EE Times-Asia

For Registered Users

Fairchild eyes GEM deal for proliferation of MOSFET packs
Author: Stephan Ohr

Fairchild Semiconductor Corp. is negotiating with GEM Services Inc. to make the latter a third-party licensor of the technology and tooling for Fairchild's new "bottomless" MOSFET BGA and flip-leaded molded packages.

Please login or register with us to view this article>>

Not yet registered?

Quick Register now and be part of the EE Times Asia community!

Email address:
Password:
Confirm password:
Company name:
Job function:
Products/Services:

Click hereto fill out other information details. You can also subscribe to eeNews and apply to receive a copy of the magazine.

Registered already? Login to view complete content.

Email address:
Password:
	Password is case-sensitive.
	Remember password Forgot your password?

	If you have already registered on the following websites, please log in using your email address and password
EE Times-Asia sites: EE Times-India EE Times-Taiwan EE Times-Korea EE Times-China Analog/Mix signal Power Systems Embedded Design India Power Design India Home Entertainment Handheld Device Industrial Controls Auto Electronics

If you have already registered on the following websites, please log in using your email address and password

EE Times-Asia sites:

	Latest News
Market gears up for LTE chips (2008-12-03) Vista-compliant audio chips are space-, power-savers (2008-12-03) 3G femtocell transceivers support UMTS (2008-12-03) Charger IC handles concurrent system load, charging (2008-12-03) I²C power manager targets portable USB-powered apps (2008-12-03) Solution bridges MDDI/CPU, MIPI (2008-12-03) Volume production commences for 256Gbyte SSDs (2008-12-03) Power modules offer 25ppm option (2008-12-03)

Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

Top tech resources

1.Web server design using soft processor(1,287views)

2. Address challenges in DVB-H (1,254views)

3. Using GMR sensors with scan interface (974views)

4. Simple glass breakage detector (970views)

5. Serial flash boot loader (883views)

Go to top

eMedia Asia	EE Times - India\|Embedded Design India\|Power Design - India\|\|\|
Global Sources	\|\|\|Electronic Components\|Computer Products\|Trade Show Center
TechInsights	EE Times\|ESM Online\|EE Times JAPAN

Copyright © 2008 eMedia Asia Ltd. All rights reserved. Reproduction in whole or in part in any form or medium without the express written permission of eMedia Asia Ltd.
is prohibited. Warning: The images on this site are protected by digital watermark technology. Your use of this website is subject to, and constitutes acknowledgement
and acceptance of our Terms of Use.