Dongbu takes X3 sensor chips into volume production
The sensor is built with a pixel-stacking architecture. It identifies colour information using three layers, capturing 19.6MP resolution at the top, but only 4.9MP each at the lower levels. This makes for a luminance resolution higher than the colour resolution, which is similar to conventional "Bayer" sensors.
The possible loss of a little colour resolution notwithstanding, Dongbu HiTek Marketing EVP Jae Song said, "Compared to prior sensor designs, this [X3 Quattro] represents a 30 per cent increase in pixel detail without the need to increase chip size."
As the first entry in this new camera line, Sigma's dp2 Quattro will soon be followed by dp1 and dp3 models also incorporating X3 Quattro CIS chips manufactured by Dongbu HiTek.
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