EE Times-Asia

For Registered Users

Testing HSDPA, HSUPA for 3G mobile apps
Author:Simon Binar

This article provides an introduction to both UTRAN enhancements—HSUPA and HSDPA—and demonstrates which test requirements exist in the development and deployment of the new technologies.

Please login to view article>>

Email address:
Password:		Password is case-sensitive.
	Remember password Forgot your password?

	If you have already registered on the following websites, please log in using your email address and password
EE Times-Asia sites: EE Times-India EE Times-Taiwan EE Times-Korea EE Times-China Analog/Mix signal Cellphone Power Systems Media Player Embedded Design India Power Design India Home Entertainment Industrial Controls Auto Electronics

If you have already registered on the following websites, please log in using your email address and password

EE Times-Asia sites:

	Latest News
JTAG boosts boundary-scan offering with latest release (2008-08-22) Xilinx touts cost-saving features of Spartan-3A FPGAs (2008-08-22) Timing device extends laptop's battery life (2008-08-22) Photodiode receivers offer ultrahigh speed data response (2008-08-22) Wireless transceiver improves packet channels (2008-08-22) SiPort receiver gets HD Radio certification (2008-08-22) Replacement parts for Intel processors roll (2008-08-22) Magnetic modules power LAN systems (2008-08-22)

Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

Top tech resources

1.Web server design using soft processor(1,287views)

2. Address challenges in DVB-H (1,254views)

3. Using GMR sensors with scan interface (974views)

4. Simple glass breakage detector (970views)

5. Serial flash boot loader (883views)

India Newsletter

1.Board design becomes a nimble giant

2.ECAD-MCAD needs unified solution

3.Smart optical nets power enterprise

4.Fibre-optic networking

Go to top

eMedia Asia	EE Times - India\|\|\|
Global Sources	\|\|\|Electronic Components\|Computer Products\|Trade Show Center\|China Sourcing Fairs
TechInsights	EE Times\|ESM Online

Copyright © 2008 eMedia Asia Ltd. All rights reserved. Reproduction in whole or in part in any form or medium without the express written permission of eMedia Asia Ltd.
is prohibited. Warning: The images on this site are protected by digital watermark technology. Your use of this website is subject to, and constitutes acknowledgement
and acceptance of our Terms of Use.