Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
 
EE Times-Asia > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Dongbu takes X3 sensor chips into volume production

Posted: 11 Mar 2014  Print Version  Bookmark and Share

Keywords:sensor  Foveon  Quattro 

Dongbu HiTek has confirmed volume production of Foveon's enhanced CMOS image sensor chips (CIS), named X3 Quattro. The chips are being deployed in the compact dp2 Quattro camera from Sigma.

The sensor is built with a pixel-stacking architecture. It identifies colour information using three layers, capturing 19.6MP resolution at the top, but only 4.9MP each at the lower levels. This makes for a luminance resolution higher than the colour resolution, which is similar to conventional "Bayer" sensors.

The possible loss of a little colour resolution notwithstanding, Dongbu HiTek Marketing EVP Jae Song said, "Compared to prior sensor designs, this [X3 Quattro] represents a 30 per cent increase in pixel detail without the need to increase chip size."

As the first entry in this new camera line, Sigma's dp2 Quattro will soon be followed by dp1 and dp3 models also incorporating X3 Quattro CIS chips manufactured by Dongbu HiTek.





Article Comments - Dongbu takes X3 sensor chips into vo...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 
 
Back to Top