• SRAMs designed for next-gen comms network (2009-07-10) [ Buffer/Storage ]
• 'First' sub-1mΩ 25V MOSFET unveiled (2009-07-10) [ Power Design ]
• Voltage supervisors tout 1.5x accuracy (2009-07-10) [ Power Design ]
• MCUs for inverter control enable energy efficiency (2009-07-10) [ Control Design ]
• Chip powers 'first' RFID-based ticketing scheme (2009-07-10) [ Buffer/Storage ]

• Battery authentication IC uses cryptographic engine (2009-07-10) [ Security Design ]
• Q2 demand growth seen in backlight optical film (2009-07-10) [ Optical Electronics and Display ]
• China, Taiwan say hello to MIPS architecture (2009-07-10) [ Embedded Systems ]
• Platform to provide HPC software to Alatum (2009-07-10) [ Embedded Systems ]
• Ericsson to enable Philippines' mobile broadband net (2009-07-10) [ RF/Wireless Design ]

• Voice over LTE faces deployment issues (2009-07-10) [ RF/Wireless Design ]
• Google concocts PC OS (2009-07-10) [ Embedded Systems ]
• Synthesizer provides <2mrad rms noise (2009-07-09) [ Signal Conditioning ]
• Interface controller offers 'plug-and-play' benefit (2009-07-09) [ Interface Design ]
• Compact 5W resistor suits automotives (2009-07-09) [ Power Design ]

• LDO regulators enable always-on power supplies (2009-07-09) [ Power Design ]
• MicroSD interface filter fits mobile, computing devices (2009-07-09) [ Interface Design ]
• Controller firmware supports Intel SSDs (2009-07-09) [ Buffer/Storage ]
• Electrical motors zoom in on cars (2009-07-09) [ Embedded Systems ]
• Huawei to provide solutions to KACST WiMAX lab (2009-07-09) [ RF/Wireless Design ]

• OKI to acquire Renesas' LED production line (2009-07-09) [ Process/Manufacturing ]
• Duo collaborates to push nanoimprint litho (2009-07-09) [ Process/Manufacturing ]
• Taiwan to boost its clean tech industry (2009-07-09) [ Power Design ]
• Top 10 industry issues (2009-07-09) [ EDA ]
• Cable assemblies suit camera link apps (2009-07-08) [ Interface Design ]

• PWM controllers trim output capacitance (2009-07-08) [ Power Design ]
• Embedded controller tailored for wireless test apps (2009-07-08) [ Embedded Systems ]
• DC/DC converter adds 40mins talk time (2009-07-08) [ Power Design ]
• Watchdog board monitors app program, OS ops (2009-07-08) [ Embedded Systems ]
• DACs enable affordable high-quality audio (2009-07-08) [ Signal Conditioning ]

• Strong growth seen in Asia handset navigation (2009-07-08) [ RF/Wireless Design ]
• TSMC, CEA-Leti team on maskless litho (2009-07-08) [ Process/Manufacturing ]
• Laser enables CRT TV recycling tech (2009-07-08) [ Optical Electronics and Display ]
• Artificial shortage meant to hike prices (2009-07-08) [ Process/Manufacturing ]
• China pushes renewable energy efforts (2009-07-08) [ Power Design ]

• Coming soon: Carbon chips (2009-07-08) [ Process/Manufacturing ]
• GPS receiver touts 30ns timing accuracy (2009-07-07) [ RF/Wireless Design ]
• Upstream amp runs on 1.25W (2009-07-07) [ Signal Conditioning ]
• LED driver delivers high current accuracy (2009-07-07) [ Optical Electronics and Display ]
• Signal generators tailored for RF design verification (2009-07-07) [ Design Test ]

• Compact 20W power supplies suit volume OEMs (2009-07-07) [ Power Design ]
• DSPs pack SATA, uPP support (2009-07-07) [ Digital Signal Processing ]
• Huawei India center gets quality certification (2009-07-07) [ Process/Manufacturing ]
• Sony acquires Epson TFT LCD assets (2009-07-07) [ Optical Electronics and Display ]
• MEMS devices grow, equipment drops (2009-07-07) [ Process/Manufacturing ]

• Comment: Will LTX-Credence survive ATE arena? (2009-07-07) [ Test & Packaging ]
• FGPA startup stops operations, seeks buyer (2009-07-07) [ Programmable Logic ]
• NetLogic-RMI preps for multicore battle (2009-07-07) [ Embedded Systems ]
• Cisco's digital camcorder carries clean design (2009-07-06) [ Embedded Systems ]
• DC/DC converters tout extra wide-input range (2009-07-06) [ Power Design ]

• Quad transceivers claims lowest jitter (2009-07-06) [ Interface Design ]
• 512Kbit serial EEPROMs come in tiny packs (2009-07-06) [ Buffer/Storage ]
• DSA takes high-accuracy vibration measurement (2009-07-06) [ Test & Packaging ]
• DSP kits ease portable medical apps dev't (2009-07-06) [ Digital Signal Processing ]
• Zigbee standard addresses energy harvesting apps (2009-07-06) [ RF/Wireless Design ]

• Wells Fargo, SunPower dip $100M in solar power (2009-07-06) [ Power Design ]
• SUSS MicroTec restructures Asia operations (2009-07-06) [ Process/Manufacturing ]
• Chip ban ripple effect hits OEMs (2009-07-06) [ EDA ]
• Sematech continues 450mm campaign (2009-07-06) [ Process/Manufacturing ]
• GE ventures into organic printed electronics (2009-07-06) [ Process/Manufacturing ]

• Antenna touts higher efficiency in small form (2009-07-03) [ RF/Wireless Design ]
• PD controllers address PoE+ standard (2009-07-03) [ Interface Design ]
• LED drivers promise flexibility, ease-of-use (2009-07-03) [ Optical Electronics and Display ]
• 3W LEDs light up solid-state apps (2009-07-03) [ Optical Electronics and Display ]
• Ultralow-power MCUs suit e-metering apps (2009-07-03) [ Control Design ]

• SoCs get digital photo frames connected (2009-07-03) [ Interface Design ]
• Traffic service market to hit $4.7B by 2014 (2009-07-03) [ RF/Wireless Design ]
• Solar glass supplier invests in Changzhou Trina PV park (2009-07-03) [ Process/Manufacturing ]
• Panavision, Tower team on linear image sensors (2009-07-03) [ Optical Electronics and Display ]
• Merger to bring new era of connectivity, location (2009-07-03) [ RF/Wireless Design ]

• Analyst sees double-digit IC growth in 2H (2009-07-03) [ Process/Manufacturing ]
• Elpida ends partnership with Powerchip (2009-07-03) [ Buffer/Storage ]
• Suntech opens PV module testing plant in China (2009-07-02) [ Design Test ]
• ABI sees picocell boom in 2013 (2009-07-02) [ RF/Wireless Design ]
• Sharp powers Tokai U solar car (2009-07-02) [ Power Design ]

• Chip vendor to outsource test operations in Asia (2009-07-02) [ Process/Manufacturing ]
• Sematech details tips for future IC scaling (2009-07-02) [ Process/Manufacturing ]
• Report: Netbook shipments to hit 59M by 2013 (2009-07-02) [ Embedded Systems ]
• Low-power FPGAs come with security features (2009-07-02) [ Programmable Logic ]
• Panel potentiometers aim at amp, audio apps (2009-07-02) [ Power Design ]

• DC/DC charger minimizes heat, charge time (2009-07-02) [ Power Design ]
• ARM11 processor designed for next-gen CE (2009-07-02) [ Control Design ]
• 32bit MCU delivers industrial reliability (2009-07-01) [ Control Design ]
• 16-/18bit SoCs handle high-speed data acquisition (2009-07-01) [ Signal Conditioning ]
• MEMS oscillators set frequencies (2009-07-01) [ Sensor Technology ]

• Protection IC tailored for power sourcing equipments (2009-07-01) [ Power Design ]
• 275W power supplies geared for medical apps (2009-07-01) [ Power Design ]
• Quartz MEMS paint pressure sensors green (2009-07-01) [ Sensor Technology ]
• Mobile banking kicks off in Manila (2009-07-01) [ RF/Wireless Design ]
• Huawei opens LTE lab in Tokyo (2009-07-01) [ Design Test ]

• Intel-Nokia deal brings mobile, PC, CE convergence closer (2009-07-01) [ RF/Wireless Design ]
• Road user charging piloted in Eindhoven (2009-07-01) [ RF/Wireless Design ]
• MEMS foundry arena gets more crowded (2009-07-01) [ Process/Manufacturing ]
• Memory vendors kick off NAND scaling race (2009-07-01) [ Buffer/Storage ]