Infineon outs leadless SMD package for CoolMOS MOSFETs
Infineon Technologies has rolled out a leadless surface mounted (SMD) package for CoolMOS MOSFETs named ThinPAK 5x6. The package guarantees engineers more flexibility in their PCB designs and better switching performance, which paves the way for more efficient power conversion while cutting overall system size in applications such as low power adapters, lighting and thin panel TVs.
Chargers for mobile devices, Ultra High Definition TVs and LED lighting all have to meet numerous conflicting requirements. Consumers long for slim yet high performing products. Therefore, manufacturers demand compact, cool and cost efficient semiconductor solutions. These considerable space constraints can be resolved by reducing the size and weight of the components that occupy PCB area.
For chargers, there is a clear trend towards smaller, faster and more efficient solutions. With its height of only 1mm and with its very small footprint of 5 x 6mm, the ThinPAK 5x6 provides 80 per cent volume reduction in comparison to traditional SMD packages such as DPAK. Thus, manufacturers gain flexibility for the design of even smaller chargers. The very low parasitics of ThinPAK, such as low source inductance compared to the traditional DPAK, reduce the gate oscillation under all load conditions and minimise voltage overshoots during switching by 40 per cent in comparison to traditional SMD thus improving device and system stability and ease of use.
Engineering samples of the ThinPAK 5x6 package are available now. Volume production will begin in September 2014.
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