Assembly handling, thermal mgmt for lidless FC-PBGA
Improved board-level, solder-joint reliability and lower cost compared to FC CBGA
Custom substrate designs / ball maps for maximum routing flexibility and electrical performance
Custom ball patterns / full arrays / depopulated arrays available, up to ˜1300 I/O
Substrates use standard organic PCB manufacturing and HDI build up technologies
FC-PBGA footprint is a drop-in replacement (PCB design and board assembly) for WB PBGA for the same ball diameter and pitch
Capability to withstand lead–free reflow processes (260C reflow)
Proven reliability in industrial environments
Lead–free solder balls available
View the PDF document for more information.
Originally published by Freescale Semiconductor at www.freescale.com as "Assembly Handling and Thermal Solutions for Lidless Flip Chip Ball Grid Array Packages".
|Related Articles||Editor's Choice|