Wireless connectivity chipset enjoys shipment upswing
Cumulative chipset shipments from 2010 through 2014 are seen to exceed 21 billion. Over the next five years, the numbers are expected to double, recording over 39 billion by the end of the forecast year. The total is believed to be higher, were it not for combo chipsets and integrated platforms.
"That is over 60 billion wireless connectivity chipsets that will have shipped over the ten year span from 2010 to 2019, driven by the emergence of new device types," said research director Philip Solis. "There is constant change in the wireless connectivity space across wireless connectivity technologies, versions of technologies, and levels of integration at the same time."
At 60 per cent, the majority of wireless connectivity chipsets will be stand-alone this year. The share will increase to two-thirds of the market in 2019. Meanwhile, integrated platforms' share will remain relatively steady over the next five years. The share of combo chipsets, in contrast, is projected to drop, though shipment volume will remain stable.
Within the smartphone segment, Broadcom dominates combo chipset solutions, and Qualcomm, integrated platforms with wireless connectivity. Broadcom, Intel, Marvell, MediaTek, and Qualcomm Atheros are the key players in the overall market for stand-alone Wi-Fi chipsets. In the overall market for stand-alone Bluetooth chipsets, Broadcom, MediaTek, and RDA are the strong performers. Overall, Broadcom is well ahead for combo chipsets.
"Wireless connectivity chipsets go into a vast array of types of products, and the dynamics of connectivity technologies and integration levels varies among them resulting in the aggregate effects we see," added Solis. "The technologies and integration level are going to be different in smartphones versus home automation versus other product types in the Internet of Things."
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