• LDO achieves high precision, ripple rejection (2009-08-20) [ Power Design ]
• DC/DC converters boast super-wide input range (2009-08-20) [ Power Design ]
• GPS receiver tailored for automotive apps (2009-08-20) [ RF/Wireless Design ]
• Embedded PC geared for mission critical apps (2009-08-20) [ Embedded Systems ]
• Optocouplers pack multiple current transfer ratios (2009-08-20) [ Optical Electronics and Display ]

• Infineon stays on top of power IC market (2009-08-20) [ Power Design ]
• Taiwan injects $1.4B in green energy industry (2009-08-20) [ Optical Electronics and Display ]
• CEVA brings HD audio in Sunplus Blu-ray SoCs (2009-08-20) [ EDA ]
• Virage Logic to buy ARC for $41M (2009-08-20) [ EDA ]
• SanDisk CEO offers NAND forecast (2009-08-20) [ Buffer/Storage ]

• DC/DC converters handle 4.5V to 13.8V input range (2009-08-19) [ Power Design ]
• 20W plug adapters are energy-efficient (2009-08-19) [ Power Design ]
• 2Tbyte hard drive suits 24/7 applications (2009-08-19) [ Buffer/Storage ]
• Single-chip WLAN ICs achieve 150Mbit/s (2009-08-19) [ RF/Wireless Design ]
• Clocks, oscillators offer wide frequency range (2009-08-19) [ RF/Wireless Design ]

• Zinc oxide nanospears boost solar cell efficiency (2009-08-19) [ Process/Manufacturing ]
• Bangladesh gets solar-powered base stations (2009-08-19) [ RF/Wireless Design ]
• NI, SolidWorks co-develop mechatronics prototype tool (2009-08-19) [ EDA ]
• IBM taps DNA scaffolding to build tiny circuit boards (2009-08-19) [ Process/Manufacturing ]
• Trade group remains dubious of Taiwan DRAM plans (2009-08-19) [ Process/Manufacturing ]

• Equalizer suits copper cable assemblies (2009-08-18) [ Signal Conditioning ]
• Tiny Ethernet switches simplify home networking (2009-08-18) [ Network Design ]
• PCIe digitizer packs on-board FPGA (2009-08-18) [ Interface Design ]
• Satellite RF tuner improves STB reception (2009-08-18) [ RF/Wireless Design ]
• Chip-on-glass LCD delivers 30:1 contrast ratio (2009-08-18) [ Optical Electronics and Display ]

• Custom-defined architecture lowers mask fees (2009-08-18) [ EDA ]
• Regulations may hinder UMC's China foundry buyout (2009-08-18) [ Process/Manufacturing ]
• Oversupply to hurt solar market until 2012 (2009-08-18) [ Process/Manufacturing ]
• Navteq expands LBS challenge reach (2009-08-18) [ RF/Wireless Design ]
• Mentor to build design center in Saudi Arabia (2009-08-18) [ EDA ]

• Ferroelectric memories exceed DRAM, flash (2009-08-18) [ Buffer/Storage ]
• Intel Vietnam IC-assembly ramp hits snags (2009-08-18) [ Test & Packaging ]
• Step-down regulators deliver 1.5A current (2009-08-17) [ Power Design ]
• SBC offers low noise, heat dissipation (2009-08-17) [ Embedded Systems ]
• MOSFETs offer very low gate charge (2009-08-17) [ Power Design ]

• 24-channel monitor tailored for automotive switches (2009-08-17) [ Control Design ]
• QVGA TFT direct drive cuts down costs (2009-08-17) [ Optical Electronics and Display ]
• 18W dual-core processors fit thin enclosures (2009-08-17) [ Embedded Systems ]
• Synterra deploys ECI's XDM-3000 MSPP (2009-08-17) [ RF/Wireless Design ]
• Asia Pacific to host 39% of world's cell towers by 2014 (2009-08-17) [ RF/Wireless Design ]

• Altera, Peking U open joint EDA/SOPC Lab (2009-08-17) [ EDA ]
• Intersil, Tower ink power management deal (2009-08-17) [ Process/Manufacturing ]
• Micron: NAND scaling to continue (2009-08-17) [ Buffer/Storage ]
• TSMC invests $50M on solar plans (2009-08-17) [ Power Design ]
• Regulator offers complete DC/DC solution (2009-08-14) [ Power Design ]

• Op amp guarantees operation down to 1.6V (2009-08-14) [ Signal Conditioning ]
• MCUs tout best HID multimedia features (2009-08-14) [ Interface Design ]
• LVDS serializer enables glueless connection (2009-08-14) [ Interface Design ]
• RF modulator tailored for WiMAX, satellite comms (2009-08-14) [ RF/Wireless Design ]
• Nightstand clock gets open-source, Wi-Fi boost (2009-08-14) [ RF/Wireless Design ]

• Q2 microprocessor shipments up 10% (2009-08-14) [ Process/Manufacturing ]
• Toshiba to join Blu-ray Disc Association (2009-08-14) [ Buffer/Storage ]
• Intel licenses Nvidia SLI technology (2009-08-14) [ Embedded Systems ]
• Infineon wireline division named Lantiq (2009-08-14) [ Process/Manufacturing ]
• SoCIP 2009 boosts China chip IP industry (2009-08-14) [ EDA ]

• Not a good time to form a startup? (2009-08-14) [ Process/Manufacturing ]
• Sun's Cornwell: NAND is moving to litho death march (2009-08-14) [ Buffer/Storage ]
• PSE controller enables PoE+ applications (2009-08-13) [ Network Design ]
• CPRI v4.1 IP core supports WiMAX, LTE (2009-08-13) [ EDA ]
• Silicon tuners consume 400mW power (2009-08-13) [ Signal Conditioning ]

• Antennas halve SAR levels in wireless apps (2009-08-13) [ RF/Wireless Design ]
• Digital power SoC achieves 92% DC/DC efficiency (2009-08-13) [ Power Design ]
• LED-backlit LCDs equipped with heat management (2009-08-13) [ Optical Electronics and Display ]
• Large-area LCD shipments up 42% in Q2 (2009-08-13) [ Optical Electronics and Display ]
• VMware acquires SpringSource for $420M (2009-08-13) [ Embedded Systems ]

• Mentor unveils open source plan (2009-08-13) [ Embedded Systems ]
• Innofidei tapes out CMMB IC with Chips&Media IP (2009-08-13) [ Process/Manufacturing ]
• Update: ITC import ban impact remains unclear (2009-08-13) [ Process/Manufacturing ]
• Intel-Micron duo heats up x3 NAND race (2009-08-13) [ Buffer/Storage ]
• VGAs integrate on-board CWD beamformers (2009-08-12) [ Signal Conditioning ]

• AnywhereUSB joins USB, serial-over-IP (2009-08-12) [ Interface Design ]
• VoIP processor packs Fast Ethernet 10/100 MAC (2009-08-12) [ RF/Wireless Design ]
• Voltage reference ICs deliver high accuracy (2009-08-12) [ Power Design ]
• Broadband amps handle 9kHz to 1GHz range (2009-08-12) [ RF/Wireless Design ]
• AMD OpenCL beta targets CPUs, GPUs (2009-08-12) [ EDA ]

• SMSC, Symwave accelerate USB 3.0 growth (2009-08-12) [ Interface Design ]
• Intersil buys analog IC designer (2009-08-12) [ EDA ]
• Japan gets HSPA+ connected (2009-08-12) [ RF/Wireless Design ]
• Smart phones push CE growth in Asia (2009-08-12) [ RF/Wireless Design ]
• IDT goes fabless, signs on TSMC (2009-08-12) [ Process/Manufacturing ]

• Elpida sees red, delays foundry ramp (2009-08-12) [ Process/Manufacturing ]
• DDR3 registered buffer supports four speed grades (2009-08-11) [ Buffer/Storage ]
• RFID antennas withstand harsh environments (2009-08-11) [ RF/Wireless Design ]
• Power supply monitor handles eight supplies (2009-08-11) [ Power Design ]
• DVB-T silicon tuner eases transition to digital TV (2009-08-11) [ Signal Conditioning ]

• UHF transceiver, receiver up radio operating cycle (2009-08-11) [ RF/Wireless Design ]
• Ceramic capacitors achieve 56nF capacitance (2009-08-11) [ Power Design ]
• Are you ready for high-def Android? (2009-08-11) [ Embedded Systems ]
• Mobile data transfer: Speed vs. ease of use (2009-08-11) [ RF/Wireless Design ]
• More pico projectors to enter mobile electronics (2009-08-11) [ Optical Electronics and Display ]

• HKSTP, IBM ink PowerPC IP core tie-up (2009-08-11) [ EDA ]
• Elpida buys Qimonda's graphics memory biz (2009-08-11) [ Buffer/Storage ]
• China boosts fabless startup efforts (2009-08-11) [ Process/Manufacturing ]