Handling, process guidelines for surface mount IC
In this application note, Texas Instruments provides recommendations for handling, storing and mounting of Texas Instrument's surface mount IC packages. The final manufacturing yield and board level reliability are influenced by various factors and processes outside the control of the IC manufacturer. This application note can therefore only be used as a guideline and reference to support our customers. Due to the variety of possible board assembly materials and equipments, Texas Instruments advises the user to consult the individual suppliers and vendors to achieve the optimum board assembly yield.
View the PDF document for more information.
Originally published by Texas Instruments Inc. at www.ti.com as "AN-2029 Handling & Process Recommendations".
|Related Articles||Editor's Choice|
votes: Add to Favorites
Top Ranked Articles