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EVG outs high-volume-mfg photoresist processing system

Posted: 13 Feb 2014  Print Version  Bookmark and Share

Keywords:EVG  photoresist  TSV  3D IC  interposer manufacturing 

EV Group (EVG) has rolled out what it describes as its most advanced 300mm photoresist processing system for logic and memory high-volume manufacturing (HVM). The EVG150XT resist coating and developing system boasts its XT Frame platform used across its spectrum of industry-leading systems, and is optimized for ultra-high throughput and productivity.

The EVG150XT is designed for processing resists, spin-on dielectrics and thick films for mid-end-of-line (MEOL) and back-end-of-line (BEOL) semiconductor applications, including through silicon via (TSV) formation, wafer bumping, redistribution layer and interposer manufacturing for 2.5 and 3D IC packaging.

EVG150XT

The EVG150XT is the industry's first high-volume-manufacturing resist processing system for 300mm logic and memory mid-end and back-end interconnect applications. (PRNewsFoto/EV Group)

The EVG150XT features nine process modules that can operate simultaneously for multi-parallel wafer processing. Smart scheduling software for throughput-optimized handling sequences has also been incorporated, along with pumps and dispense systems tailored for thick film applications. In addition, an in-line metrology module has been integrated into the EVG150XT that can detect a variety of process irregularities and defects to enable real-time process corrections to reduce defects, increase yields and lower production costs. These and other software and hardware enhancements optimize the EVG150XT for high-volume manufacturing environments.





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