New Products
- Level translator supports Secure Digital 3.0 (2012-02-01)
- Clock ICs geared for PCIe devices (2012-01-27)
- LEDs target camera auxiliary flash (2012-01-27)
- Video transceiver boasts link speeds up to 5Gb/s (2012-01-18)
- zSFP+ connector geared for 25Gb/s Ethernet (2012-01-16)
- Circuit headers boast press-fit terminals (2012-01-11)
- FPC connector offers 0.3mm front flip lock (2012-01-06)
- USB-to-Ethernet controller cuts BOM, power use (2011-11-23)
- KVM-over-IP switches support up to 8-16 servers (2011-11-22)
- Fiber optic sol'ns target cloud, virtual server apps (2011-11-17)
- Frame grabber touts 4GB/s peak transfer rate (2011-11-14)
- Interface optocouplers operate at 10MBd (2011-11-14)
- Bus port protection offers 0.6pF capacitance (2011-11-09)
- Encryption chips offers anti-keylogger features (2011-10-24)
- Intelligent platform eases business to cloud migration (2011-10-19)
News & Trends
- HP leads the path to terabyte backplane (2012-02-03)
- Renesas Electronics bows out of large-sized display driver IC biz (2012-02-02)
- Micron buys storage virtualization startup (2012-01-26)
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CES Unveiled: A gadget haven (2012-01-12)
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USBs, peripherals take center stage (2011-12-22)
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JEDEC to release 3D IC standard (2011-12-21)
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Hot CE innovations at the CES (2011-12-20)
- Rambus, ITRI team up for 3D packaging (2011-12-20)
- Nokia works on Bluetooth, indoor navigation combo (2011-12-02)
- Microsoft cooks Kinect for Windows (2011-11-28)
- Sematech starts 3D tech forum (2011-11-09)
- Analyst: DisplayPort devices to ship 400 million by 2014 (2011-11-03)
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TI touts role in Android 4.0 rollout (2011-10-25)
- Surge of USB continues (2011-10-20)
- Mobile network optimization set to surge (2011-10-17)
Technical Archives
- Make the most of 8b/10b encoding in USB 3.0 design (2012-01-19)
- Address challenges in 40G/100G SerDes design, implementation (2011-11-17)
- Understanding power issues in SDI products (Part 2) (2011-08-22)
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Understanding power issues in SDI products (Part 1)
(2011-07-25)
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USB 3.0: More than just a speed boost (2011-04-11)
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A look at the MIPI RFFE standard (2011-03-30)
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Integrating analog video interface IP into SoCs (Part 2) (2010-05-19)
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A closer look at LVDS (2010-05-17)
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Integrating analog video interface IP into SoCs (Part 1) (2010-05-13)
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The move to a discrete Serdes solution for 4G (2010-03-31)
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Carrying out Autosar CAN diagnoses (2010-03-24)
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Host, device apps get SATA IP solution (2009-12-11)
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Differentiate your mobile device's UI (2009-12-02)
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Tips for selecting interface displays for extreme apps (2009-11-17)
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Perk up medical imaging with improved connectors (2008-09-16)
Application Notes
- Comparison of Maxim DS323x RTCs (2012-02-03)
- Employing IBIS-AMI models for serial channel simulation (2012-01-25)
- How to use PWM mode 1 of SH7216 CPU (2011-12-23)
- Installation guide for USB HHID class driver (2011-12-20)
- Guide to installing USB PCDC (2011-12-19)
- Installing USB Host Mass Storage Class Driver (2011-12-16)
- Transmission/reception with master while in slave mode (2011-12-15)
- Using USB host mass storage class driver (2011-12-14)
- Learn about USB basic firmware (2011-12-13)
- Guide to installing USB basic firmware (2011-12-12)
- Tips on using TJA1055T transceiver in CAN apps (2011-11-07)
- FPD-Link III SerDes with bidirectional control channel for I2C (2011-11-01)
- Utilize SDI for an equalizer-only app (2011-10-28)
- Dealing with power needs of SDI video components (2011-10-27)
- Address power issues in SDI components (2011-10-26)
Top10 Article
- Research center targets home energy conservation
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Top Ranked Articles
- CES Unveiled: A gadget haven
- USBs, peripherals take center stage
- JEDEC to release 3D IC standard
- Hot CE innovations at the CES
- TI touts role in Android 4.0 rollout
- PCIe board achieves up to 200MBps throughput
- SATA 3.0 promises 'lightning-fast' transfer speed
- Converter IC links DisplayPort to DTVs
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