• Boost converter packs dual half-bridge switches (2009-05-29) [ Power Design ]
• 0.8mm-thick solar module targets mobile devices (2009-05-29) [ Power Design ]
• Integrated EMI filter handles high-speed data line apps (2009-05-29) [ EMI/EMC Design ]
• 8-channel DACs combine high accuracy, low power (2009-05-29) [ Signal Conditioning ]
• E-beam litho tool tailored for 8nm (2009-05-29) [ Process/Manufacturing ]

• Slide switches achieve up to 1000,000 cycles (2009-05-29) [ Network Design ]
• Low-power 14bit capacitive sensor rolls (2009-05-29) [ Sensor Technology ]
• DC/DC converters extend battery life in portable apps (2009-05-29) [ Power Design ]
• India wireless test market to enjoy steady growth (2009-05-29) [ Design Test ]
• Hynix to pay bond for infringing Rambus patents (2009-05-29) [ Buffer/Storage ]

• Atmel, ARM fortify strategic partnership (2009-05-29) [ Embedded Systems ]
• Qualcomm licenses 3G modem to China's Gionee (2009-05-29) [ RF/Wireless Design ]
• Comment: TI should revamp MCU strategy (2009-05-29) [ Embedded Systems ]
• Team sets solar cell record efficiency (2009-05-29) [ Power Design ]
• Nikon plans 1,000 layoffs in fab tool unit (2009-05-29) [ Process/Manufacturing ]

• Memory tech can store data up to 1B years (2009-05-29) [ Buffer/Storage ]
• Re-drivers support high-speed serial interfaces (2009-05-28) [ Interface Design ]
• SSDs fit for rugged environments (2009-05-28) [ Buffer/Storage ]
• WLAN ref design enables 300Mbit/s throughput (2009-05-28) [ EDA ]
• Triple-mode PC TV tuner comes in half-mini card (2009-05-28) [ Signal Conditioning ]

• Shock, vibration sensors roll for industrial monitoring (2009-05-28) [ Sensor Technology ]
• DAC/amp IC cuts cost, improves audio performance (2009-05-28) [ Signal Conditioning ]
• Spectrum analyzer allows quick signal detection (2009-05-28) [ Design Test ]
• Capacitive touchscreens tailored for netbooks (2009-05-28) [ Optical Electronics and Display ]
• Taiwan basic handset shipments hit 10.21M in Q1 (2009-05-28) [ RF/Wireless Design ]

• PV modules to power hybrid aerial vehicle (2009-05-28) [ Power Design ]
• IBM, Bulgarian gov't join forces on nanotechnology (2009-05-28) [ Process/Manufacturing ]
• China Mobile, ST-Ericsson team on TD-SCDMA (2009-05-28) [ RF/Wireless Design ]
• Microsoft continues support for Russia market (2009-05-28) [ Process/Manufacturing ]
• China Optics Valley ready for broader terrain (2009-05-28) [ Process/Manufacturing ]

• Long wait for IC recovery (2009-05-28) [ Process/Manufacturing ]
• Rambus details DDR4 DRAM roadmap (2009-05-28) [ Buffer/Storage ]
• Mega PoE midspans provide up to 95W per port (2009-05-27) [ Network Design ]
• 3G router powers high-bandwidth apps in harsh setups (2009-05-27) [ RF/Wireless Design ]
• Signal generator geared for TV quality testing (2009-05-27) [ Design Test ]

• HDMI transmitters fit ultraslim portable apps (2009-05-27) [ Interface Design ]
• A peek inside Microsoft's BlueTrack mouse (2009-05-27) [ Optical Electronics and Display ]
• IGBTs pack fast switching, low conduction loss (2009-05-27) [ Power Design ]
• Junction box enables automated PV modules (2009-05-27) [ Network Design ]
• SPI multi I/O flash achieves up to 40MBps (2009-05-27) [ Buffer/Storage ]

• Small/medium LCD prices fall despite demand surge (2009-05-27) [ Optical Electronics and Display ]
• Cypress sets up new PSoC lab in India college (2009-05-27) [ EDA ]
• ASTRI, Credo co-develop high-speed comm ICs (2009-05-27) [ RF/Wireless Design ]
• Japan 3G subscribers exceed 100M (2009-05-27) [ RF/Wireless Design ]
• Researchers tout air-powered batteries (2009-05-27) [ Power Design ]

• Buzz: Huawei to open manufacturing plants in Hungary (2009-05-27) [ Process/Manufacturing ]
• Long-distance link face-off: fiber vs. satellite (2009-05-27) [ RF/Wireless Design ]
• ITC favors Tessera in packaging patent suit (2009-05-27) [ EDA ]
• LTE: A well-designed mobile OFDMA IP solution (2009-05-26) [ RF/Wireless Design ]
• High-voltage amp fits piezoelectrics, MEMS apps (2009-05-26) [ Signal Conditioning ]

• DC/DC controller drives n-channel MOSFET (2009-05-26) [ Power Design ]
• GPS solution tailored for outdoor navigation apps (2009-05-26) [ RF/Wireless Design ]
• HS-CAN transceivers handle 1Mbit/s apps (2009-05-26) [ Network Design ]
• Rotary encoder withstands rough environments (2009-05-26) [ Sensor Technology ]
• PoE midspan delivers improved power efficiency (2009-05-26) [ Network Design ]

• DAC/amp enhances audio quality in mobile apps (2009-05-26) [ Signal Conditioning ]
• PMC module packs on-board Xilinx FPGA (2009-05-26) [ Interface Design ]
• Netbooks to propel mobile broadband uptake (2009-05-26) [ RF/Wireless Design ]
• Jordan adopts South Korea's WiBro tech (2009-05-26) [ RF/Wireless Design ]
• National, Solmetric co-develop PV software tool (2009-05-26) [ Design Test ]

• IBM boosts Vietnam IT with new innovation center (2009-05-26) [ Process/Manufacturing ]
• Transformation optics improve invisibility cloak area (2009-05-26) [ Optical Electronics and Display ]
• Infineon, India team report ESD advance (2009-05-26) [ EMI/EMC Design ]
• Researchers alert of transistor model glitch (2009-05-26) [ Process/Manufacturing ]
• Micron seeks funds to enter LED, solar markets (2009-05-26) [ Optical Electronics and Display ]

• Wireless solution simplifies smart grid connections (2009-05-25) [ RF/Wireless Design ]
• Multifunction films packs high brightness, power efficiency (2009-05-25) [ Optical Electronics and Display ]
• HSPA+ femtocell chip supports 8 users (2009-05-25) [ RF/Wireless Design ]
• Power amp geared for mobile WiMAX systems (2009-05-25) [ RF/Wireless Design ]
• Multi-I/O SPI flash enables faster data transmission (2009-05-25) [ Buffer/Storage ]

• Software tools speed up design process (2009-05-25) [ EDA ]
• Energy monitoring IC fits home, enterprise apps (2009-05-25) [ Power Design ]
• DC/DC converters offer extended voltage range (2009-05-25) [ Power Design ]
• e-Paper market to reach $2.1B by 2015 (2009-05-25) [ Optical Electronics and Display ]
• Xilinx helps boost embedded system design at Beijing U (2009-05-25) [ EDA ]

• Vietnam applies RFID to ensure food export safety (2009-05-25) [ RF/Wireless Design ]
• T-RAM, Globalfoundries tie-up on embedded memory (2009-05-25) [ Buffer/Storage ]
• Ethernet Alliance pushes for 40G spec (2009-05-25) [ Network Design ]
• Solar panels to dim and shine (2009-05-25) [ Power Design ]
• Downturn puts fab tool market in the red (2009-05-25) [ Process/Manufacturing ]

• ST ready to shed off old image (2009-05-25) [ Process/Manufacturing ]
• Transceiver PMC module handles wideband signals (2009-05-22) [ RF/Wireless Design ]
• Server fan delivers high airflow, static pressure (2009-05-22) [ Embedded Systems ]
• Gaming sensor boasts high-speed motion detection (2009-05-22) [ Sensor Technology ]
• Current regulators drive LED lighting apps (2009-05-22) [ Optical Electronics and Display ]

• Dual switches pack audio click, pop elimination (2009-05-22) [ Network Design ]
• Computing boards are Atom-equipped (2009-05-22) [ Embedded Systems ]
• Software cuts engineering time, prototype iterations (2009-05-22) [ EDA ]
• USB isolator IC tailored for medical apps (2009-05-22) [ Interface Design ]
• Touchscreens to become a $9B-market by 2015 (2009-05-22) [ Sensor Technology ]

• Saudi Arabia 3G network gets an upgrade (2009-05-22) [ RF/Wireless Design ]
• 3G fever to hit Vietnam (2009-05-22) [ RF/Wireless Design ]
• Toshiba to stop handset production in Japan (2009-05-22) [ Process/Manufacturing ]
• Otellini defends Intel against EC ruling (2009-05-22) [ Embedded Systems ]
• Electronics counterfeiting goes online (2009-05-22) [ EDA ]

• Li-ion battery tech to make or break Chevy Volt (2009-05-22) [ Power Design ]
• Micron ventures into microdisplay panels (2009-05-22) [ Optical Electronics and Display ]
• DACs trim design time for automation apps (2009-05-21) [ Signal Conditioning ]
• PoE controller fits 13/26W powered devices (2009-05-21) [ Power Design ]
• I²C digipots deliver increased accuracy, reliability (2009-05-21) [ Signal Conditioning ]

• PWM controllers up design flexibility of HB LEDs (2009-05-21) [ Optical Electronics and Display ]
• Highly-integrated power module simplifies design (2009-05-21) [ Power Design ]
• RF transceivers cut power, BOM costs in 4G apps (2009-05-21) [ RF/Wireless Design ]
• FRAM state savers tailored for automotive apps (2009-05-21) [ Buffer/Storage ]
• Host controller handles SuperSpeed USB 3.0 (2009-05-21) [ Interface Design ]

• Falling prices drive LCD TV shipments in Q1 (2009-05-21) [ Optical Electronics and Display ]
• IC equipment facility rises in Saigon Hi-Tech Park (2009-05-21) [ Process/Manufacturing ]
• South Korea to invest $3.4B on green IT (2009-05-21) [ Process/Manufacturing ]
• NFC welcomes two new specs (2009-05-21) [ RF/Wireless Design ]
• Energy harvesting: ready for prime time? (2009-05-21) [ Power Design ]

• Nikon denies EUV litho program delay (2009-05-21) [ Process/Manufacturing ]
• What font do you want in your handset? (2009-05-21) [ Embedded Systems ]
• AnalogicTech stays 'fabless without foundries' (2009-05-21) [ Process/Manufacturing ]