EE Times-Asia

Solder joint reliability of BGA/CSP for mobile phones
Author: Kinuko Mishiro, Mitsunori Abe, Shigeo Ishikawa, Yutaka Higashiguchi and Ken-ichiro Tsubone

A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.

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