Infineon optimizes mobile phone chips

Infineon Technologies has introduced its latest chips for ultralow cost (ULC) mobile phones that optimizes system performance five times and reduces the BOM by almost 10 percent.

The X-GOLD 102, a single-chip solution, provides handset manufacturers the lowest cost solutions based on technologies that are already available in volume production. As part of a platform solution XMM 1020, the chip enables customers to bring mobile phones to market within a 5-month time frame.

This pre-tested platform delivers best-in-class RF performance, highest voice quality, well-proven protocol stack, smallest form factor at 8mm x 8mm, as well as lowest bill-of-material thereby creating highest customer value and differentiation in the market.

The X-GOLD102 single chip includes the baseband processor, the RF transceiver, RAM memory and the entire power management unit for the mobile phone. It supports MP3 audio, color display, FM Radio interface, USB charger and is based on 130nm technology (CMOS SoC) for enhanced monolithic integration. Additionally the XMM1020 platform can be realized in a 4-layer PCB and low via count, in a modem area of less than 5cm(SUB>2 and a component count of less than 50 devices.

Dual-SIM XMM 1028
Infineon has also launched its new Ultra-Low Cost dual-SIM platform, the XMM 1028 based on the X-GOLD 102DS, a cost-optimized single baseband solution for dual-SIM platforms.

The XMM1028 is a fully capable dual-SIM solution based on a single baseband device that integrates baseband, power management, RF and two SIM interfaces that allows the user to benefit from the offerings of two network operators at the same time, without needing to switch the SIM-card. It offers voice call and SMS for both SIM and features unique applications for dual SIM such as phonebook or call log, as well as automatic switching between operators.

With less than 50 components (Modem) in a PCB mounted area of less than 6cm₂, the XMM 1028 provides a clean migration path for developers familiar with the XMM1010 platform with fast time-to-market and industries lowest system BOM, which enables manufacturers to offer best possible cost effectiveness in the dual-SIM segment.

The XMM1020 and XMM1028 are now available in volume production.

Keywords: ULC handset   RF chip