• Low-cost transceiver FPGAs fit 3Gbit/s apps (2009-05-20) [ Programmable Logic ]
• Pushbutton switches withstand harsh setups (2009-05-20) [ Interface Design ]
• DC/DC converters pack 258MHz voltage-error amp (2009-05-20) [ Power Design ]
• Digipot integrates I²C interface, EEPROM (2009-05-20) [ Power Design ]
• Long-range wireless module operates at 434MHz (2009-05-20) [ RF/Wireless Design ]

• MEMS/IC environment handles co-simulation, co-verification (2009-05-20) [ EDA ]
• Op amp architecture aims for zero offset voltage (2009-05-20) [ Signal Conditioning ]
• Tektronix rolls low-cost mixed-signal oscilloscopes (2009-05-20) [ Design Test ]
• ST revenues up in flat car infotainment market (2009-05-20) [ RF/Wireless Design ]
• Navteq, Intel drive LBS support for MIDs (2009-05-20) [ RF/Wireless Design ]

• Hynix, Wuxi Industrial set up back-end JV (2009-05-20) [ Process/Manufacturing ]
• Consortium pushes for next-gen memory interface spec (2009-05-20) [ Buffer/Storage ]
• China OEMs boom as wireless market slides (2009-05-20) [ RF/Wireless Design ]
• India designers pursue Japan market (2009-05-20) [ EDA ]
• Globalfoundries dips $6B in new NY fab (2009-05-20) [ Process/Manufacturing ]

• What went wrong with MIPS-Chipidea merger? (2009-05-20) [ EDA ]
• LED backlighting strips promise high intensity, reliability (2009-05-19) [ Optical Electronics and Display ]
• Voltage divider boasts up to 200kΩ resistance (2009-05-19) [ Power Design ]
• Audio codec packs dual ADC paths, digital voice filters (2009-05-19) [ Signal Conditioning ]
• Blade server drives down energy consumption (2009-05-19) [ Embedded Systems ]

• Virtex-5 FPGAs tailored for defense, aerospace (2009-05-19) [ Programmable Logic ]
• Vocoder chip offers three full duplex channels (2009-05-19) [ Signal Conditioning ]
• Mobile I/O expander packs ambient light sensing (2009-05-19) [ Interface Design ]
• ADC's 2ppm/°C reference ensures precise measurements (2009-05-19) [ Signal Conditioning ]
• Cars with embedded telematics to reach 43% by 2014 (2009-05-19) [ Embedded Systems ]

• ST, Soitec co-develop BSI tech for CMOS image sensors (2009-05-19) [ Optical Electronics and Display ]
• TI acquires ARM Cortex MCU supplier (2009-05-19) [ Control Design ]
• Firms team to advance China handset market (2009-05-19) [ RF/Wireless Design ]
• Trade group skeptical on Taiwan DRAM venture (2009-05-19) [ Buffer/Storage ]
• ASML to benefit from Nikon EUV litho delay (2009-05-19) [ Process/Manufacturing ]

• EC ruling hits Intel with $1.45B fine, PR nightmare (2009-05-19) [ Embedded Systems ]
• Downturn shuffles top 20 IC supplier list (2009-05-19) [ Process/Manufacturing ]
• Audio IC suits portable multimedia apps (2009-05-18) [ Signal Conditioning ]
• Digital isolator ICs support SMBus, PMBus apps (2009-05-18) [ EDA ]
• PowerQUICC III processor starts sampling (2009-05-18) [ Control Design ]

• Low-cost, smart-card interface unveiled (2009-05-18) [ Interface Design ]
• 1W compact WLED offers low thermal resistance (2009-05-18) [ Optical Electronics and Display ]
• In-Stat expects intense competition in UMDs (2009-05-18) [ Control Design ]
• PC processor market decline slows down (2009-05-18) [ Embedded Systems ]
• Report: SSD energy savings could power a country (2009-05-18) [ Buffer/Storage ]

• India homes get a taste of FTTH connectivity (2009-05-18) [ RF/Wireless Design ]
• Intel, Novell partner to boost Moblin adoption (2009-05-18) [ Embedded Systems ]
• Broadband products designed for CATV apps (2009-05-15) [ RF/Wireless Design ]
• 2.5A optocoupler aims at industrial apps (2009-05-15) [ Signal Conditioning ]
• Phone market welcomes WLED drivers (2009-05-15) [ Optical Electronics and Display ]

• Infineon intros Smart IGBT modules (2009-05-15) [ Power Design ]
• USB 3.0 transceiver IC ensures data integrity (2009-05-15) [ Interface Design ]
• Samsung, IMEC team up on green radios (2009-05-15) [ RF/Wireless Design ]
• Ericsson's IP investment in the Valley continues (2009-05-15) [ EDA ]
• China's Suntech to establish U.S. solar facility (2009-05-15) [ Power Design ]

• Intel collaborates with South Korea firms to advance MIDs (2009-05-15) [ RF/Wireless Design ]
• High speed Bluetooth ready for wider market (2009-05-15) [ RF/Wireless Design ]
• SMPS converters ease low-power directive compliance (2009-05-14) [ Power Design ]
• Multilayer capacitors offer low ESR (2009-05-14) [ Power Design ]
• Rugged IC suits harsh auto environments (2009-05-14) [ Embedded Systems ]

• Atom-equipped boards boast flexibility (2009-05-14) [ Embedded Systems ]
• Embedded memory uses 30nm-class process tech (2009-05-14) [ Buffer/Storage ]
• China, U.S. threaten Europe's solar reign (2009-05-14) [ Power Design ]
• Wipro test facility rises in Bangalore (2009-05-14) [ Test & Packaging ]
• Infineon buys back its bonds (2009-05-14) [ RF/Wireless Design ]

• Korean, Taiwan companies toughen LED competition (2009-05-14) [ Optical Electronics and Display ]
• Rising demand stabilizes analog IC market (2009-05-14) [ Embedded Systems ]
• 950V MOSFETs deliver improved reliability (2009-05-13) [ Power Design ]
• NFC controller now sampling to handset makers (2009-05-13) [ RF/Wireless Design ]
• 5V op amp touts high accuracy at low power (2009-05-13) [ Signal Conditioning ]

• 2.4GHz SoC tailored for low-power RF apps (2009-05-13) [ RF/Wireless Design ]
• TFT LCD modules integrate LED backlight (2009-05-13) [ Optical Electronics and Display ]
• Line switch ICs fit space-constraint apps (2009-05-13) [ Network Design ]
• Multicore processors deliver over 2GHz (2009-05-13) [ Embedded Systems ]
• PC board withstands extreme environments (2009-05-13) [ Embedded Systems ]

• Sensors, smart cards drive thin-film battery market (2009-05-13) [ Power Design ]
• Cisco networks keep Vietnam campus connected (2009-05-13) [ RF/Wireless Design ]
• Alcatel-Lucent scores $1.7B 3G upgrade deals in China (2009-05-13) [ RF/Wireless Design ]
• Acer joins WiMAX open patent alliance (2009-05-13) [ EDA ]
• Via Licensing launches new LTE patent pool effort (2009-05-13) [ EDA ]

• Freescale taps nanocrystals for embedded flash (2009-05-13) [ Process/Manufacturing ]
• Android phone market to enjoy 900% boom in '09 (2009-05-13) [ Embedded Systems ]
• Adobe-ARM smart phone video promise needs more time (2009-05-13) [ Embedded Systems ]
• Miniature LNA simplifies mobile app design (2009-05-12) [ RF/Wireless Design ]
• NXP Cortex-M3 MCU bags highest performance stamp (2009-05-12) [ Control Design ]

• Low-axis materials improve antenna efficiency (2009-05-12) [ Process/Manufacturing ]
• Power manager packs overvoltage protection (2009-05-12) [ Power Design ]
• Agilent intros WirelessHD test system (2009-05-12) [ Design Test ]
• Matched balun filter suits Atmel wireless transceivers (2009-05-12) [ RF/Wireless Design ]
• Over-moulded connectors are waterproof to IP68 (2009-05-12) [ Network Design ]

• PROFINET cables trim on-site installation time (2009-05-12) [ Network Design ]
• Plasma panel shipments plunge 28% in Q1 (2009-05-12) [ Optical Electronics and Display ]
• Samsung LED sets up manufacturing base in China (2009-05-12) [ Process/Manufacturing ]
• Mentor to acquire LogicVision for $13M (2009-05-12) [ EDA ]
• Corning green lasers power Microvision picoprojectors (2009-05-12) [ Optical Electronics and Display ]

• Report: Europe to impose fine against Intel (2009-05-12) [ Embedded Systems ]
• Carriers welcome handset surge (2009-05-12) [ RF/Wireless Design ]
• Micron back on No. 3 spot in DRAM ranking (2009-05-12) [ Buffer/Storage ]
• Analysis: MIPS-Chipidea not a good mix (2009-05-12) [ EDA ]
• Waveform digitizer addresses ATE, OEM apps (2009-05-11) [ Design Test ]

• Boost regulator touts 1.2MHz switching frequency (2009-05-11) [ Power Design ]
• LED flash drivers offer design optimization (2009-05-11) [ Interface Design ]
• MOSFETs in DFN packs save 55% PCB space (2009-05-11) [ Embedded Systems ]
• PCIe expansion card features solid-state storage (2009-05-11) [ Buffer/Storage ]
• TI intros PicoStar package (2009-05-11) [ Test & Packaging ]

• ST taps FET's lithium battery tech (2009-05-11) [ Power Design ]
• IC manufacturing utilization to rise 60% in Q2 (2009-05-11) [ Process/Manufacturing ]
• TriQuint nabs $50M deal with China's ZTE (2009-05-11) [ RF/Wireless Design ]
• Telecom Malaysia may bid on DTV spec (2009-05-11) [ RF/Wireless Design ]
• Vietnam opens first solar panel plant (2009-05-11) [ Power Design ]

• Ramtron cuts foundry ties with Fujitsu (2009-05-11) [ Process/Manufacturing ]