Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
 
EE Times-Asia > Memory/Storage
 
 
Memory/Storage  

Hynix to start sampling 3D flash memory chips

Posted: 04 Jan 2013  Print Version  Bookmark and Share

Keywords:3D flash memory  VSAT  smartphones  tablet 

South Korean memory semiconductor supplier SK Hynix said earlier this week that it would begin mass production and sampling of 3D flash memory chips that utilises vertical-stacked-array-transistor (VSAT) technology, according to a report by the Korea Times.

Flash chip, which is a type of non-volatile memory that can be erased and reprogrammed, is ideal for data-intensive devices that constantly connect to the Internet. It has a simple cell structure that allows for higher memory capacity, density and durability.

"As far as I know, all major semiconductor companies are investing more in the development of 3D flash memory chips. SK Hynix is trying hard to mass produce them as early as possible," said CTO Park Sung-wook. Samsung Electronics is reportedly planning to produce 3D flash memory chips in its plant in Xi'an, China upon completion of the facility.





Article Comments - Hynix to start sampling 3D flash mem...
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
 
Webinars

Seminars

Visit Asia Webinars to learn about the latest in technology and get practical design tips.

 
 
Back to Top