Designing to digital wireless specifications using circuit envelope simulation
Author: How-Siang Yap
This paper explains circuit envelope technology and it is contrasted with Spice and harmonic balance simulators, applications of the technology are also demonstrated in the simulation of PLL.
Please login or register with us to view this article>>
Registered already? Login to view complete content.
If you have already registered on the following websites, please log in using your email address and password
eeForum: Demystifying Vietnam What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?