Compact ARM9 MCUs integrate high speed USB OTG

NXP has announced that its latest offerings, LPC3130 and LPC3131, are the industry's most affordable ARM9 MCUs with high speed USB 2.0 OTG.

PMC-Sierra expands WiMAX RFIC solutions

As WiMAX becomes a "global phenomenon," PMC-Sierra Inc. steps up to help solve WiMAX global spectrum hurdles and help OEMs develop cost-effective WiMAX products to enter the market.

NI Video Product Demo

Learn how National Instruments combines Graphical Programming (NI LabVIEW) with NI Technologies (NI Smart Camera, NI CompactRio, NI Compact FieldPoint) to help you increase productivity, reduce costs and smoothen your programming process.

Introduction

Backplanes are vital in communications infrastructure. Here, designers are faced with many pressures: the requirements of high performance, upgraded aps, the increased need for throughput, and rapid time-to-market. Here is an introduction to backplane technology, the first in a series of articles, which will help designers deliver system performance.

Data Conversion

Find out key issues that analog engineers deal in analog front-end (AFE) design while grappling with analog-to-digital converters (ADCs).

Solar power: The next major energy source

Here's a look at the technology that is free from the leash of the oil industry, low in maintenance, high in modularity and scalability, and the only one capable of meeting the long-term energy needs without emitting greenhouse gases.

Rouse future digital input
designs

Modern digital input module designs require high-channel count, small form factor, low-power consumption and high data rates. Conventional designs are unable to keep pace. Instead, use innovative circuit designs such as digital input serializers that exceed requirements and lay the groundwork for future digital input designs.

Uncovering the Cdv/dt shoot-
through

A fast commutation in a half-bridge topology can cause a Cdv/dt shoot through. A current flowing through the gate-drain capacitance can raise the Vgs of a MOSFET and thus obtain a cross conduction into the leg. This article highlights the internal MOSFET parameters affecting this phenomenon.

Soundbars invigorate flat-panel TV audio

Cramming high-quality audio components into the confines of a flat-panel TV simply isn't a feasible solution. The answer is the soundbar, which significantly improves audio experience without the complexity of an entire home theater setup.

Design all-digital audio for HDTVs

The digital lifestyle explosion is driving A/V system integration. Architecture digitization is driving decreasing system cost for CE products.

Achieve good audio quality in portables

Mark Toth, system engineer at Texas Instruments, provides suggestions for good system design and PCB layout practices relevant to the design of any portable system that includes audio playback and/or recording functionality.

1H 08 shows revamp in IC
ranking

A big shakeup in the top 20 semiconductor supplier ranking for 1H 08 has been reported by IC Insights. Although the top four companies stayed put in their spots, there were a number of "movers and shakers" up and down the list.

Solar vendors strive to lower costs amid setbacks

Amid uncertain markets and policies, solar panel makers are gearing up factories with an objective of pulling down costs to a competitive level.

• AMD to Spin Off Plants
• Ford's key-with-a-chip
• Second-tier memory vendors laying off workers
• Scientists develop solar cells with a twist
• Electronics makers'eco-technology boost
• Economists mixed on possibility of technical recession for Singapore
more headlines

IBM opens gates of 300mm fab

Up until recently, IBM Corp. and its secretive chip unit refused to reveal any information about its semiconductor operations

IBM sets up global cloud computing centers

Brazil, India, South Korea and Vietnam are the new homes of IBM's cloud computing centers.

IBM launches 'green' consulting services

IBM has initiated a new "green" consulting service targeted to help customers deliver more eco-friendly products from development and manufacturing through delivery and use to end-of-life reclamation and recycling.

Imagine Cup fuels students' inquisitive minds

Microsoft Corp., through its annual Imagine Cup contest, has transformed the software sector, but more importantly has touched lives of students, providing them opportunities to explore and innovate early.

Analysts: Micron-Qimonda deal in the works

Micron Technology, long rumored to be working toward an acquisition of Qimonda AG's stake in Inotera Memories, may now be on the verge of a deal to acquire more assets of the struggling Infineon Technologies spinoff, according to analysts.

Analyst: Micron plays waiting game in Qimonda takeover

Micron Technology Inc. is playing the waiting game before it buys Qimonda AG, or at least pieces of the troubled DRAM maker, according to an analyst.

Qualcomm mobile chip powers first Android handset

Qualcomm may have secured its place inside the first Android cellphone but analysts believe that stiff competition from rival wireless chip vendors will follow on future handsets running the Google Inc.-backed OS.

Android-powered smart phones ready for launch

Google's Android OS will account for 4 percent of all smart phones sold in the United States during the Q4 08, according to market research group Strategy Analytics.

Dell mum over plans on Limerick facility

Dell Inc. has declined to comment on concerns that it could close its plant in Limerick, Ireland as part of measures to lower manufacturing costs and improve profitability.

Analysts skeptical of NXP survival plan

NXP BV's restructuring plan has left analysts pondering the company's future and dusting off age-old European chip company merger ideas.

Atmel restructuring continues in Nantes

Shortly after it announced 180 job cut at its manufacturing site in Rousset, Atmel Corp. disclosed it will trim 30 jobs from its 250 staff in Nantes, France.