Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
 
 


( File format: PDF, 2401 KB )
TMS320F2810, TMS320F2811, TMS320F2812, TMS320C2810, TMS320C2811,TMS320C2812 DSPs (Rev. O)
Texas Instruments

Description
The TMS320F2810, TMS320F2811, TMS320F2812, TMS320C2810, TMS320C2811, and TMS320C2812 devices, members of the TMS320C28x. DSP generation, are highly integrated, high-performance solutions for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview. Throughout this document, TMS320F2810, TMS320F2811, and TMS320F2812 are abbreviated as F2810, F2811, and F2812, respectively. F281x denotes all three Flash devices. TMS320C2810, TMS320C2811, and TMS320C2812 are abbreviated as C2810, C2811, and C2812, respectively. C281x denotes all three ROM devices. 2810 denotes both F2810 and C2810 devices; 2811 denotes both F2811 and C2811 devices; and 2812 denotes both F2812 and C2812 devices.
Features
High-Performance Static CMOS Technology 150 MHz (6.67-ns Cycle Time) Low-Power (1.8-V Core @135 MHz, 1.9-V Core @150 MHz, 3.3-V I/O) Design 3.3-V Flash Programming Voltage JTAG Boundary Scan Support High-Performance 32-Bit CPU (TMS320C28x) 16 x 16 and 32 x 32 MAC Operations 16 x 16 Dual MAC Harvard Bus Architecture Atomic Operations Fast Interrupt Response and Processing Unified Memory Programming Model 4M Linear Program Address Reach 4M Linear Data Address Reach Code-Efficient (in C/C++ and Assembly) TMS320F24x/LF240x Processor Source Code Compatible On-Chip Memory Flash Devices: Up to 128K x 16 Flash (Four 8K x 16 and Six 16K x 16 Sectors) ROM Devices: Up to 128K x 16 ROM 1K x 16 OTP ROM L0 and L1: 2 Blocks of 4K x 16 Each Single-Access RAM (SARAM) H0: 1 Block of 8K x 16 SARAM M0 and M1: 2 Blocks of 1K x 16 Each SARAM Boot ROM (4K x 16) With Software Boot Modes Standard Math Tables External Interface (F2812) Up to 1M Total Memory Programmable Wait States Programmable Read/Write Strobe Timing Three Individual Chip Selects Clock and System Control Dynamic PLL Ratio Changes Supported On-Chip Oscillator Watchdog Timer Module Three External Interrupts Peripheral Interrupt Expansion (PIE) Block That Supports 45 Peripheral Interrupts 128-Bit Security Key/Lock Protects Flash/ROM/OTP and L0/L1 SARAM Prevents Firmware Reverse Engineering Three 32-Bit CPU-Timers Motor Control Peripherals Two Event Managers (EVA, EVB) Compatible to 240x Devices Serial Port Peripherals Serial Peripheral Interface (SPI) Two Serial Communications Interfaces (SCIs), Standard UART Enhanced Controller Area Network (eCAN) Multichannel Buffered Serial Port (McBSP) With SPI Mode 12-Bit ADC, 16 Channels 2 x 8 Channel Input Multiplexer Two Sample-and-Hold Single/Simultaneous Conversions Fast Conversion Rate: 80 ns/12.5 MSPS Up to 56 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins Advanced Emulation Features Analysis and Breakpoint Functions Real-Time Debug via Hardware Development Tools Include ANSI C/C++ Compiler/Assembler/Linker Supports TMS320C24x™/240x Instructions Code Composer Studio™ IDE DSP/BIOS™ JTAG Scan Controllers [Texas Instruments (TI) or Third-Party] Evaluation Modules Broad Third-Party Digital Motor Control Support Low-Power Modes and Power Savings IDLE, STANDBY, HALT Modes Supported Disable Individual Peripheral Clocks Package Options 179-Ball MicroStar BGA™ With External Memory Interface (GHH), (ZHH) (2812) 176-Pin Low-Profile Quad Flatpack (LQFP) With External Memory Interface (PGF) (2812) 128-Pin LQFP Without External Memory Interface (PBK) (2810, 2811) Temperature Options: A: -40°C to 85°C (GHH, ZHH, PGF, PBK) S: -40°C to 125°C (GHH, ZHH, PGF, PBK) Q: -40°C to 125°C (PGF, PBK) TMS320C24x, Code Composer Studio, DSP/BIOS, and MicroStar BGA are trademarks of Texas Instruments. All trademarks are the property of their respective owners. IEEE Standard 1149.1–1990, IEEE Standard ......




As the hyperlinked contents/websites are those of third parties, we cannot vouch for their accuracy or legitimacy.
Tech Watch

Super-nano fiber

Research reveals self-assembling super-nano plastic fibers

The researchers studied a material made from copper and selenium that exhibits liquid-like behaviors due to...

 
 
Back to Top