• Front-end modules feature three power modes (2009-05-08) [ RF/Microwave ]
• Tiny current-limit switches promise high-accuracy (2009-05-08) [ Networks ]
• 8bit LCD MCUs suit industrial, automotive apps (2009-05-08) [ Optoelectronics/Displays ]
• Sensor hardware kit rolls for RFID, security apps (2009-05-08) [ Sensors/MEMS ]
• Hall-effect sensor simplifies design process (2009-05-08) [ Sensors/MEMS ]

• USB 2.0 oscillator handles up to 100MHz (2009-05-08) [ RF/Microwave ]
• RF switch connectors tailored for UWB apps (2009-05-08) [ RF/Microwave ]
• Motorola paints GSM phone 'green' (2009-05-08) [ RF/Microwave ]
• RFID market to enjoy 11% growth despite downturn (2009-05-08) [ RF/Microwave ]
• Motorola boosts Singapore WiMAX network (2009-05-08) [ RF/Microwave ]

• SDK takes over Fujitsu's HD media biz (2009-05-08) [ Memory/Storage ]
• Trio to co-develop NAND controllers (2009-05-08) [ Memory/Storage ]
• IC equipment recovery not until August, analyst says (2009-05-08) [ Manufacturing/Packaging ]
• IEEE to jumpstart smart grid standards effort (2009-05-08) [ Power/Alternative Energy ]
• Comment: IBM should come clean on layoffs, offshoring (2009-05-08) [ Manufacturing/Packaging ]

• Wi-Fi backers draft 60GHz spec for wireless video (2009-05-08) [ RF/Microwave ]
• Firmware boosts oscilloscope throughput (2009-05-07) [ T&M ]
• Connectors come with shrouded stacking header (2009-05-07) [ Networks ]
• USB switches tout improved power dissipation (2009-05-07) [ Interface ]
• DC/DC converter cuts cost, space in automotive apps (2009-05-07) [ Power/Alternative Energy ]

• 'First' red-green-blue-white multichip LED debuts (2009-05-07) [ Optoelectronics/Displays ]
• Hot swappable fan design allows quick exchange (2009-05-07) [ Amplifiers/Converters ]
• Transceivers handle up to 32Mbit/s apps (2009-05-07) [ RF/Microwave ]
• Tool simplifies on-chip interconnect design (2009-05-07) [ EDA/IP ]
• Netbook, MID shipments defy economic downturn (2009-05-07) [ RF/Microwave ]

• Report urges China to boost green procurement (2009-05-07) [ Manufacturing/Packaging ]
• Lumitex builds Asian manufacturing site in Taiwan (2009-05-07) [ Manufacturing/Packaging ]
• Meta System, Wavecom deliver telematics solutions (2009-05-07) [ RF/Microwave ]
• Foundry startup CEO sketches bright future (2009-05-07) [ Manufacturing/Packaging ]
• Will NFC finally take-off? (2009-05-07) [ RF/Microwave ]

• Update: China firm to acquire Freescale wireless biz (2009-05-07) [ RF/Microwave ]
• FPGA startup eyes handheld consumer market (2009-05-07) [ FPGAs/PLDs ]
• Modulator improves wireless transmitter performance (2009-05-06) [ RF/Microwave ]
• Sykworks injects LNAs with pHEMT, SiGe tech (2009-05-06) [ RF/Microwave ]
• Fuel gauges combine Li+ protector, SHA-1 (2009-05-06) [ Power/Alternative Energy ]

• MCUs pack 32bit floating-point accelerator (2009-05-06) [ Controls/MCUs ]
• Wireless chipset delivers 1080p HD content (2009-05-06) [ RF/Microwave ]
• RF transceiver offers precise signal processing (2009-05-06) [ RF/Microwave ]
• Connector loads SIM, microSD cards (2009-05-06) [ Networks ]
• Low-power ADCs handle wide variety of applications (2009-05-06) [ Amplifiers/Converters ]

• Handset shipments drop 13% in Q1 09 (2009-05-06) [ Manufacturing/Packaging ]
• Qualcomm grants 3G license to Sanmu (2009-05-06) [ RF/Microwave ]
• Intel invests in fab tool supplier (2009-05-06) [ Manufacturing/Packaging ]
• Agilent, Datang team on TD-SCDMA testing (2009-05-06) [ T&M ]
• In-Stat: No more UWB by 2013 (2009-05-06) [ RF/Microwave ]

• CEA to set 3D glasses standards (2009-05-06) [ Optoelectronics/Displays ]
• Japan solar cell makers eye 1GW production (2009-05-06) [ Power/Alternative Energy ]
• TSMC resolves 40nm yield issues (2009-05-06) [ Manufacturing/Packaging ]
• PCIe-to-USB 2.0 host controller bridge debuts (2009-05-05) [ Interface ]
• Ultrasmall MOSFET touts lowest on-resistance (2009-05-05) [ Power/Alternative Energy ]

• Inline sensor provides accurate measurements (2009-05-05) [ T&M ]
• Headphone amps pack built-in protection circuitry (2009-05-05) [ Amplifiers/Converters ]
• Pitch-and-yaw MEMS gyro readies for Wii (2009-05-05) [ Sensors/MEMS ]
• PMICs extend battery life, cuts BOM costs (2009-05-05) [ Power/Alternative Energy ]
• MicroTCA system tailored for IP-based comm systems (2009-05-05) [ Embedded ]

• DSCs cut power consumption in motor controls (2009-05-05) [ Controls/MCUs ]
• APEC Transport Ministers push for eco-friendly systems (2009-05-05) [ Power/Alternative Energy ]
• Will netbook's appeal last after downturn? (2009-05-05) [ Embedded ]
• Fujitsu, TSMC partner on 40nm logic ICs (2009-05-05) [ Manufacturing/Packaging ]
• Equinix sets up IT dev't center in Singapore (2009-05-05) [ Manufacturing/Packaging ]

• What should Taiwan DRAM makers do to survive? (2009-05-05) [ Memory/Storage ]
• Opinion: What's next for Nokia? (2009-05-05) [ Embedded ]
• Apple beefs up chip design efforts (2009-05-05) [ EDA/IP ]
• FPGA startup survives IC crunch (2009-05-05) [ FPGAs/PLDs ]
• Step-down controller handles fast load steps (2009-05-04) [ Power/Alternative Energy ]

• USB 2.0 OVP device packs high-speed ESD protection (2009-05-04) [ Power/Alternative Energy ]
• Carrier board compatible with PICMG design guide (2009-05-04) [ EDA/IP ]
• RFID reader integrates PoE connectivity (2009-05-04) [ RF/Microwave ]
• Toshiba ramps up 32nm NAND production (2009-05-04) [ Memory/Storage ]
• Class D audio amp delivers low quiescent, standby current (2009-05-04) [ Amplifiers/Converters ]

• Application processor delivers Full HD in handsets (2009-05-04) [ Processors/DSPs ]
• LED controllers promise faster design cycles (2009-05-04) [ Optoelectronics/Displays ]
• Mobile computing, CE apps propel GPS growth (2009-05-04) [ RF/Microwave ]
• Eureka, embWiSe team on embedded SD/SDIO (2009-05-04) [ EDA/IP ]
• Suzhou invests $1M in solar projects (2009-05-04) [ Power/Alternative Energy ]

• UMC buys China foundry for $285M (2009-05-04) [ Manufacturing/Packaging ]
• Update: IBM faces union ire (2009-05-04) [ Manufacturing/Packaging ]
• Holographic disk can hold up to 500Gbytes (2009-05-04) [ Memory/Storage ]
• Wireless specs vie to replace IR remotes (2009-05-04) [ RF/Microwave ]
• Nokia plays catch-up with Apple (2009-05-04) [ RF/Microwave ]