Video buffer promises 'green energy' features

To help makers design energy-efficient CE, TI has launched a flexible four-channel video buffer that it claims uses 57 percent less power.

MEMS accelerometer rolls for automotive, industrial apps

The AIS326DQ meets automotive-industry requirements for non-safety applications such as vehicle alarms, tracking and monitoring, black-box systems, seat controls, navigation support and antenna positioning.

NI Video Product Demo

Learn how National Instruments combines Graphical Programming (NI LabVIEW) with NI Technologies (NI Smart Camera, NI CompactRio, NI Compact FieldPoint) to help you increase productivity, reduce costs and smoothen your programming process.

Noise, Cross-talk, Jitter, Skew, and EMI

This section discusses backplane signal integrity, focusing on the phenomena and effects that can disrupt clean signals and high signal integrity. Enemies of signal integrity include noise, cross-talk, jitter, skew, and EMI. All electronic systems contain some elements of these phenomena. The key to designing for high signal integrity is the reduction of these phenomena below levels that will adversely affect signal quality.

Zigbee

Find out key issues about Zigbee, a standard for embedded application software that has been ratified in late 2004 under IEEE 802.15.4 Wireless Networking Standards.

'Green' energy emerging from two lighting systems

Despite the attention drawn on other sources of energy to increase available power, some measures are targeted to the conservation of energy. Along with "making more," the energy challenge is also aimed at "using less."

Rouse future digital input
designs

Modern digital input module designs require high-channel count, small form factor, low-power consumption and high data rates. Conventional designs are unable to keep pace. Instead, use innovative circuit designs such as digital input serializers that exceed requirements and lay the groundwork for future digital input designs.

Uncovering the Cdv/dt shoot-
through

A fast commutation in a half-bridge topology can cause a Cdv/dt shoot through. A current flowing through the gate-drain capacitance can raise the Vgs of a MOSFET and thus obtain a cross conduction into the leg. This article highlights the internal MOSFET parameters affecting this phenomenon.

Partition multicores for embedded networking

Multicore mania has definitely hit the embedded networking market, but as the dust begins to settle it has become clear that many important architectural details need to be examined closely before decisions are made.

Handling multicore design patterns

Consolidation is a long-standing trend in embedded design.The latest round of this trend is the proliferation of multicore embedded microprocessors.

Multicore future is right now

Great hopes are being pinned on multiprocessor and parallel architecture as the answers for the continuing development of electronics and computing. Most would agree that multicore is the way forward.

1H 08 shows revamp in IC
ranking

A big shakeup in the top 20 semiconductor supplier ranking for 1H 08 has been reported by IC Insights. Although the top four companies stayed put in their spots, there were a number of "movers and shakers" up and down the list.

Semicast: Consumer electronics to achieve steady growth

The market for 32bit/64bit MCUs, embedded microprocessors and general purpose DSPs will show steady and on-going growth despite the current economic uncertainties.

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Memristors transit to reality

HP Labs is attempting to catapult the memristor, the fourth passive circuit element after resistors, capacitors and inductors, into the electronics mainstream.

Cellphones push mobile growth in rural India

It is not the gleaming edifices housing thousands of software engineers nor the bustling cities caught up in perennial traffic jams, but the endless landscapes of 600,000 villages in India that is becoming the next frontier for handset makers to conquer.

Andes facilitates Taiwan SoC design

Driven by strong market demand for portable products, the consumer electronics sector swerves to the Internet-capability route, as touted by Mobile Internet Devices.

TSMC delays high-k offering to 28nm

Taiwan Semiconductor Manufacturing has rolled out its 28nm process and disclosed it will push out its initial high-k/metal-gate offering until 28nm, putting it slightly behind its rivals in Chartered, IBM and Samsung.

IBM 'fab club' details foundry roadmap

IBM Corp.'s "fab club" has outlined its foundry process road map including a 28nm "half-node" technology, and, in some cases, positioned its 32nm offering as a better alternative to 40nm.

Chartered moves to 40nm process and below

Aiming to take the lead in the foundry market, Chartered Semiconductor Manufacturing unveiled its new roadmap, which includes plans to develop and offer a 28nm process possibly by next year.

Analyst: Micron plays waiting game in Qimonda takeover

Micron Technology Inc. is playing the waiting game before it buys Qimonda AG, or at least pieces of the troubled DRAM maker, according to an analyst.

LTE rollout to boost picocell, femtocell markets

A new report from ABI Research forecasts that femtocells and picocells will form an integrated part of the initial rollouts of Long Term Evolution (LTE) networks.

Visa-Nokia solidifies further mobile payment project

Visa Inc. and Nokia will jointly deliver Visa payment and payment-related services, including contactless payments, remote payments, money transfer, alerts and notifications, for Nokia's next-generation handsets.

Unlocked iPhones land in Hong Kong

Apple is offering in Hong Kong a carrier-independent, "unlocked" iPhone that can be used with each customer's wireless operator of choice.

Cleantech investment hit record $2.6B in Q3

The Cleantech Group disclosed that venture investments in North America, Europe, China and India across 158 companies reached $2.6 billion in the third quarter of 2008, a record quarter for clean tech investments.

Ascent Solar, Texsa co-develop PV roofing materials

Ascent Solar Technologies Inc. has singed a definitive cooperation agreement with Texsa S.A. of Spain for the development of new PV roofing products intended for the European marketplace.