• Integrated PMIC enables slimmer LCD monitors (2009-09-30) [ Power Design ]
• 40nm PHY cuts validation, dev't costs in HDDs (2009-09-30) [ Interface Design ]
• Thyristor protectors offer ultralow capacitance (2009-09-30) [ Power Design ]
• Audio converter/driver IC saves board space, BOM costs (2009-09-30) [ Signal Conditioning ]
• Low-cost image sensor tester supports 64Mpixel designs (2009-09-30) [ Design Test ]

• Intel 45nm SoC enters digital TVs (2009-09-30) [ Embedded Systems ]
• Duo to co-develop PV products for U.S. military (2009-09-30) [ Power Design ]
• IBM injects cloud computing to make Dongying 'smarter' (2009-09-30) [ Embedded Systems ]
• General Motors opens science lab in China (2009-09-30) [ Process/Manufacturing ]
• Nanocrystalline silicon to cross $2B mark by 2016 (2009-09-30) [ Process/Manufacturing ]

• Intel plugs optical links to PCs (2009-09-30) [ Interface Design ]
• Update: 10 companies in trouble (2009-09-30) [ EDA ]
• Resistors boast improved load-life stability (2009-09-29) [ Power Design ]
• TCXOs deliver ±0.5ppm frequency stability (2009-09-29) [ Signal Conditioning ]
• MCU packs 2.4GHz radio for wireless sensor nets (2009-09-29) [ Embedded Systems ]

• Compact PWM regulators support Intel mobile CPUs (2009-09-29) [ Power Design ]
• Grandmaster clock delivers precise time over Ethernet (2009-09-29) [ Interface Design ]
• Low-cost 32bit CMOS processor runs at 1.5GHz (2009-09-29) [ Embedded Systems ]
• Premier Farnell increases Web focus (2009-09-29) [ Embedded Systems ]
• Mobile apps drive MEMS mic shipments (2009-09-29) [ Sensor Technology ]

• Brady opens R&D center in Singapore (2009-09-29) [ Process/Manufacturing ]
• Suntech sets new PV cell conversion record (2009-09-29) [ Power Design ]
• Atmel, Global Unichip tie-up on SoC design (2009-09-29) [ EDA ]
• Intel set to transform TV viewing (2009-09-29) [ Optical Electronics and Display ]
• GlobalFoundries adjusts 32nm SOI roadmap (2009-09-29) [ Process/Manufacturing ]

• Crystal oscillators deliver ±50ppm frequency stability (2009-09-28) [ Signal Conditioning ]
• Converter offers programmable input current (2009-09-28) [ Power Design ]
• Power monitors cut need for external amps (2009-09-28) [ Power Design ]
• Mobile processors ups clock speed to 75% (2009-09-28) [ Embedded Systems ]
• Tiny SDRAM handles high-density memory apps (2009-09-28) [ Buffer/Storage ]

• Transceiver radio enables two-way wireless comms (2009-09-28) [ RF/Wireless Design ]
• Survey finds enterprises prefer HSPA over Wi-Fi (2009-09-28) [ RF/Wireless Design ]
• Huawei powers Singapore broaband network (2009-09-28) [ Network Design ]
• ReneSola buys Dynamic Green Energy (2009-09-28) [ Process/Manufacturing ]
• Cisco, Intel, Microsoft help upgrade Kenya education (2009-09-28) [ Embedded Systems ]

• Are you creating a good design? (2009-09-28) [ EDA ]
• Intel sets sight on SoC arena (2009-09-28) [ Process/Manufacturing ]
• LED driver packs temp management control (2009-09-25) [ Optical Electronics and Display ]
• 1,080p HD image sensor tailored for HD CCTVs (2009-09-25) [ Optical Electronics and Display ]
• Tiny ESD devices offer improved reliability (2009-09-25) [ EMI/EMC Design ]

• Low-cost smart card reader boasts NDS stamp (2009-09-25) [ Interface Design ]
• Safety-critical RTOS supports Intel Atom (2009-09-25) [ Embedded Systems ]
• Amp-modulator delivers high-speed modulation (2009-09-25) [ RF/Wireless Design ]
• Mobile VoIP poised to take more markets (2009-09-25) [ RF/Wireless Design ]
• Altech, Seacom forge strategic alliance (2009-09-25) [ Network Design ]

• Sanyo, TomTom partner on in-car navigation (2009-09-25) [ RF/Wireless Design ]
• Malaysia WiMAX network taps Fujitsu mux (2009-09-25) [ Optical Electronics and Display ]
• Samsung gears phase-change RAM for mobiles (2009-09-25) [ Buffer/Storage ]
• Will IC market recovery continue until Q4? (2009-09-25) [ Process/Manufacturing ]
• FPGA design software tailored for 40/100G apps (2009-09-24) [ EDA ]

• USB devices target car navigation, infotainment (2009-09-24) [ Interface Design ]
• Single-chip PMU saves portable board space (2009-09-24) [ Power Design ]
• Power transistor streamlines UHF transmitter design (2009-09-24) [ RF/Wireless Design ]
• Mixers, demodulators suit 4G base stations (2009-09-24) [ RF/Wireless Design ]
• microSD connector offers standard, reverse mounts (2009-09-24) [ Network Design ]

• NXP, Skymeter cooperate on road pricing (2009-09-24) [ RF/Wireless Design ]
• OLED cellphone displays top 178M by 2015 (2009-09-24) [ Optical Electronics and Display ]
• TriQuint, Huawei partner on optical networks (2009-09-24) [ Network Design ]
• IBM touts fastest 32nm SOI dynamic memory prototype (2009-09-24) [ Buffer/Storage ]
• Otellini: Intel to make more SoCs than PC CPUs (2009-09-24) [ Process/Manufacturing ]

• Analysis: Bumpy ride to SuperSpeed USB (2009-09-24) [ Interface Design ]
• Video filter supports 1,080p HD (2009-09-23) [ Signal Conditioning ]
• GPS LNA packs pre-/post-high rejection filters (2009-09-23) [ RF/Wireless Design ]
• MOSFETs make power supplies lighter, cooler (2009-09-23) [ Power Design ]
• FPGA-based dev't board eases prototyping (2009-09-23) [ Programmable Logic ]

• LDOs promise improved system stability (2009-09-23) [ Power Design ]
• 10G transceiver packs diagnostic reporting (2009-09-23) [ RF/Wireless Design ]
• Numonyx beats Spansion in Q2 NOR flash war (2009-09-23) [ Buffer/Storage ]
• Cisco to establish IT training center in Dalian (2009-09-23) [ Process/Manufacturing ]
• Rambus, Kingston co-develop threaded module (2009-09-23) [ Buffer/Storage ]

• Entropic, ViXS work on MoCA storage ref design (2009-09-23) [ Buffer/Storage ]
• TMC signs up ProMOS as manufacturing partner (2009-09-23) [ Process/Manufacturing ]
• Canon litho dreams hit price roadblock (2009-09-23) [ Process/Manufacturing ]
• USB modules cuts need for external power adapter (2009-09-22) [ Interface Design ]
• PXI tester supports full IC logic test (2009-09-22) [ Design Test ]

• VDSL/ADSL chips deliver high-def IPTV (2009-09-22) [ RF/Wireless Design ]
• White LED driver targets LCD backlights (2009-09-22) [ Optical Electronics and Display ]
• Quad-core processor packs dual memory controllers (2009-09-22) [ Embedded Systems ]
• Transceiver supports LTE, WiMAX baseband processors (2009-09-22) [ RF/Wireless Design ]
• Qualcomm injects 3G in China health services (2009-09-22) [ RF/Wireless Design ]

• Aricent, Cavium tie-up on LTE solutions (2009-09-22) [ RF/Wireless Design ]
• Canadian Solar taps ECN metal wrap-through tech (2009-09-22) [ Power Design ]
• Intel takes 80.6% of Q2 microprocessor market (2009-09-22) [ Embedded Systems ]
• ARM, Intel bring rivalry to netbook arena (2009-09-22) [ Embedded Systems ]
• Execs weigh in on SoC design challenges (2009-09-22) [ EDA ]

• ST-Ericsson debuts 65nm TD-HSPA modem chips (2009-09-21) [ RF/Wireless Design ]
• ARM fires up Intel rivalry with Osprey A9 core (2009-09-21) [ Embedded Systems ]
• Step-down controller tailored for Nvidia GPUs (2009-09-21) [ Power Design ]
• External storage apps to drive USB 3.0 adoption (2009-09-21) [ Interface Design ]
• TCL opens LCD integration plant in Guangdong (2009-09-21) [ Process/Manufacturing ]

• Ethernet woes: Bandwidth demands, costs (2009-09-21) [ RF/Wireless Design ]