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MediaTek, VIA Telecom team up for multimode LTE modem chipset

Posted: 08 Jan 2014  Print Version  Bookmark and Share

Keywords:MediaTek  LTE modem  VIA Telecom  VoLTE  mobile network 

MediaTek has joined forces with VIA Telecom to integrate its CDMA2000 technology into the upcoming Worldmode mobile platforms. The collaboration is part of MediaTek's strategy to address global markets with its highly-integrated, feature-rich SoC designs for mainstream mobile devices.

The existing MediaTek SoCs include comprehensive wireless modem, connectivity and multimedia capabilities. The collaboration with VIA Telecom enables the next-generation MediaTek SoCs to include support for Worldmode global roaming of voice and data services across CDMA2000, LTE (TDD and FDD), DC-HSPA+, UMTS, TD-SCDMA and GSM/EDGE networks.

MediaTek Worldmode SoCs will support interoperability between CDMA2000 and LTE modes for the US and China regions, with handover for seamless switching across both networks, depending on coverage. The SoCs will also be software upgradeable to support Voice over LTE (VoLTE) once mobile network operators begin to roll out the technology.

MediaTek uses VIA Telecom baseband processors as a discrete part in its existing mobile reference designs, and now, incorporating CDMA2000 technology into SoC designs will significantly reduce manufacturing costs and power consumption for mobile devices.

In light of this, the company has also unveiled its first LTE modem platform at CES 2014 that the company said delivers LTE data rates as high as 150Mb/s downlink and 50Mb/s uplink. The chip implements frequency division duplex and time division duplex (FDD and TDD) modes of LTE for broad compatibility with mobile operator networks worldwide. In addition to LTE, the MT6290 also supports DC-HSPA+, W-CDMA, TD-SCDMA, EDGE and GSM/GPRS radio technologies.

The supporting RF chip in the platform is called MT6169 that supports up to eight primary RF inputs (three high bands, two mid bands, three low bands), plus another eight RF inputs for diversity gains. The RF chip supports more than 30 3GPP bands and is configurable to meet the RF band needs of mobile operators globally.

"We are pleased to unveil our first LTE modem platform at the CES show and seek to create a global market of mainstream LTE devices in collaboration with our mobile operator partners," said Cheng-Te Chuang, head of wireless communications technology businesses unit and VP of MediaTek. "The MT6290 is fully-compatible with the presently-available 3G mobile SoCs from MediaTek and our next-generation SoCs with LTE integration will be sampling throughout 2014."

Mohit Bhushan, VP/GM of MediaTek corporate marketing, USA, said: "MediaTek has shared its LTE plans with all US operators, and the response has been terrific. We are now preparing to certify the MT6290 platform with all US operators followed by the commercialization of MT6290-enabled data devices within 2014."

The MT6290 reference design has been delivered to MediaTek's early-adopter OEM partners and the first commercial devices are expected in 2Q14. Samples of MediaTek Worldmode SoCs will be available in 4Q14 and the first commercial devices are expected in 1H15.





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