Current Issue Home / Current Issue
16 July 2006

News & Analysis | Technical Features | Opinion | Interview
News & Analysis
Agere chips ease 1394 upgrades
The company offers a combination of 1394 silicon that affords board makers greater flexibility in migrating to 800Mbit versions.

Processor rolls for 3G infrastructure
The nP3665 from Applied Micro Circuits Corp. is the company's first packet-forwarding engine dedicated to 3G wireless applications.

Plain I²C bus to get speed makeover
Designers at Philips have increased the speed of the I²C serial bus by 250 percent, improving data transfer speeds and response to control commands.

MIPS-based processors for residential gateways
PMC-Sierra Inc. has unveiled two multiservice processors—one for DSL-based residential gateways using ADSL2+ and another for networks using passive optical networks in conjunction with VDSL.

Buffer line handles all DDR2 speeds
From Inphi Corp. comes a line of configurable, registered memory buffers that lets designers cover all DDR2 speed grade requirements with just a single chip.

Coax network processor refines MoCA apps
Entropic Communications' next-gen coaxial network processor addresses customers' cost concerns and offers some refinements over an earlier chip.


•  Editorial Calendar

•  Contact the Editor

•  Free Subscription

•  Previous Issues
A glimpse inside the Cell processor
Several years ago, IBM, Toshiba and Sony took the task on creating Cell, an amazing new multiprocessor microprocessor chip that will debut later this year in Sony's PlayStation 3 video game console, Toshiba's high-end televisions and IBM's blade servers.

They're not the Valley—and that's the point
Silicon Valley is no longer the end of the rainbow for companies in search of R&D talent, advanced research opportunities, submicron-process expertise or applications development prowess.

Asia's next tier eyes global role
By global standards, the only thing truly big about Beijing Huaqi Information Digital Technology Co. is its name. Nevertheless, it has big plans. Like dozens of companies across Asia, Huaqi aspires to follow in the footsteps of regional giants like Sony and Samsung to be a household name with cutting-edge technology.

OLEDs see action in mobile future
Researchers exploring reflective and emissive display technologies are keen on transforming their fascination with OLED into portable electronic applications.

Philippine electronics industry beefs up engineering capabilities
Long considered a minor player in the global electronics game, the Philippine electronics industry is rallying itself to step up to the plate with two key points in mind: cooperation and education.

LCDs tighten market grip
LCDs continue to benefit from huge capital investments, and technical advances in backlights and display processes are eradicating some of the technology's performance drawbacks.

New tools, solutions at ESC, EDA&T-Taiwan
Asia's longest-running design event will once again gather the world's leading vendors on an expanded show floor at the Taipei International Convention Center in August.

Green engineering challenges reliability, logistics
Manufacturers are compelled to address reliability concerns and logistics issues such as inventory management, part number changes for compliant parts and management of materials-content information.

Going green: Zero emission across different industries
Concern for environmental damage caused by industries' pollution has reached fever pitch globally. Proactive waste management systems practiced today are still in the "end-of-the-pipe" phase. They need to move beyond recycling to work at minimizing waste generation.

Re-engineering the obsolete semiconductor
Here are key points to consider when scouting for a partner to produce obsolete parts for your mission-critical application.

Stencil, squeegee blades affect aperture fill sub-process
This article reviews the impact of the stencil and squeegee blade on the aperture fill sub-process of lead-free printing.

Back to Top

Technical Features
Power ICs simplify Li-ion battery charging
Autonomous power ICs offer full-featured standalone battery chargers integrated with PowerPath controllers and ideal diode devices that efficiently manage input power sources. (PDF file)

Networking the digital home with Viiv
Intel's Viiv technology connects PCs with other consumer electronics devices in the home, allowing them to share content and affording users high-definition entertainment. (PDF file)

The art of capacitive touch sensing
Recent advances in mixed-signal programmable devices are making capacitance-based touch sensors a practical alternative to mechanical switches in many consumer products. (PDF file)

Green IC packaging addresses environmental concerns
Adherence to manufacturing regulations should become a basic requirement for participation in world markets. (PDF file)

Virtual instrumentation for different apps
As a standard platform for test and measurement applications, PXI takes advantage of commercial technologies to improve the performance and lower cost. (PDF file)

MIMO: New tech requires new techniques
Understand the proposed IEEE 802.11n system and the anticipated design and measurement challenges for a specific type of MIMO system implementation. (PDF file)

Back to Top


Opinion
Design for environment is sustainable
With European regulations coming into force, there would be no running away from ecological responsibility.

Distributed framework for multicores
A distributed object model brings all the benefits of object-oriented programming to multicore processing.


Interview
What's in a name? Ask Acer's founder
Stan Shih recently spoke with EE Times' Mike Clendenin about Asia's next brands, China's role in the tech world and why invention isn't the only kind of innovation.

Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

more

 
Top tech resources
 
Go to top