Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
 
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Assembly handling, thermal mgmt for lidless FC-PBGA

Posted: 26 May 2014  Print Version  Bookmark and Share

Keywords:assembly handling  thermal management  lidless  Flip Chip  Plastic Ball Grid Array 

This application note provides recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array (FCPBGA) components. Freescale's FC-PBGA is a laminate-based BGA packaging solution that provides competitive solutions for higher performance applications.

 • Improved board-level, solder-joint reliability and lower cost compared to FC CBGA
 • Custom substrate designs / ball maps for maximum routing flexibility and electrical performance
 • Custom ball patterns / full arrays / depopulated arrays available, up to ˜1300 I/O
 • Substrates use standard organic PCB manufacturing and HDI build up technologies
 • FC-PBGA footprint is a drop-in replacement (PCB design and board assembly) for WB PBGA for the same ball diameter and pitch
 • Capability to withstand lead–free reflow processes (260C reflow)
 • Proven reliability in industrial environments
 • Lead–free solder balls available

View the PDF document for more information.

Originally published by Freescale Semiconductor at www.freescale.com as "Assembly Handling and Thermal Solutions for Lidless Flip Chip Ball Grid Array Packages".





Article Comments - Assembly handling, thermal mgmt for ...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 
 
Back to Top