Monolithic 3D accelerometer boasts WLP tech
According to the company, the technology breakthrough in combining the 3D IC sensor with full WLP translates directly to a 60 per cent reduction in cost and a 50 per cent reduction in size, enabling a generation of mobile consumer devices such as phones, tablets, toys and wearable devices.
The key to this breakthrough is MEMSIC's proprietary and patented thermal accelerometer technology, in which the MEMS sensor structure is etched directly into standard CMOS wafers, enabling the world's only CMOS monolithic solution. This technique uses thermal convection of heated gas molecules inside a sealed cavity to sense acceleration or inclination, and has been used for many years in MEMSIC's products for automotive stability control and rollover detection, digital cameras, projectors and many other applications.
The MXC400xXC offers a number of benefits to system designers of space- and cost-sensitive consumer devices, noted the company. In addition to offering the world's lowest cost, the device provides 12bit resolution on all three axes, programmable FSR of ±2g/±4g/±8g, an 8bit temperature output, plus orientation/shake detection, added MEMSIC. With a package size of 1.2 x 1.7mm, board space is reduced by 50 per cent over industry-standard 2 x 2mm solutions. And like all MEMSIC thermal accelerometers, the MXC400xXC has no moving parts, making the sensor structure extremely robust to shock and vibration (withstands shock in excess of 200,000g with no change in sensor performance).This is critically important to wearable and many consumer applications.
The MEMSIC MXC400xXC three-axis accelerometers are priced at $0.19 each in 100,000 piece quantities and is available in sample quantities.
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