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Molex touts plastic substrate interconnect for CoB arrays

Posted: 09 Jun 2014  Print Version  Bookmark and Share

Keywords:Molex  interconnect  CoB array  Chip-on-Board  LED 

Molex Inc. has introduced a plastic substrate interconnect (PSI) for LED Chip-on-Board (CoB) arrays. According to the company, the customisable interconnects feature a low-profile harness interface that delivers power to the array through a simple and reliable connection to a holder, or plastic substrate.

With a low overall package height of about 2mm, Molex PSI provides a slim design for space-limited applications while minimising substrate costs. By employing the Pico-EZmate harness system, the solution integrates the electrical and mechanical features with the array for a simple, solderless connection, noted the company.

Molex PSI

The PSI system is geared for high-density and high-light output applications such as downlighting (track, pendants and linear) and area lighting (roadways, parking lots and wall packs). LED CoB technology ensures strong future development capabilities by allowing integration of additional components.

The system supports a variety of potential PSI designs including circular, rectangular, and customisable shapes, sizes, mounting hole patterns and interconnects. The circular design comes in a 22.50 x 22.50mm CoB size; 36mm outer diameter and 2mm height profile. The rectangular design comes in a 22.50 x 22.50mm CoB size; 36.50 x 28.50mm outer dimension and 2mm height profile.

The solderless Pico-EZmate harness attaches to the LED array holder with no special processes or tools for an efficient connection that minimises contact with the array to reduce the risk of damage. The vertical snap-to-mate connection, positive-lock latching feature and gold plated contacts deliver superior reliability. The harnesses will be offered in three wire gauge configurations and various lengths for a range of initial harness options based on application need.

In addition to the integrated Pico-EZmate solution, Molex offers a variety of low-profile header and receptacle systems that can be integrated into a custom PSI depending on the application.





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