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Bits and bytes
New Products
- Free circuits await LTE base stations on FPGA (2008-11-26)
- New tech responds to 40nm, 65nm design needs (2008-11-17)
- Verification IP eases USB 3.0 dev't (2008-11-13)
- Modules simplify configuration processes (2008-11-12)
- Improved adapters, VIP comply with system app needs (2008-11-06)
- SoC Designer brings customized platform solutions (2008-11-05)
- 3G dev kit eyes TI OMAP35x, Windows CE 6 (2008-11-04)
- Simulation tech enhances mixed-signal designs (2008-11-04)
- EM design platform hastens circuit development (2008-11-04)
- Actel boasts compact, low-cost FPGAs (2008-11-03)
- Ziptronix heralds 3-D chip stacking technique (2008-10-31)
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LCD TV design solution achieves 90% efficiency (2008-10-31)
- Advanced Simulink tool delivers customized designs (2008-10-30)
- Reference tool hastens production of media devices (2008-10-29)
- Simulation tool upgrades multicore architectures (2008-10-24)
News & Trends
- Cadence downplays Connections membership issue (2008-11-28)
- Exhibition caters to China's SoC sector (2008-11-28)
- Cadence cuts members from Connections program (2008-11-27)
- SiliconBlue, Magma bolster tech collaboration (2008-11-26)
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Confab to highlight nanotech for bio (2008-11-21)
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Wafer-level packaging achieves prominence (2008-11-21)
- Adobe-ARM team up boosts ARM-powered devices (2008-11-20)
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Comment: Gphones should be more open in net search (2008-11-20)
- RTOS ensures safety in critical tool processing (2008-11-20)
- Analog on 45 nm treated with trepidation by senior engineer at ICCAD panel (2008-11-19)
- Bangalore is home to new The MathWorks office (2008-11-18)
- NTU introduces blink of the eye transmission speed SoC (2008-11-13)
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IBM transits to 45nm SOI (2008-11-12)
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IPO candidates await market recovery (2008-11-10)
- Restructuring befalls Cadence (2008-11-07)
Technical Archives
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Valuing substrate parasitics in RFIC designs
(2008-09-16)
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Automate formal verification for OCP (2008-09-01)
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Employ fencing for best EMI protection (2008-07-01)
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New formula to speed up PCB designs (2008-05-16)
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Sign-off smartly with SSTA (2008-05-01)
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Reduce EMI with proper SI design (2008-04-01)
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Solving PCIe compliance, interoperability issues (2008-02-01)
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Optimize I/O expansion in workstations (2007-12-17)
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Use time-domain methods to measure crosstalk (2007-11-16)
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Multicore future is right now (2007-11-01)
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Know the essentials in stimulus-response test (2007-11-01)
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Formulating an EDA solution to ESI (2007-11-01)
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Keeping up with complex intellectual property (2007-10-16)
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Cut domestic energy with speed control (2007-10-01)
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Broadband illumination captures critical defects (2007-09-17)
Application Notes
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PCB design guidelines for dual power supply voltage translators (2008-10-14)
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USB 2.0 PCB guidelines for the ArcticLink solutions platform (2008-10-10)
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Signal Integrity: Tips and Tricks (2008-09-25)
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Get your priorities right: Make your design up to 50% smaller (2008-09-24)
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Complete battery-pack design for one-or two-cell portable applications (2008-09-18)
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Power-management solutions for telecom systems improve performance, cost, and size (2008-09-18)
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Selecting the correct IC for power supply applications (2008-09-18)
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Advanced adapter ORing solutions using the TPS23753 (2008-09-16)
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25W, high-power PoE using the TPS2376-H (2008-09-16)
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Viterbi decoder block decoding - Trellis termination and tail biting (2008-09-15)
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Extending single input charger to dual input applications (2008-09-15)
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Single-Cell Impedance Track gas gauge for novices (2008-09-15)
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Inverting LVDS Signals for Efficient PCB Layout in Spartan-3 Generation FPGAs (2008-09-13)
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J Drive: In-System Programming of IEEE Standard 1532 Devices (2008-09-13)
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Custom PCI timing budgets for Spartan-3 Generation FPGAs (2008-09-12)
Top Ranked Articles
- Wafer-level packaging achieves prominence
- Confab to highlight nanotech for bio
- Comment: Gphones should be more open in net search
- IBM transits to 45nm SOI
- IPO candidates await market recovery
- VC funding for chip firms slows down
- Bozotti cites key points for ST's rehabilitation
- LCD TV design solution achieves 90% efficiency
- Intel to showcase 32nm technology at confab
- GooglePhone responds to Android's aspirations
