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EVG outs high-volume-mfg photoresist processing system

Posted: 13 Feb 2014     Print Version  Bookmark and Share

Keywords:EVG  photoresist  TSV  3D IC  interposer manufacturing 

EV Group (EVG) has rolled out what it describes as its most advanced 300mm photoresist processing system for logic and memory high-volume manufacturing (HVM). The EVG150XT resist coating and developing system boasts its XT Frame platform used across its spectrum of industry-leading systems, and is optimized for ultra-high throughput and productivity.

The EVG150XT is designed for processing resists, spin-on dielectrics and thick films for mid-end-of-line (MEOL) and back-end-of-line (BEOL) semiconductor applications, including through silicon via (TSV) formation, wafer bumping, redistribution layer and interposer manufacturing for 2.5 and 3D IC packaging.


The EVG150XT is the industry's first high-volume-manufacturing resist processing system for 300mm logic and memory mid-end and back-end interconnect applications. (PRNewsFoto/EV Group)

The EVG150XT features nine process modules that can operate simultaneously for multi-parallel wafer processing. Smart scheduling software for throughput-optimized handling sequences has also been incorporated, along with pumps and dispense systems tailored for thick film applications. In addition, an in-line metrology module has been integrated into the EVG150XT that can detect a variety of process irregularities and defects to enable real-time process corrections to reduce defects, increase yields and lower production costs. These and other software and hardware enhancements optimize the EVG150XT for high-volume manufacturing environments.

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