• 60W power supplies save space, cost (2009-04-30) [ Power/Alternative Energy ]
• Board-to-board connector flaunts ultraslim form (2009-04-30) [ Networks ]
• Power resistor improves automated board assembly (2009-04-30) [ Power/Alternative Energy ]
• DC/DC converters fit power-hungry apps (2009-04-30) [ Power/Alternative Energy ]
• Resonant controller ensures noise immunity (2009-04-30) [ Power/Alternative Energy ]

• Current source operates without capacitors (2009-04-30) [ Power/Alternative Energy ]
• 3G connectivity powers CE, ultramobile apps (2009-04-30) [ RF/Microwave ]
• Jasper finds place in AMD design centers (2009-04-30) [ EDA/IP ]
• Firms enter LSI assembly, test service JV (2009-04-30) [ T&M ]
• Forecast: GPU sales to rebound in Q3 (2009-04-30) [ Processors/DSPs ]

• Tech enables large-sized multi-touch displays (2009-04-30) [ Sensors/MEMS ]
• Atom-based Symbian OS to spawn next-gen CE apps (2009-04-30) [ Embedded ]
• 14bit ADC cuts digital feedback (2009-04-29) [ Amplifiers/Converters ]
• 1Gbit mobile DRAM touts high speed at low power (2009-04-29) [ Memory/Storage ]
• Instrumentation amp is smaller than pencil's tip (2009-04-29) [ Amplifiers/Converters ]

• Authentication IC offers low-cost data protection (2009-04-29) [ Controls/MCUs ]
• 'Smallest' VCXOs fit tuner modules (2009-04-29) [ RF/Microwave ]
• Programmable power manager is highly integrated (2009-04-29) [ Power/Alternative Energy ]
• MEMS accelerometers pack smart algorithms (2009-04-29) [ Sensors/MEMS ]
• PC oscilloscope achieves 1GSps (2009-04-29) [ T&M ]

• LED TVs to hit 11% market penetration by 2012 (2009-04-29) [ Optoelectronics/Displays ]
• NEC Electronics, Renesas merge biz operations (2009-04-29) [ Manufacturing/Packaging ]
• Zigbee Alliance adopts Internet Protocol standards (2009-04-29) [ RF/Microwave ]
• ADI, Infineon develop automotive airbag safety system (2009-04-29) [ Sensors/MEMS ]
• Nokia to boost mobile Internet services in UAE (2009-04-29) [ RF/Microwave ]

• Dialog Semi goes beyond power management (2009-04-29) [ Power/Alternative Energy ]
• Startup Cswitch battles IC downturn (2009-04-29) [ Manufacturing/Packaging ]
• Analysis: Winners and losers in Renesas-NEC merger (2009-04-29) [ Manufacturing/Packaging ]
• Wi-Fi/HSPA solution powers Classmate PCs (2009-04-28) [ RF/Microwave ]
• 2mm connector system comes in 4/5-row versions (2009-04-28) [ Networks ]

• Clock generators achieves 500fs RMS jitter (2009-04-28) [ Amplifiers/Converters ]
• 8/16bit MCUs claim lowest sleep current (2009-04-28) [ Controls/MCUs ]
• LED power supplies come in rugged packages (2009-04-28) [ Optoelectronics/Displays ]
• Design tool tailored for Infineon TriCore MCUs (2009-04-28) [ EDA/IP ]
• Reconfigurable processors pack 97M transistors (2009-04-28) [ Processors/DSPs ]

• Wi-Fi tracker handles two-way RTLS (2009-04-28) [ RF/Microwave ]
• Renesas absorbs Key Stream WLAN biz (2009-04-28) [ RF/Microwave ]
• OLED market to hit $5.5B by 2015 (2009-04-28) [ Optoelectronics/Displays ]
• juwi, First solar to build Germany's largest PV park (2009-04-28) [ Power/Alternative Energy ]
• Qualcomm to pay Broadcom $891M (2009-04-28) [ RF/Microwave ]

• 'First' 22nm SRAM cells from EUV litho debut (2009-04-28) [ Manufacturing/Packaging ]
• iSuppli: No memory rebound coming soon (2009-04-28) [ Memory/Storage ]
• South Korea memory firms post Q1 profit drops (2009-04-28) [ Memory/Storage ]
• 'Green' displays to take center stage (2009-04-28) [ Optoelectronics/Displays ]
• SBC supports 1.6GHz Atom processor (2009-04-27) [ Embedded ]

• Modem IC trims system size, power consumption (2009-04-27) [ RF/Microwave ]
• Miniature pushbutton switches fit avionics displays (2009-04-27) [ Networks ]
• MCU boasts high speed communication (2009-04-27) [ Controls/MCUs ]
• Digital multimeters promise reliability, safety (2009-04-27) [ T&M ]
• OTP memory IP tailored for 65nm designs (2009-04-27) [ EDA/IP ]

• Wet tantalum capacitors offer high ripple current (2009-04-27) [ Amplifiers/Converters ]
• Modulator combines four devices in one chip (2009-04-27) [ RF/Microwave ]
• Litho tools propel photoresist market (2009-04-27) [ Manufacturing/Packaging ]
• IMEC, Cytec aim to extend organic PV life (2009-04-27) [ Power/Alternative Energy ]
• Hainan gets a taste of mobile TV (2009-04-27) [ Optoelectronics/Displays ]

• Nokia taps Infineon Edge platform (2009-04-27) [ RF/Microwave ]
• Capital spending to recover in 2H 09 (2009-04-27) [ Manufacturing/Packaging ]
• Analyst sees slow rebound for equipment vendors (2009-04-27) [ Manufacturing/Packaging ]
• Beyer: Freescale won't succumb to pressure (2009-04-27) [ Manufacturing/Packaging ]
• Firms give MIPS processor Android boost (2009-04-27) [ Embedded ]

• Connectors handle 50 mating cycles (2009-04-24) [ Networks ]
• 1µF MLCC in 0603 package debuts (2009-04-24) [ Amplifiers/Converters ]
• 20V MOSFET claims lowest R<SUB>DS(ON)</SUB> (2009-04-24) [ Power/Alternative Energy ]
• Controller delivers HD video over in-car nets (2009-04-24) [ Controls/MCUs ]
• Tiny charger IC fits slimmer portable apps (2009-04-24) [ Power/Alternative Energy ]

• LEDs boast 90lm/W luminous efficacy (2009-04-24) [ Optoelectronics/Displays ]
• A/V demodulator delivers enhanced picture quality (2009-04-24) [ Amplifiers/Converters ]
• 40W microprocessors run up to 2.3GHz (2009-04-24) [ Processors/DSPs ]
• China to enter flat panel TV era this year (2009-04-24) [ Optoelectronics/Displays ]
• Spansion mulls alternatives for wireless biz (2009-04-24) [ RF/Microwave ]

• Firms to deliver design, test services in Japan (2009-04-24) [ T&M ]
• Numonyx, Ovonyx ink phase change memory deal (2009-04-24) [ Memory/Storage ]
• Analyst: Inconsistent profitability brought Sun down (2009-04-24) [ Embedded ]
• Fab tool vendors post poor Q1 results (2009-04-24) [ Manufacturing/Packaging ]
• Research takes step towards ferroelectric transistors (2009-04-24) [ Manufacturing/Packaging ]

• Apple feels downturn sting (2009-04-24) [ Manufacturing/Packaging ]
• Receptacles equipped for harsh environments (2009-04-23) [ Networks ]
• VGA mux handles up to 1GHz bandwidth (2009-04-23) [ Networks ]
• LEDs come in 'smallest' white bins (2009-04-23) [ Optoelectronics/Displays ]
• On-chip MCUs fit portable medical apps (2009-04-23) [ Controls/MCUs ]

• Quad DACs save space in compact boards (2009-04-23) [ Amplifiers/Converters ]
• Multicore processor tailored for netbooks (2009-04-23) [ Embedded ]
• Sign-off flow to speed up product dev't (2009-04-23) [ EDA/IP ]
• Samsung ramps up 50nm DDR3 production (2009-04-23) [ Memory/Storage ]
• PV downturn to shape more mature supply chain (2009-04-23) [ Power/Alternative Energy ]

• Broadcom launches takeover bid for Emulex (2009-04-23) [ Networks ]
• Li-ion battery facility to rise in Japan (2009-04-23) [ Manufacturing/Packaging ]
• TI ramps production in Philippine test plant (2009-04-23) [ T&M ]
• Bluetooth 3.0 rides 24Mbit/s over 802.11 (2009-04-23) [ RF/Microwave ]
• TSMC invests in R&D despite downturn (2009-04-23) [ Manufacturing/Packaging ]

• Mentor exec confident on IC recovery (2009-04-23) [ Manufacturing/Packaging ]
• Another UWB startup shuts down (2009-04-23) [ RF/Microwave ]
• CMOS sensor suits driver assistance apps (2009-04-22) [ Optoelectronics/Displays ]
• Stratix dev't kit eases high-speed interface testing (2009-04-22) [ T&M ]
• Bluetooth IC tailored for coin cell-powered apps (2009-04-22) [ RF/Microwave ]

• 14bit ADC promises high speed at low power (2009-04-22) [ Amplifiers/Converters ]
• Samsung UMPC packs broadband connectivity (2009-04-22) [ RF/Microwave ]
• IP platform addresses submicron leakage challenge (2009-04-22) [ EDA/IP ]
• SDI equalizer touts lowest jitter across cable lengths (2009-04-22) [ Interface ]
• DIMMs reduce power consumption in servers (2009-04-22) [ Memory/Storage ]

• 4G hype won't phase out 2G/3G networks (2009-04-22) [ RF/Microwave ]
• Huawei, China Telecom launch 3G services in 52 cities (2009-04-22) [ RF/Microwave ]
• Nokia Siemens to build telecom hub in Indonesia (2009-04-22) [ RF/Microwave ]
• Infineon, Ident ink license deal for game consoles (2009-04-22) [ EDA/IP ]
• Samsung sees smart phone, OLED boost (2009-04-22) [ Optoelectronics/Displays ]

• Databeans: IC rebound coming soon (2009-04-22) [ Manufacturing/Packaging ]
• Report: China Q1 fab utilization plunges to 43% (2009-04-22) [ Manufacturing/Packaging ]
• Oracle-Sun merger stirs questions on Java's future (2009-04-22) [ Embedded ]
• Broadband module packs wake-on wireless feature (2009-04-21) [ RF/Microwave ]
• Dual-channel photocouplers save 40% board space (2009-04-21) [ Optoelectronics/Displays ]

• Highly-efficient LED modules rated for 50,000 hrs (2009-04-21) [ Optoelectronics/Displays ]
• 6-pin MCUs fit space-constrained consumer apps (2009-04-21) [ Controls/MCUs ]
• 100W DC/DC modules target industrial apps (2009-04-21) [ Power/Alternative Energy ]
• RJ-45 connectors feature enhanced Ethernet protection (2009-04-21) [ Networks ]
• 30&#181;m IR detector handles low input signals (2009-04-21) [ Optoelectronics/Displays ]

• 8bit MCUs highlight dual-operation flash memory (2009-04-21) [ Controls/MCUs ]
• Litho technique streamlines nanofabrication process (2009-04-21) [ Manufacturing/Packaging ]
• Sharp to start 10G LCD production by October (2009-04-21) [ Manufacturing/Packaging ]
• SMIC, Dolphin develop audio converters for PMPs (2009-04-21) [ Manufacturing/Packaging ]
• China 3G market eyes double-digit growth (2009-04-21) [ RF/Microwave ]

• Analysts post PC shipment plunge in Q1 (2009-04-21) [ Embedded ]
• Group claims smallest diamond transistor (2009-04-21) [ Manufacturing/Packaging ]
• SEMI India bets big on solar power (2009-04-21) [ Power/Alternative Energy ]
• Renesas-NEC merger: a good deal? (2009-04-21) [ Manufacturing/Packaging ]