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01 December 2006
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News & Analysis
Nokia unveiled last month Wibree, which aims to develop a low-power extension to Bluetooth for a short-range wireless sensor link.
Buffeted by a slowdown in IC sales, the foundries now face lower-than-expected growth heading into 2007 and perhaps beyond—a trend that could accelerate a long-awaited shakeout, analysts and vendors warned.
Russia ranks near the bottom of the ladder among participants in the world's electronics and semiconductor markets, but the country has the technical resources to forge a formidable industry presence.
Thanks to technological advancement, GPS will soon emerge in many cellphones built to meet the GSM standard.
Amid calls for a single power spec throughout the design flow, EDA vendor rivalry continues to fuel two separate efforts to develop a low-power description standard.
Pinyon Technology is demonstrating a steerable smart-antenna technology that can be implemented in very small microstrips on FR4, or even on single chips.
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OEM companies in the United States are coordinating four efforts to attack the battery recall problem, while a government-led plan in Japan is addressing the issue with local vendors.
Micron Technology Inc. recently launched a 1Gbit chip made in its 78nm process, tapping the huge potential of the emerging DDR3 generation of double-data-rate memory.
Safety, reliability, engine efficiency and lower cost requirements remain primary concerns in current and future automotive sensor apps.
Demand for the development of automotive sensors is driven by requirements of high reliability, low system costs, harsh operating conditions, small footprint and high precision.
Many audio amps are not designed with high-frequency RF interference in mind, thus inadvertently demodulating information from an RF carrier into the audio band.
With SoC configurability, designers can now release an initial version of a product before final specs are set. Here are a few tips on designing configurable sections within in an SoC.
Bill Schweber underscores the importance of clear, immediate feedback to product users.
Freescale Semiconductor hopes to beat competition with its first PoE chip, which boasts lower prices owing to advanced process technology.
SoftJin Technologies has introduced software that compresses mask data files in Mebes format by a factor of five to 15, reducing file sizes and associated data transfer times.
Ruckus Networks Inc.'s MediaFlex NG is being marketed to carriers with advanced management features for tracking traffic while supporting multiple service set identifiers.
Celsia Technologies recently unveiled a microfluidic technology that cools notebook computers, telecom gear and LEDs used for illumination.
Fujifilm Dimatix has improved the resolution of its electronics-use inkjet printers to approximately 20µm lines and spaces, thanks to a new generation of nozzles based on MEMS.
The ARC Player brings 32bit processing to low-end, high-volume markets for portable consumer electronics.
Ikanos Communications used its Fusiv network processor chip to produce its first residential gateway reference design that supports 802.11b/g WLANs.
Technical Features
By using VoIP-optimized SoCs, OEMs can optimize BOM costs and create product platforms that can be the basis for optimized configurations. (PDF file)
The extension of memory MCPs to include ASICs such as basebands or multimedia processors is challenged by development and ownership/reduction costs, which can be addressed by the emerging PoP concept. (PDF file)
OLED boasts several advantages over LCDs, such as ease of manufacture, faster response time, wider viewing angles, lower power consumption and brighter/higher-contrast images. (PDF file)
Added features and integration of multiple functions have made IC designs more sensitive to ESD, challenging designers to provide the most effective protection while minimizing board space and cost. (PDF file)
Monolithic pHEMT/HBT ICs represent a significant step toward advancing the potential for GaAs capabilities as it maximizes the advantages of both bipolar and FET circuits. (PDF file)
An automated, autonomous, efficient and non-iterative technique for post-processing DCT compressed images is seen as a viable solution to mosquito noise and blocking artifacts. (PDF file)
This article deals with LDMOS IC substrate specifics and balun design challenges, and presents two successful designs and the associated measurement data. (PDF file)
RF verification has rapidly evolved to address the complex RF interfaces found in today's telecommunications standards. (PDF file)
A new generation of SMUs satisfies the need for cost-effective automated test systems with rapid throughput for production of high-pin-count devices and multiple DUT testing. (PDF file)
Opinion
Vital signs are indicating that there's absolutely no reason to predict a dull 2007.
Job candidates must carefully plan their careers. Companies, on the other hand, must be clearer about their standards and expectations, and more aggressive in their recruitment efforts.
Interview
Global forces have set Europe's chip giants on a course of self-reinvention. STMicroelectronics' changes were company-specific.
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