Memsic rolls out monolithic 3-axis accelerometer
Memsic Inc. has announced what it says is the world's first monolithic 3D accelerometer and the first to make use of wafer-level packaging. According to the company, the MXC400xXC makes use of Memsic's patented thermal convection, heated gas method to detect acceleration and inclination.
The method has been used for many years by Memsic in single-axis or dual-axis form for automotive stability control and rollover detection, digital cameras, projectors and many other applications. MEMSIC's designers have combined 3D sensing with wafer scale packaging to reduced cost and size for mobile applications such as phones, tablet computers, toys and wearable devices.
Memsic claims to offer a 60 per cent reduction in cost and a 50 per cent reduction in size but only partially benchmarks what it is comparing the MXC400xXC against.
The MXC400xXC provides 12bit resolution on all three axes, programmable FSR of ±2g/±4g/±8g, an 8bit temperature output, plus orientation/shake detection. With a package size of 1.2 x 1.7mm, board space is reduced by 50 per cent over industry-standard 2 x 2mm products. As the MXC400xXC has no moving parts the sensor structure extremely robust to shock and vibration and in can withstand shock in excess of 200,000g, added the company.
The MEMSIC MXC400xXC three-axis accelerometer is priced at $0.19 each in 100,000 piece quantities and is available in sample quantities.
- Peter Clarke
EE Times Europe
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