Kingyoup bonding equipment addresses miniaturisation
Taiwan-based start-up Kingyoup Optronics Co., Ltd revealed its temporary bonding and de-bonding equipment co-developed with IBM at the IEEE Electronics Components and Technology Conference (ECTC) held in Florida last month.
The temporary bonding and de-bonding equipment is specially designed to meet the microelectronics miniaturisation needs of today's smart, mobile, consumer electronics devices. It enables 3D ICs, 2.5D packaging integration and system applications.
The equipment uses a hybrid laser de-bonding solution with a claimed industry-leading throughput of over 60 wafers to 100 wafers per hour. It also supports wafer thinning to 50um and below, which is less than the thickness of a human hair, for either 200mm or 300mm wafers.
The temporary bonding process features coating uniformity, uniform bonding pressure, fast heating and cooling design, and compliance to both low and high temperature processes. Meanwhile, the de-bonding process showcases fast release from low power laser, full absorption by the coating layer without defect, minimum de-bonding stress, and several adhesive options.
According to Kingyoup, IBM researchers produced technical presentations discussing the benefits of the patented laser de-bonding technology. The technology can be applied to semiconductor wafer processing and packaging technologies in either wafer level or panel size formats.
Kingyoup temporary bonding and de-bonding processes flows. Source: Kingyoup