EE Times-Asia

For Registered Users

Fujitsu announces breakthrough in solder bumping, flip-chip bonding

Fujitsu Ltd has developed new technology that enables formation of ultrafine pitch 35&3181;m (center-to-center distance of bumps) solder bumps, and high-precision flip-chip bonding interconnection.

Please login to view article>>

Email address:
Password:		Password is case-sensitive.
	Remember password Forgot your password?

	If you have already registered on the following websites, please log in using your email address and password
EE Times-Asia sites: EE Times-India EE Times-Taiwan EE Times-Korea EE Times-China Analog/Mix signal Cellphone Power Systems Media Player Embedded Design India Power Design India Home Entertainment Industrial Controls Auto Electronics

If you have already registered on the following websites, please log in using your email address and password

EE Times-Asia sites:

Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

Top tech resources

1.Web server design using soft processor(1,287views)

2. Address challenges in DVB-H (1,254views)

3. Using GMR sensors with scan interface (974views)

4. Simple glass breakage detector (970views)

5. Serial flash boot loader (883views)

India Newsletter

1.Board design becomes a nimble giant

2.ECAD-MCAD needs unified solution

3.Smart optical nets power enterprise

4.Fibre-optic networking

Go to top

eMedia Asia	EE Times - India\|\|\|
Global Sources	\|\|\|Electronic Components\|Computer Products\|Trade Show Center\|China Sourcing Fairs
TechInsights	EE Times\|ESM Online

Copyright © 2008 eMedia Asia Ltd. All rights reserved. Reproduction in whole or in part in any form or medium without the express written permission of eMedia Asia Ltd.
is prohibited. Warning: The images on this site are protected by digital watermark technology. Your use of this website is subject to, and constitutes acknowledgement
and acceptance of our Terms of Use.