• Oscillators deliver ±150ppm frequency stability (2009-06-10) [ RF/Wireless Design ]
• PMIC suits low-power portable apps (2009-06-10) [ Power Design ]
• Four-channel LED driver ensures uniform brightness (2009-06-10) [ Optical Electronics and Display ]
• PSoC devices pack improved analog, digital performance (2009-06-10) [ Control Design ]
• EMI filters feature touch safe block connectors (2009-06-10) [ EMI/EMC Design ]

• Zigbee SoC tailored for industrial apps (2009-06-10) [ RF/Wireless Design ]
• PCIe 3.0 cores support up to 16 lanes (2009-06-10) [ EDA ]
• Palm Pre teardown intros new multitouch controller (2009-06-10) [ Optical Electronics and Display ]
• SID helps boost FPD industry in Latin America (2009-06-10) [ Optical Electronics and Display ]
• Freescale opens new tech center in Mexico (2009-06-10) [ EDA ]

• Taiwan muses on allowing 12-inch fabs in China (2009-06-10) [ Process/Manufacturing ]
• Yingli Green powers 13MW Czech solar plant (2009-06-10) [ Power Design ]
• Weighing in on the Intel-Wind River deal (2009-06-10) [ Embedded Systems ]
• Bluetooth, Zigbee bag Health Alliance endorsement (2009-06-10) [ RF/Wireless Design ]
• Looking for the next Silicon Valley (2009-06-10) [ Process/Manufacturing ]

• Foundry growth seen in Q2 as shortages loom (2009-06-10) [ Process/Manufacturing ]
• Op amps combine high precision, low noise (2009-06-09) [ Signal Conditioning ]
• IP-verified DDR3 runs at 1600Mbit/s (2009-06-09) [ Buffer/Storage ]
• Buck regulator delivers fast transient response (2009-06-09) [ Power Design ]
• MEMS gyros promise stability in wide temp range (2009-06-09) [ Sensor Technology ]

• Memory model generator trims verification time (2009-06-09) [ Design Test ]
• HSPA module tailored for netbooks (2009-06-09) [ RF/Wireless Design ]
• Low-power RF chip mimics inner ear (2009-06-09) [ RF/Wireless Design ]
• LEDs handle up to 300W projection apps (2009-06-09) [ Optical Electronics and Display ]
• Wireless groups team to develop WiMAX femtocell spec (2009-06-09) [ RF/Wireless Design ]

• NetLogic, RMI enter merger deal (2009-06-09) [ Embedded Systems ]
• Juniper, Nokia Siemens ink Carrier Ethernet JV (2009-06-09) [ Network Design ]
• Intel helps boost WiMAX adoption in Japan (2009-06-09) [ RF/Wireless Design ]
• Three alternatives challenge HDMI (2009-06-09) [ Interface Design ]
• Analysis: How CEVA defies economic crunch (2009-06-09) [ EDA ]

• Coming soon: Flexible memories (2009-06-09) [ Buffer/Storage ]
• Analysts, execs, editors see double-digit drop in '09 (2009-06-09) [ Process/Manufacturing ]
• Dev't kit simplifies high-speed serial interface designs (2009-06-08) [ Programmable Logic ]
• Multimode tuner cuts space, cost in mobile TVs (2009-06-08) [ RF/Wireless Design ]
• DC/DC converters tailored for military apps (2009-06-08) [ Power Design ]

• Power switches include built-in surge protection (2009-06-08) [ Power Design ]
• Long lead thermistors offer 33 resistance values (2009-06-08) [ Power Design ]
• Bluetooth device boasts faster user interface (2009-06-08) [ RF/Wireless Design ]
• PCIe board achieves up to 200MBps throughput (2009-06-08) [ Interface Design ]
• USB sensors pack built-in external trigger circuitry (2009-06-08) [ Sensor Technology ]

• Skyworks buys power amplifier supplier (2009-06-08) [ Signal Conditioning ]
• Mirasol display fab rises in Taiwan (2009-06-08) [ Optical Electronics and Display ]
• Cree inks transistor supply deal with Korea firm (2009-06-08) [ Process/Manufacturing ]
• CDMA2000 boosts 3G services in China (2009-06-08) [ RF/Wireless Design ]
• Cadence CEO sees opportunities in fabless trend (2009-06-08) [ EDA ]

• WiMAX interoperability, roaming tests pick up (2009-06-08) [ RF/Wireless Design ]
• ASML details EUV litho production plan (2009-06-08) [ Process/Manufacturing ]
• Intel ventures on embedded apps with Wind River deal (2009-06-08) [ Embedded Systems ]
• Power amps extend talk time in UMTS handsets (2009-06-05) [ Signal Conditioning ]
• Control ICs ensure safe battery charging (2009-06-05) [ Power Design ]

• Op amps equipped with power-saving features (2009-06-05) [ Signal Conditioning ]
• LED solution tailored large-panel TVs (2009-06-05) [ Optical Electronics and Display ]
• Lattice rolls industrial temp-qualified FPGAs (2009-06-05) [ Programmable Logic ]
• Low ESR capacitors deliver high peak voltage (2009-06-05) [ Power Design ]
• NVRAM system achieves up to 200MBps peak transfer (2009-06-05) [ Buffer/Storage ]

• LCDs handle extreme temperatures (2009-06-05) [ Optical Electronics and Display ]
• Analyst sees 27% drop in PV inverter market in '09 (2009-06-05) [ Power Design ]
• Firms demo netbook with free-to-air TV at Computex (2009-06-05) [ Embedded Systems ]
• SATA 3.0 promises 'lightning-fast' transfer speed (2009-06-05) [ Buffer/Storage ]
• IMEC, TSMC expand research collaboration (2009-06-05) [ Process/Manufacturing ]

• Medical, home net apps to propel mobile growth (2009-06-05) [ RF/Wireless Design ]
• De Geus: Downturn to change IC design (2009-06-05) [ EDA ]
• Vendors fuel netbook hype at Computex (2009-06-05) [ Buffer/Storage ]
• Ex-Intel Fellow: AMD struggling to stay in the game (2009-06-05) [ Process/Manufacturing ]
• Power optimizers target solar PV systems (2009-06-04) [ Power Design ]

• High-density FPGA handles 40G/100G apps (2009-06-04) [ Programmable Logic ]
• High-speed SSDs tout enhanced netbook performance (2009-06-04) [ Buffer/Storage ]
• Intel intros eight-core Xeon processor (2009-06-04) [ Embedded Systems ]
• RF front-end ICs tailored for Bluetooth, Zigbee apps (2009-06-04) [ RF/Wireless Design ]
• 'Smallest' 8bit MCU offers improved design flexibility (2009-06-04) [ Control Design ]

• Compact computer delivers flexible I/O connectivity (2009-06-04) [ Embedded Systems ]
• Embedded controller consumes 45mA at 3.3V (2009-06-04) [ Control Design ]
• Continued growth seen in Taiwan WiMAX CPE market (2009-06-04) [ RF/Wireless Design ]
• China to enjoy HD TV broadcast in portable apps (2009-06-04) [ RF/Wireless Design ]
• Dongbu HiTek taps Kilopass' NVM solution (2009-06-04) [ Buffer/Storage ]

• Bosch opens ECU production facility in India (2009-06-04) [ Control Design ]
• Media phone buzz hits Computex (2009-06-04) [ RF/Wireless Design ]
• Team touts advance in flexible OLED displays (2009-06-04) [ Optical Electronics and Display ]
• MEMS find place GPS, mobile apps (2009-06-04) [ Sensor Technology ]
• Intel details ultrathin roadmap (2009-06-04) [ Embedded Systems ]

• DVB-T chip promises high quality at low power (2009-06-03) [ RF/Wireless Design ]
• Step-down regulator lowers output capacitance (2009-06-03) [ Power Design ]
• Pin diode switches handle up to 4GHz (2009-06-03) [ Network Design ]
• WiMAX chips target handheld mobile apps (2009-06-03) [ RF/Wireless Design ]
• FPGA platform supports up to 4GByte DDR3 (2009-06-03) [ Design Test ]

• Cortex-M3 MCU packs high speed USB (2009-06-03) [ Embedded Systems ]
• PoE controller delivers up to 100W (2009-06-03) [ Power Design ]
• AMD intros six-core server processors (2009-06-03) [ Embedded Systems ]
• CDMA connects more than 100M in India (2009-06-03) [ RF/Wireless Design ]
• Micron spins off Aptina Imaging (2009-06-03) [ Optical Electronics and Display ]

• Trio to work on N-type solar cells (2009-06-03) [ Power Design ]
• Singapore's M1 preps for high-speed mobile broadband (2009-06-03) [ RF/Wireless Design ]
• Smartbooks to take center stage at Computex (2009-06-03) [ Embedded Systems ]
• Green memory: key to driving down data center power (2009-06-03) [ Buffer/Storage ]
• Taiwan firm buys e-paper supplier for $215M (2009-06-03) [ Optical Electronics and Display ]

• Analysis: AMD's road to fabless operations (2009-06-03) [ Process/Manufacturing ]
• Connectors suit medical imaging apps (2009-06-02) [ Network Design ]
• DC/DC converters maximize battery life (2009-06-02) [ Power Design ]
• Sonoscan to debut operator-free wafer inspection system (2009-06-02) [ Process/Manufacturing ]
• RF transceivers target smart grid, home automation (2009-06-02) [ RF/Wireless Design ]

• Power modules fit solar, UPS systems (2009-06-02) [ Power Design ]
• Power block tailored for FPGAs, processors (2009-06-02) [ Power Design ]
• Power modulator simplifies base station design (2009-06-02) [ RF/Wireless Design ]
• Network processors run up to 1.4GHz (2009-06-02) [ Embedded Systems ]
• Report: Taiwan investment to boost China IC industry (2009-06-02) [ Process/Manufacturing ]

• UNESCO, Sun Micro team to drive open source tech (2009-06-02) [ Embedded Systems ]
• Malaysia 2G network gets an upgrade (2009-06-02) [ RF/Wireless Design ]
• Inkjet tech enables big-screen OLED TVs (2009-06-02) [ Optical Electronics and Display ]
• Nanocrystals key to sub-32nm optical litho (2009-06-02) [ Process/Manufacturing ]
• India CEO sees paradigm shift in automotive industry (2009-06-02) [ Process/Manufacturing ]

• Chartered Semi denies buyout rumors (2009-06-02) [ Process/Manufacturing ]
• Opinion: 10 IC companies in danger (2009-06-02) [ Process/Manufacturing ]
• Converter IC links DisplayPort to DTVs (2009-06-01) [ Interface Design ]
• Solid tantalum capacitor fit for harsh setups (2009-06-01) [ Power Design ]
• Voltage translators achieve 100Mbit/s data rate (2009-06-01) [ Interface Design ]

• 3D hall sensor operates at higher temp range (2009-06-01) [ Sensor Technology ]
• NXP Cortex-M3 MCUs tout lowest power (2009-06-01) [ Embedded Systems ]
• Incremental encoders boast long operating life (2009-06-01) [ Sensor Technology ]
• Accelerometers to top MEMS market by 2013 (2009-06-01) [ Sensor Technology ]
• CEVA, mimoOn team on LTE baseband solution (2009-06-01) [ RF/Wireless Design ]

• MPI opens test service lab in Taiwan (2009-06-01) [ Design Test ]
• Nanosensors spot bridge, aircraft defects (2009-06-01) [ Sensor Technology ]
• SanDisk, Samsung ink flash license, supply deals (2009-06-01) [ Buffer/Storage ]
• Buzz: Qimonda loses potential China investor (2009-06-01) [ Buffer/Storage ]