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01 September 2006
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News & Analysis
If the optimistic market analyses are correct, WiMAX could nab nine million subscribers worldwide by 2009, not counting infrastructure applications in cellular backhaul.
Security specialist Certicom rolled out a hardware-based approach to protecting silicon IP using its elliptic-curve cryptography technology and a 20,000-gate embedded core. The company hopes to gain an early-mover advantage as commercial and military developers step up efforts in semiconductor security.
The recent Design Automation Conference made it clear that the EDA industry is counting on DFM for a much-needed boost. But the RDRs that are quietly emerging for 45nm and smaller geometries may reduce the need for some DFM tools and techniques, some observers say.
Frequency issues may be a gating factor in Japan, where WiMAX penetration depends on how the Ministry of Internal Affairs and Communications regulates the usage of the 2.5GHz band.
IBM Corp. and Freescale Semiconductor Inc. have renewed ties to develop a converged approach toward the Power processor architecture.
With the 68K/ColdFire MCU core, OEMs can now easily upgrade from 8bit to 32bit capability with the same on-chip peripheral functions and tool sets.
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The EDA rivals find themselves at odds as the quest for a single simulation approach suitable for high-speed designs continues.
While it's clear that Apple will continue to rule the portable music player market, what puzzles many is the company's apparent shuffling of chip vendors for its iPod platforms.
After members of the IEEE 802.11 working group voting on draft 1.0 of the standard failed to achieve the required 75 percent approval rate earlier this year, standard proposal groups TGnSync, World-Wide Spectrum Efficiency and MitMot agreed to work on a compromise proposal.
Wavesat Inc. and Texas Instruments Inc. are collaborating on a card operating at the unlicensed frequency of 5.8GHz.
Silicon Laboratories has developed a single-chip GSM phone that combines the power-management unit, ARM controller, battery interface and charging circuitry, among others, into a monolithic IC.
CebaTech has announced plans to offer both TCP/IP intellectual property and the C-language compiler that was used to create it.
Via Technologies will launch a single-chip core logic platform that squeezes connectivity options and multimedia acceleration into a 35mm² footprint.
Enigma Semiconductor's new concepts in hybrid switching fabrics combine elements from crossbar and shared-memory switching chips.
Halo-Quest is designed to fit on top of EDA design and analysis tools, and generate accurate silicon image representation of IC designs for use within design flows.
In developing the handset's storage subsystem, designers must decide the type of memory and how much of it to use, the most appropriate package type and how to address that memory in a bus design.
As the quest continues for lower-power, lighter, more robust products, NAND is proving to be a better storage choice than HDD.
The MCP testing challenge can be overcome by a software re-routable interface technique for connecting tester resources to the specific pins being tested.
Here are some tips on how to achieve the longest battery life possible in portable applications.
Technical Features
The whole mobile imaging value chain is expected to benefit from new interface standards, achieving lower costs, faster time-to-market and future-proof solutions. (PDF file)
With the aid of new design techniques, DSP designers can now address the main areas of power consumption--leakage power, clock trees, logic transitions and power grids. (PDF file)
MIMO is the disruptive technology that will change the wireless industry's playing field over the next decade. Today, companies are maximizing the data rate, coverage and spectral efficiency benefits that MIMO OFDM provides. (PDF file)
FTransceivers included in the Virtex-4 FPGA family incorporate highly flexible equalization circuits that extend the range and performance of high-speed serial links. (PDF file)
Memory bandwidth has emerged as the force behind the rapidly increasing 3D-rendering performance of PC graphics systems in desktop and notebook PCs. (PDF file)
Power requirements and power-saving challenges call for new manufacturing and process technologies. These methods must work together to optimize performance and maximize battery life for the customer's benefit. (PDF file)
The Bluetooth headset market has experienced impressive growth in the past five years, with total shipments rising from 7 million units in 2003 to over 60 million headsets in 2005. (PDF file)
At the highest level of powermanagement techniques is Advanced Configuration and Power Interface, an open-industry specification jointly developed by Compaq, Intel, Microsoft, Phoenix and Toshiba. (PDF file)
Learn how to reduce immediate and long-term risks, and improve the productivity, predictability and quality of your verification projects. (PDF file)
Opinion
Taiwan peripherals makers will need to be more agile in their pursuit of new bright spots on the PC horizon.
Smart sensor technology shifts the balance of system intelligence from the operator and instrumentation to the sensors, helping create systems with increased ease-of-use and enhanced capabilities.
Interview
Jim Doran sat down with David Lammers at Spansion's Austin, Texas fab to discuss cultural differences in engineering.
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