MEI develops advanced metal lift-off system
MEI's FluidJet batch wet processing system for metal lift-off works with no metal re-deposition on either the front side or back side of the wafer, and eliminates device damage, while using 80 per cent less chemical than current single wafer processing solutions. In addition, FluidJet enables highly efficient, easily obtained gold and metal reclaim, reducing waste and downtime.
Patented FluidJet for metal lift-off
FluidJet also saves valuable manufacturing floor space by reducing the wet process footprint requirement by at least 60 per cent over comparable throughput single wafer spray tools.
"By adopting the FluidJet metal lift-off system, semiconductor manufacturers will increase yield while reducing downtime and chemical costs and disposal," said Dan Cappello, MEI president and CEO. "FluidJet cleans the surface gently improving metal lift-off performance at a lower cost. Side by side 'split lot' comparison data demonstrates superior performance on lift-off and resist strip layers while also reducing defects."