• Battery chargers save cost, space (2009-06-19) [ Power Design ]
• Eighth-brick DC/DC converter delivers up to 240W (2009-06-19) [ Power Design ]
• Space-flight FPGAs get performance boost (2009-06-19) [ Programmable Logic ]
• Router provides 400Gbit/s per slot (2009-06-19) [ Network Design ]
• IDC: APAC base stations to hit 3M by 2012 (2009-06-19) [ RF/Wireless Design ]

• Opinion: Welcome back design innovation (2009-06-19) [ EDA ]
• TSMC claims first 28nm SRAM cell (2009-06-19) [ Process/Manufacturing ]
• New Q-Cells solar site rises in Malaysia (2009-06-19) [ Process/Manufacturing ]
• Single board computer consumes only 5W (2009-06-18) [ Embedded Systems ]
• FRAM provides up to 45 years data retention (2009-06-18) [ Buffer/Storage ]

• Power amp fit Wi-Fi, WiMAX apps (2009-06-18) [ RF/Wireless Design ]
• DisplayPort controller drives multiple monitors (2009-06-18) [ Optical Electronics and Display ]
• DC/DC converter delivers accurate voltage reference (2009-06-18) [ Power Design ]
• TV IC shipments slide to 30.8M units in Q1 (2009-06-18) [ Optical Electronics and Display ]
• Firms ally to boost Singapore mobile comms industry (2009-06-18) [ RF/Wireless Design ]

• Digi ventures into M2M with MobiApps asset acquisition (2009-06-18) [ RF/Wireless Design ]
• Globalfoundries touts 22nm high-k advance (2009-06-18) [ Process/Manufacturing ]
• Equipment cost to hinder Moore's Law in 2014 (2009-06-18) [ Process/Manufacturing ]
• Stickers offer way to stretchable electronics (2009-06-18) [ Process/Manufacturing ]
• Alliance pushes HD spec for surveillance apps (2009-06-18) [ Optical Electronics and Display ]

• SiGe mixer tailored for 3G/4G base stations (2009-06-17) [ RF/Wireless Design ]
• Filter connectors exceed 1,000 thermal shock cycles (2009-06-17) [ Network Design ]
• RF transceiver saves cost, space in 3G handsets (2009-06-17) [ RF/Wireless Design ]
• Hi-res digipots pack I²C, SPI connectivity (2009-06-17) [ Power Design ]
• Programmable clock generators simplify device testing (2009-06-17) [ Interface Design ]

• Data converters support JEDEC JESD204A interface (2009-06-17) [ Signal Conditioning ]
• Cogwheel sensor provides precise signal (2009-06-17) [ Sensor Technology ]
• Apps modules roll for multicore processors (2009-06-17) [ Embedded Systems ]
• APAC network security market to grow 6.5% in '09 (2009-06-17) [ Security Design ]
• Huawei, Etisalat build application center in Abu Dhabi (2009-06-17) [ RF/Wireless Design ]

• Man Yue, Tsinghua U extend capacitor collaboration (2009-06-17) [ Buffer/Storage ]
• Pacnet improves network connectivity in Vietnam (2009-06-17) [ Network Design ]
• Rambus, EC to settle patent spat (2009-06-17) [ Buffer/Storage ]
• Touchscreens target PC market (2009-06-17) [ Sensor Technology ]
• New TSMC CEO eyes LED, solar markets (2009-06-17) [ Process/Manufacturing ]

• Analysis: SiRF's ticket to survival (2009-06-17) [ RF/Wireless Design ]
• Storage system delivers high availability, reliability (2009-06-16) [ Buffer/Storage ]
• Switches/LNAs target mobile Wi-Fi market (2009-06-16) [ RF/Wireless Design ]
• MEMS oscillators tout ±25ppm frequency stability (2009-06-16) [ Sensor Technology ]
• ASSP improves HD image, video quality (2009-06-16) [ Optical Electronics and Display ]

• Two-stage LNAs pack high linearity (2009-06-16) [ RF/Wireless Design ]
• LEDs shine bright in notebooks (2009-06-16) [ Optical Electronics and Display ]
• Intel, Globe roll out WiMAX in the Philippines (2009-06-16) [ RF/Wireless Design ]
• IBM builds rail innovation center in China (2009-06-16) [ Sensor Technology ]
• Motorola boosts WiMAX services in Saudi Arabia (2009-06-16) [ RF/Wireless Design ]

• Intel, TSMC to tap ASML's EUV litho tool (2009-06-16) [ Process/Manufacturing ]
• Top 7 trends in bleak IC market (2009-06-16) [ Process/Manufacturing ]
• MagnaChip files for insolvency (2009-06-16) [ Process/Manufacturing ]
• Overvoltage protectors pack USB charger detection (2009-06-15) [ Power Design ]
• MEMS accelerometer fits ultraslim designs (2009-06-15) [ Sensor Technology ]

• Battery charger controllers require no blocking diode (2009-06-15) [ Power Design ]
• Inductive-touch AFE trims design time, cost (2009-06-15) [ Sensor Technology ]
• Wi-Fi, LAN modules offer increased design flexibility (2009-06-15) [ RF/Wireless Design ]
• ST-Ericsson, Samsung boost China mobile broadband (2009-06-15) [ RF/Wireless Design ]
• Netbooks, UMPCs drive next-gen mobile computing (2009-06-15) [ RF/Wireless Design ]

• Freescale won't go fabless despite downturn (2009-06-15) [ Process/Manufacturing ]
• TSMC weighs in on e-beam, EUV litho (2009-06-15) [ Process/Manufacturing ]
• Top 10 electronics blunders (2009-06-15) [ Process/Manufacturing ]
• Micro DC/DC converters come with integrated coil (2009-06-12) [ Power Design ]
• Integrated receiver subsystem trims design time (2009-06-12) [ RF/Wireless Design ]

• Passive mixer tailored for UHF-900MHz devices (2009-06-12) [ RF/Wireless Design ]
• 0.18µm foundry solution targets Hall sensors (2009-06-12) [ Process/Manufacturing ]
• Microwatt sensors suit energy-scavenging apps (2009-06-12) [ Sensor Technology ]
• DSPs promise cost, power savings (2009-06-12) [ Digital Signal Processing ]
• Mobile WiMAX SoC packs network processor (2009-06-12) [ RF/Wireless Design ]

• Video decoder consumes less than 200mW (2009-06-12) [ Signal Conditioning ]
• Don't kiss UWB goodbye (2009-06-12) [ RF/Wireless Design ]
• Rambus four drops patent claims vs. Nvidia (2009-06-12) [ Buffer/Storage ]
• T-Mobile taps R&S systems for mobile network testing (2009-06-12) [ Design Test ]
• UMC shareholders okay He Jian acquisition (2009-06-12) [ Process/Manufacturing ]

• Portuguese investors buy Qimonda solar stake (2009-06-12) [ Power Design ]
• Opinion: Infineon has bigger problems than relocations (2009-06-12) [ Process/Manufacturing ]
• Judge revives Samsung-Spansion patent feud (2009-06-12) [ Buffer/Storage ]
• Bigger 300mm plants to boost fab capex in 2010 (2009-06-12) [ Process/Manufacturing ]
• Detect switches tailored for portable medical apps (2009-06-11) [ Network Design ]

• Rotary sensors promise high accuracy, reliability (2009-06-11) [ Sensor Technology ]
• Single-chip WLAN solution supports up to 72Mbit/s (2009-06-11) [ RF/Wireless Design ]
• Power amps simplify 3G handset design (2009-06-11) [ RF/Wireless Design ]
• Car navigation SoC handles higher-speed graphics (2009-06-11) [ Embedded Systems ]
• Sub-GHz transceiver radio suits low-power wireless apps (2009-06-11) [ RF/Wireless Design ]

• GaN HEMT amplifier claims record efficiency (2009-06-11) [ Signal Conditioning ]
• PoE power SoC packs 2kV isolation (2009-06-11) [ Network Design ]
• u-blox gets China handsets GPS-enabled (2009-06-11) [ RF/Wireless Design ]
• Infineon forms power module JV in South Korea (2009-06-11) [ Power Design ]
• WiMAX patent alliance welcomes new members (2009-06-11) [ RF/Wireless Design ]

• iSuppli: Intel MPU shares slide in Q1 (2009-06-11) [ Embedded Systems ]
• ST-Ericsson sets sights at China, U.S. markets (2009-06-11) [ RF/Wireless Design ]
• IC growth seen only in wireless-related segments (2009-06-11) [ RF/Wireless Design ]
• Globalfoundries details NY fab plans (2009-06-11) [ Process/Manufacturing ]
• Analysts, vendors tip slow IC improvement (2009-06-11) [ Process/Manufacturing ]