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Toshiba offers TransferJet-compatible wireless comm module

Posted: 05 Mar 2014  Print Version  Bookmark and Share

Keywords:Toshiba  wireless communication  module  TransferJet  FPC coupler 

Toshiba has unveiled what it boasts as the world's smallest wireless communication module and thinnest flexible printed circuit (FPC) coupler compatible with TransferJet, the close-proximity wireless transfer technology. In combination and applied to mobile devices, such as smartphones, they achieve a maximum data transfer rate of 375Mb/s, detailed the firm.

TransferJet continues to win attention as a low-power, high-speed communication standard, and is expected to find wide acceptance because of its uniquely simple approach to connectivity. Since the already high data volumes handled by individuals are expected to increase explosively in the near future, TransferJet is a highly promising solution for high-speed communications between electronic devices in close proximity. This will fuel demand for TransferJet, modules and couplers that can be easily implemented in consumer products.

Toshiba's small module, only 4.8 x 4.8 x 1mm, and ultra-thin FPC coupler, only 0.12mm thick, achieve a maximum physical layer transmission rate of 522Mb/s (effective data transfer rate of 375Mb/s). Module miniaturization was realized by employing 3D integration technology to embed a TransferJet-compatible LSI in the module substrate. Such embedding usually requires a higher module to maintain performance, but Toshiba's advanced design capabilities enabled it to secure a low module with excellent performance. The thin FPC coupler is fabricated with an innovative process that uses molecular bonding technology.

A potential problem with small, thin modules formed with 3D integration technology is a parasitic capacitance increase that often degrades performance. The frequency response of TransferJet is particularly sensitive to this, as has a wide signal bandwidth, 560MHz. Toshiba identified potential problems with parasitic capacitance, and solved them with the design of the module structure and tuning transmission signals' waveforms inside the LSI.

The FPC coupler is fabricated with molecular bonding technology, which secures enough adhesion of FPC by covalent bond of a thin molecular layer. The coupler is electrically evaluated with the module and excellent transmission RF signals have been observed. It has quarter thickness of conventional couplers.

This module and coupler are geared for small, thin mobile devices, and Toshiba expects them to be widely adopted. The module is ready for sample production and the coupler will be ready for sample production this month.





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