• USB 2.0 mux offers >12kV ESD performance (2009-07-31) [ Interface Design ]
• FPGAs are PCIe 2.0-compliant (2009-07-31) [ Programmable Logic ]
• DC/DC converters achieve over 88% efficiency (2009-07-31) [ Power Design ]
• Class-D amps transform cars into concert halls (2009-07-31) [ Signal Conditioning ]
• NV FRAM promises 10-year data retention (2009-07-31) [ Buffer/Storage ]

• MCUs pack improved mid-range 8bit core (2009-07-31) [ Control Design ]
• Oversupply, low demand hit solar market (2009-07-31) [ Process/Manufacturing ]
• ST taps GlobalFoundries for 40nm low-power devices (2009-07-31) [ Process/Manufacturing ]
• Q-Cells, MEMC partner to build solar parks (2009-07-31) [ Process/Manufacturing ]
• Huawei builds LTE lab in Texas (2009-07-31) [ RF/Wireless Design ]

• DAC panel revisits DFM debate (2009-07-31) [ EDA ]
• Intel injects cash in cleantech startups (2009-07-31) [ Power Design ]
• Processor packs GPS for in-car navigation systems (2009-07-30) [ RF/Wireless Design ]
• Integrated front-end IC tailored for Wi-Fi mobile apps (2009-07-30) [ RF/Wireless Design ]
• Yield issues may hurt graphics IC market (2009-07-30) [ Process/Manufacturing ]

• Is EDA getting its fair share in IC market? (2009-07-30) [ EDA ]
• Octal switch allows design flexibility in handsets (2009-07-29) [ Network Design ]
• CMMB receiver IC offers -100dBm sensitivity (2009-07-29) [ RF/Wireless Design ]
• USB 3.0 bridge IC enables 5Gbit/s transfer rate (2009-07-29) [ Interface Design ]
• Buck converter boasts wide input, light load (2009-07-29) [ Power Design ]

• Media processor delivers improved video resolution (2009-07-29) [ Optical Electronics and Display ]
• Camera module covers 90° field angle (2009-07-29) [ Optical Electronics and Display ]
• Pure-play foundry market to contract 25.5% in '09 (2009-07-29) [ Process/Manufacturing ]
• Aeroflex, w2bi work on LTE testing platform (2009-07-29) [ Design Test ]
• Partners develop PCTV minicard for UMPCs (2009-07-29) [ Optical Electronics and Display ]

• Ericsson acquires Nortel LTE, CDMA assets (2009-07-29) [ RF/Wireless Design ]
• FPGA startups struggle to stay in the game (2009-07-29) [ Programmable Logic ]
• Can Taiwan DRAM vendors stay independent? (2009-07-29) [ Buffer/Storage ]
• LNA improves receiver sensitivity for RKE, TPM apps (2009-07-28) [ RF/Wireless Design ]
• Power supplies pack more screw options (2009-07-28) [ Power Design ]

• Protection IC monitors voltage from charger (2009-07-28) [ Power Design ]
• Computer-on-module supports SSDDR SODIMM (2009-07-28) [ Embedded Systems ]
• UMTS duplexers come in miniature form (2009-07-28) [ RF/Wireless Design ]
• ARM core reaches GHz rate (2009-07-28) [ Embedded Systems ]
• June TFT LCD shipments hit 46.7M (2009-07-28) [ Optical Electronics and Display ]

• Digi-Key, Fujitsu ink distribution deal (2009-07-28) [ Sensor Technology ]
• LSI buys NAS solutions provider for $25M (2009-07-28) [ Buffer/Storage ]
• Korea Fair Trade fines Qualcomm $200M (2009-07-28) [ RF/Wireless Design ]
• NXP mulls alternatives for digital TV biz (2009-07-28) [ Optical Electronics and Display ]
• Power to take center stage at DAC (2009-07-28) [ EDA ]

• DC/DC controller guards against voltage transients (2009-07-27) [ Power Design ]
• Multi-UE handles TD-LTE base station testing (2009-07-27) [ Design Test ]
• Battery protection IC delivers fault monitoring (2009-07-27) [ Power Design ]
• MCU packs embedded full-speed USB (2009-07-27) [ Control Design ]
• Enhanced backplane connectors suit industrial apps (2009-07-27) [ Network Design ]

• Samsung ramps up 40nm 2Gbit DDR3 production (2009-07-27) [ Buffer/Storage ]
• NEC helps boost Indonesia IP networks (2009-07-27) [ Network Design ]
• Asia solar firms dominate top 10 PV ranking (2009-07-27) [ Power Design ]
• Agilent, China University team up on LTE testing (2009-07-27) [ Design Test ]
• Ceitec builds Brazil's first chip design center (2009-07-27) [ EDA ]

• Globalfoundries gets new customer on board (2009-07-27) [ Process/Manufacturing ]
• Freescale CEO stays optimistic despite Q2 loss (2009-07-27) [ Process/Manufacturing ]
• Dual LDOs boast miniscule form (2009-07-24) [ Power Design ]
• DC/DC converter minimizes PCB footprint (2009-07-24) [ Power Design ]
• Single-chip LDO tailored for car antennas (2009-07-24) [ Power Design ]

• SPARC processor delivers 90 MIPS @100MHz (2009-07-24) [ Embedded Systems ]
• 2GHz SAW filters tout high sensitivity, low loss (2009-07-24) [ RF/Wireless Design ]
• Video sensor with MIPI suits notebooks (2009-07-24) [ Optical Electronics and Display ]
• AAC opens Singapore R&D center (2009-07-24) [ Process/Manufacturing ]
• AT4 finds LTE test equipment distributor in Japan (2009-07-24) [ Design Test ]

• RF power devices see hope in China, LTE push (2009-07-24) [ RF/Wireless Design ]
• Nokia Siemens powers Vietnam 3G (2009-07-24) [ RF/Wireless Design ]
• Researchers tap lamp-posts for sensor nets (2009-07-24) [ Sensor Technology ]
• Silicon Valley sets sights on Taiwan stock market (2009-07-24) [ Process/Manufacturing ]
• Connector delivers optimum EMI shielding (2009-07-23) [ Network Design ]

• ARM Workbench supports Atmel SAM3U MCUs (2009-07-23) [ EDA ]
• Chips save 50% power in optical transport nets (2009-07-23) [ RF/Wireless Design ]
• Video filter amp packs short-to-battery protection (2009-07-23) [ Signal Conditioning ]
• 100V ceramic capacitors handle automotive apps (2009-07-23) [ Power Design ]
• 'First' 34nm NAND flash SSDs debut (2009-07-23) [ Buffer/Storage ]

• Analyst: LCD TV outsourcing falls short (2009-07-23) [ Optical Electronics and Display ]
• Cadence, Toshiba work on next-gen SoC designs (2009-07-23) [ EDA ]
• Intel finalizes Wind River acquisition (2009-07-23) [ Embedded Systems ]
• NXP, Trusted Logic team to drive NFC adoption (2009-07-23) [ RF/Wireless Design ]
• MEMS equipment to reap $500M by 2012 (2009-07-23) [ Process/Manufacturing ]

• Cisco, Intel help boost smart grids (2009-07-23) [ Embedded Systems ]
• Magnetic sensor ICs deliver open/close detection (2009-07-22) [ Sensor Technology ]
• USB/AC battery chargers ensure fast, safe charging (2009-07-22) [ Power Design ]
• SBC packs advanced connectivity interfaces (2009-07-22) [ Embedded Systems ]
• Battery shunt resistor boasts 100µΩ resistance (2009-07-22) [ Power Design ]

• Real-time clocks save up to 73% board space (2009-07-22) [ Interface Design ]
• Video amplifiers are energy-efficient (2009-07-22) [ Signal Conditioning ]
• Dialog, TridonicAtco open lighting IC dev't center (2009-07-22) [ Process/Manufacturing ]
• Survey finds 121% rise in HSPA user devices (2009-07-22) [ RF/Wireless Design ]
• Report: OLED market to reach $7.1B by 2016 (2009-07-22) [ Optical Electronics and Display ]

• ST, CEA-LETI launch Nano2012 program (2009-07-22) [ Process/Manufacturing ]
• VC investments post 32% growth in Q2 (2009-07-22) [ Process/Manufacturing ]
• Fab tool collaboration: Mission impossible? (2009-07-22) [ Process/Manufacturing ]
• RF module packs built-in 2.4GHz antenna (2009-07-21) [ RF/Wireless Design ]
• LCD driver cuts component count in digicams (2009-07-21) [ Optical Electronics and Display ]

• Integrated PMIC tailored for notebook LCDs (2009-07-21) [ Power Design ]
• Wall adapter meets Energy Star EPS 2.0 spec (2009-07-21) [ Power Design ]
• Platform enables Android performance analysis (2009-07-21) [ EDA ]
• Upconverting mixer handles up to 2.7GHz (2009-07-21) [ RF/Wireless Design ]
• Wi-Fi 802.11n chips to surpass 802.11g by 2010 (2009-07-21) [ RF/Wireless Design ]

• ASESC kicks off Li-ion battery production (2009-07-21) [ Process/Manufacturing ]
• South Korea city turns LEDs on (2009-07-21) [ Optical Electronics and Display ]
• EVG, Applied ink 3D wafer bonding deal (2009-07-21) [ Process/Manufacturing ]
• New York injects $92.5M in R&D chip venture (2009-07-21) [ Process/Manufacturing ]
• Intel exec paints picture of better days (2009-07-21) [ Process/Manufacturing ]