.

Chip foils Blu-ray-DVD war
The battle between competing next-gen DVD standards may soon be over as electronics companies promise to unroll universal players within the year.

China design firms favor soft IP
Gaining proficiency at handling the more design-intensive soft IP, China companies that buy IP blocks are now favoring soft over hard cores.

Architecture supports Ethernet, Infiniband
California-based Mellanox Technologies Ltd announced in November its ConnectX architecture, which packs support for Ethernet and Infiniband into one chip.

Samsung piles chips for thin MCPs
Samsung Electronics' advanced packaging technology piles 16 chips on top of each at an unbelievable height of only 1.4mm.

Transmitter ICs enable PC's shift to HDMI
Silicon Image rolled out a pair of VastLane HDMI transmitters that provide PC manufacturers with a single-chip solution for driving digital output to PC monitors and HDTVs.

Ethernet chips for PDH
Galazar Networks' two new chips—the CopperNode chip fro CPE and the CopperNodeHE for equipment in the carrier network—bring Ethernet services to DS1 and E1 digital circuits.

IDT rolls 10Gbps RapidIO serial buffer
A new 12Mbit serial buffer from IDT is designed as a RadioIO-specific memory for use in 10Gbps networks for advanced mobile video services in wireless-infrastructure apps.

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Technical Features
Making MAS essential for mobile WiMAX
This article reviews the basic principles behind multi-antenna signal processing architectures, their key benefits and implementation considerations for WiMAX equipment developers. (PDF file)

Achieve optimum ADC performance
ADCs are found in many applications that they are almost a commodity. Learn more about ADCs and how to apply them successfully. (PDF file)

Obtain best performance from your FPGA design
This article will explore how FPGA designers can benefit from the latest FPGA building blocks in their quest for higher system-level performance. (PDF file)

Dual or single? Choose the right media processor
Selecting a processor for an embedded multimedia application is a complex endeavor. It involves a thorough analysis of the processor's core architecture and peripheral set. (PDF file)

Achieve accurate angular positioning in rotary stages
Rotary stages are required whenever there is a need for precision in angular positioning or controlled rotation. (PDF file)

Meet amp requirements for high-speed apps
System designers are turning to op amps to help solve challenges ranging from interfacing with data converters to maintaining signal fidelity. (PDF file)

Close the gap between USB, plug-in DAQs
By closing the performance gap between USB and plug-in DAQ devices, designers will have the flexibility to select different modules to construct test systems and meet testing needs. (PDF file)

Do timely testing to avoid cosmic ray damage
Accurate measurements and comparisons of radiation sensitivities of IC memory devices require the control of test conditions according to the complexity of devices. (PDF file)

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Opinion
What's right for electronics design in Asia
With the beginning of a new year, we outline some bright spots in electronics design industry in Asia in an attempt to see what is right in this world.

Getting ahead of 'green' regulations
If environmental efforts are aggressively and efficiently pursued, our industry may find itself achieving 'regulatory insulation.'


Interview
Future engineers see global economy in action
The best way to prepare students to be globally competitive, says Belle Wei, dean of engineering at San Jose State University, is to show them what they're up against.
Interview

NXP CTO reveals HPMS strategy

NXP Semiconductors CTO René Penning De Vries discusses with EE Times Asia how high performance mixed signal technology can shape the future.

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