EE Times-Asia

Integrating handling for test, inspection, marking and packing
Author: Remy Degen

Deploying individual handling systems for testing, inspection, marking and packing leads to inefficiency, under-utilization of IC test equipment, and can even cause bottlenecks that can slow down related back-end processes. Not only do multi-function automated systems circumvent these problems, they also improve throughput and occupy far less floor space.

Please login or register with us to view this article>>

Not yet registered?

Quick Register now and be part of the EE Times Asia community!

Email address:
Password:
Confirm password:
Company name:
Job function:
Products/Services:

Click hereto fill out other information details. You can also subscribe to eeNews and apply to receive a copy of the magazine.

Registered already? Login to view complete content.

Email address:
Password:
	Password is case-sensitive.
	Remember password Forgot your password?

	If you have already registered on the following websites, please log in using your email address and password
EE Times-Asia sites: EE Times-India EE Times-Taiwan EE Times-Korea EE Times-China Analog/Mix signal Power Systems Embedded Design India Power Design India Home Entertainment Handheld Device Industrial Controls Auto Electronics

If you have already registered on the following websites, please log in using your email address and password

EE Times-Asia sites:

	Latest News
Netbook bandwagon welcomes new processors, chips (2009-01-07) Fast-Ethernet switches made for mobile, comms-intensive apps (2009-01-07) 8-/16bit MCUs tout 0.7A standby current consumption (2009-01-07) Intel releases beta of Parallel Composer software tool (2009-01-07) Switches ensure safety from short-circuits (2009-01-07) Processor blade packs Intel Xeon, memory controller hub (2009-01-07) Automotive output controller handles up to 38V (2009-01-07) LED controllers cut power dissipation in flat LCD TVs (2009-01-07)

Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

Top tech resources

1.Web server design using soft processor(1,287views)

2. Address challenges in DVB-H (1,254views)

3. Using GMR sensors with scan interface (974views)

4. Simple glass breakage detector (970views)

5. Serial flash boot loader (883views)

India Newsletter

1.DSPs integrate automotive bus standards

2.Use comparators for mixed-signal apps

3.Innovations advance mobile VoIP

4.WiMAX boosts India broadband market

eMedia Asia	EE Times - India\|Embedded Design India\|Power Design - India\|\|\|
Global Sources	\|\|\|Electronic Components\|Computer Products\|Trade Show Center
TechInsights	EE Times\|ESM Online\|EE Times JAPAN